66results about How to "Avoid thermal resistance" patented technology

The invention provides a heat dissipation device based on carbon nanotube arrays and low temperature co-fired ceramics and a preparation method, belonging to the heat dissipation technology of microelectronic devices. The heat dissipation device comprises a low temperature co-fired ceramic substrate with a micro channel embedded inside. Carbon nanotube arrays are prepared on the surface of the low temperature co-fired ceramic substrate and a heating device connected with a circuit of the low temperature co-fired ceramic substrate is fixed on the carbon nanotube arrays. The device makes the most of the advantage that the low temperature co-fired ceramic substrate is easy to be machined into three-dimensional structure, the micro channel is manufactured in the substrate and most heat generated by the heating device is led away through convective heat exchange of the micro channel; and meanwhile, the carbon nanotube arrays and the low temperature co-fired ceramics are closely jointed with the heating device, thus reducing the microvoids generated on the joint interface by the traditional methods such as welding, avoiding heat resistance caused by the microvoids, weakening the heat resistance between the heating device and the low temperature co-fired ceramic substrate and improving the heat dissipation capability of the heat dissipation device.

A heat dissipation apparatus including an insulation substrate, a heat sink, and a heat mass member. The insulation substrate includes a first surface serving as a heated body receiving surface and a second surface opposite to the first surface. A heat sink is thermally coupled to the second surface of the insulation substrate. A heat mass member includes a stress reduction portion and a heat mass portion arranged so that one is above the other. The stress reduction portion includes a plurality of recesses in at least either one of a surface facing toward the insulation substrate and a surface facing toward the heat sink of the heat mass member. The heat mass portion has a thickness that is greater than that of the stress reduction portion, and the heat mass member has a thickness that is greater than three millimeters.

The present invention is intended to obtain a semiconductor device that is reduced in size, weight, and cost and improved in performance stability and productivity.

The semiconductor device includes a semiconductor module in which a semiconductor element is sealed with a resin, a reinforcing beam fixed to an upper surface of the semiconductor module via a plate-like spring, and a frame part to which both ends of the reinforcing beam are fixed, the frame part being disposed in such a fashion as to enclose from four directions an outer periphery of the semiconductor module, plate-like spring, and the reinforcing beam.

The present invention is fluid ice making method and apparatus. The method includes cooling the cool carrying medium in fluid to below 0 deg.c with evaporator, spraying ice making water to the cooled cool carrying medium in fluid to form mixed fluid of ice grain and cool carrying medium and separating ice from the cool carrying medium in fluid to obtain fluid ice. The apparatus for making fluid ice includes evaporator, ice making unit, water sprayer, filter with filtering net and circulating pump connected via pipeline. The present invention has high heat efficiency, high practicality, simple structure and low running cost.

Disclosed is a coaxial wound heat exchanger in the field of heat exchange devices. The coaxial wound heat exchanger comprises a spiral fluted tube, a plurality of capillary tubes and a thermal insulation layer, wherein each capillary tube is wound in a corresponding groove between outer screw threads of the spiral fluted tube; the thermal insulation layer covers the spiral fluted tube and the capillary tubes; the flowing medium in the spiral fluted tube is a refrigerating medium, the flowing media in the capillary tubes are freezing media, and the refrigerating medium and the freezing media flow in a reverse-flow mode. According to the coaxial wound heat exchanger, the size of the heat exchanger can be reduced, and the heat exchange efficiency of the heater exchanger can be improved.

A composite water-cooling radiator structure includes at least a cooling plate, a cooling chip unit and a vapor chamber. The cooling plate has a first upper surface and a first lower surface; a liquid flowing section, through which a first working liquid flows; and an inlet and an outlet communicating with the liquid flowing section. The cooling chip unit is located beneath the cooling plate and has a cold end and a hot end; and the cold end is in contact with the first lower surface of the cooling plate. The vapor chamber is located beneath the cooling chip unit and has a second upper surface and a second lower surface; and the second upper surface is in contact with the hot end of the cooling chip unit. With the superposed cooling plate, cooling chip unit and vapor chamber, the composite water-cooling radiator structure provides good heat dissipation effect.

The invention belongs to the technical field of wireless charging, and discloses a high-thermal-conductivity composite magnetism isolating sheet for a wireless charging receiving end and a preparationmethod of the high-thermal-conductivity composite magnetism isolating sheet. The composite magnetism isolating sheet for the high-thermal-conductivity wireless charging receiving end is a composite material formed by alternately compounding nanocrystalline sheets and a composite material layer, and the composite material layer comprises a thermal conductive filler, a magnetic conductive filler and a binder. According to the preparation method, the surface of the magnetic conductive powder is uniformly coated with the heat conductive powder, so that the electrical conductivity of the magneticpowder can be effectively reduced. And meanwhile, even if the composite magnetic powder has a bridging phenomenon in the composite material layer, the heat conductive powder with excellent insulativity on the surface of the magnetic powder can play a certain role in isolation, so that the resistivity of the composite layer is greatly improved, and the improvement of the charging efficiency of thesystem is facilitated.

The invention relates to a semiconductor device based on a composite substrate and a preparation method thereof. The preparation method comprises steps of selecting a Si substrate layer; growing a diamond layer on a lower surface of the Si substrate layer; growing an AlN nucleating layer on an upper surface of the Si substrate layer; growing a GaN buffer layer on an upper surface of the AlN nucleating layer; and growing an AlGaN barrier layer on an upper surface of the GaN buffer layer. The preparation method is advantaged in that the Si substrate layer with high quality and the diamond layerwith high thermal conductivity are combined to form the Si/diamond composite substrate structure, and high thermal conductivity of the diamond layer is utilized to solve a problem of poor heat dissipation caused by growing a high-power nitride semiconductor material purely on the Si substrate layer.

The invention provides a double-temperature condensing two-stage compressing heat pump system. The double-temperature condensing two-stage compressing heat pump system is characterized by comprising a high pressure stage compressing mechanism, a low pressure stage compressing mechanism, a high temperature stage condensing mechanism, a low-temperature stage condensing mechanism, a high temperature stage evaporation mechanism, a low temperature stage evaporation mechanism, a frictional condensing mechanism, a heat exchanging mechanism, a first throttle mechanism, a second throttle mechanism and a third throttle mechanism; the high pressure stage compressing mechanism, the high temperature stage condensing mechanism, the frictional condensing mechanism, the low temperature stage condensing mechanism, the first throttle mechanism, the low temperature stage evaporation mechanism, the low pressure stage compressing mechanism and the heat exchanging mechanism are sequentially connected to form into a loop; the frictional condensing mechanism is connected with the second throttle mechanism and the third throttle mechanism; the third throttle mechanism is connected with the high pressure stage evaporation mechanism; the high pressure stage evaporation mechanism is connected with the low pressure stage compressing mechanism; the second throttle mechanism is connected with the heat exchanging mechanism. The double-temperature condensing two-stage compressing heat pump system has the advantages of reducing energy loss, improving stability of system operation, meanwhile enabling low temperature heat source in different stages to be used and enabling heat of a low temperature condensing mechanism to be fully used.

A heat dissipation element with mounting structure includes a main body and a plurality of mounting elements. The main body includes a first side and a second side, between which a chamber is defined; a plurality of supports located in the chamber and respectively connected at two opposite ends to the first side and the second side of the main body; a working fluid filled in the chamber; and at least one wick structure layer internally attached to the chamber. The mounting elements respectively define an axial bore and have an end extended through the first side of the main body into the supports to thereby connect to the main body. With these arrangements, the heat dissipation element with the mounting elements connected thereto can tightly contact with a heat-generating element and maintain the chamber in the main body in an airtight state without leakage.

A heat dissipation device with mounting structure includes a main body and a plurality of mounting elements. The main body includes an internally defined chamber having a first side and an opposite second side; a plurality of supports located in the chamber and respectively having two ends connected to the first side and the second side of the chamber; a working fluid filled in the chamber; and a plurality of connection sections in the form of recesses formed on an outer surface of the main body at positions corresponding to the supports in the chamber. The mounting elements are connected to the connection sections. With these arrangements, the heat dissipation device with the mounting elements connected to one outer surface thereof can maintain the chamber in the main body in an airtight state and ensure tight contact of it with a heat-generating element.

The invention discloses a flat plate collector with worm pipes. The flat plate collector comprises a frame; high-light-transmission tempered glass is embedded on the frame; an absorber plate core is arranged below the tempered glass and comprises a heat exchange pipe, heat exchange volutes and heat collecting pipes as many as the heat exchange volutes; each heat collecting pipe comprises a heat collecting runner and heat collecting fins which are integrally formed on the two sides of the heat collecting runner; the heat exchange pipes pass through a plurality of heat exchange volutes; the upper part of each heat collecting runner is communicated with one corresponding heat exchange volute, and the lower part of each heat collecting runner is sealed independently; and the heat exchange pipe, the heat exchange volutes and the heat collecting runners form a closed space which is filled with a heat pipe medium. The flat plate collector has the advantages that as the heat collecting pieces are formed through one-time extrusion, the problems on firmness and heat resistance caused by laser welding or ultrasonic welding are avoided; the defects of frost cracking of a common heat collector in winter and scaling of a pipeline of a common flat plate collector are overcome; and a channel can be formed in each heat collecting runner, and thus the heat transfer effect of the flat plate collector can be improved effectively.