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Semiconductor device

A semiconductor, integrated technology, applied in the direction of semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., can solve the problems of large copper ratio, reduced rigidity of heat sink, inability to miniaturize semiconductor devices, lightweight and low cost, etc. Achieve stable performance and suppress thermal resistance

Active Publication Date: 2009-02-11
MITSUBISHI ELECTRIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, copper that is generally used as a material that satisfies this condition has a large specificity and is expensive. If copper is used as a heat sink component, or the structure of the component itself is thickened to improve rigidity, there is a problem that the semiconductor device cannot be miniaturized and light. Quantitative, low-cost issues
In addition, in the case of using copper, an easily available plate material is generally used, and there is also a problem that it is difficult to shape the shape due to reasons such as reducing machining costs.
[0007] And, in order to make semiconductor device miniaturization, light weight, low cost, if make heat sink thin, light weight etc., then the rigidity of heat sink reduces, and heat sink easily deforms, therefore, it is difficult to make the thickness of thermally conductive member thin and uniform problem
In addition, the deformation of the heat sink is caused by various factors such as the influence of the pressing force of the reinforcement beam and the plate spring, or the influence of the pressure contact force for forming a thin and uniform thermally conductive member. Due to the influence of the temperature of the environment in which the semiconductor device is used or the thermal stress caused by the heat generated by the semiconductor module, etc., there is a problem that the original performance of the semiconductor device cannot be stably exhibited.

Method used

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no. 1 approach

[0021] figure 1 It is an exploded perspective view showing the configuration of the semiconductor device according to the first embodiment of the present invention. figure 2 it means assembled figure 1 A perspective view of the state of the semiconductor device. image 3 Yes figure 2 A partial cross-sectional view of the semiconductor device is shown, and the frame portion is omitted. Figure 4 It is to fix the cooling part and the control part on the figure 2 A schematic diagram of an example of a semiconductor device.

[0022] exist Figure 1 to Figure 3 Among them, the semiconductor device 1 includes: a semiconductor module 2 in which a semiconductor element is sealed with resin; a reinforcing beam 4 fixed to the upper surface of the semiconductor module 2 by a leaf spring 3; The frame portions 6 at both ends of the reinforcing beam 4 are installed and fixed.

[0023] The semiconductor module 2 has a control terminal 21 connected to a control unit described later,...

no. 2 approach

[0048] In the first embodiment, the frame portion 6 is formed of a synthetic resin material, but in the second embodiment, the frame portion is formed of a metal having high rigidity.

[0049] Figure 5 It is an exploded perspective view showing the configuration of the semiconductor device according to the second embodiment of the present invention. Image 6 is assembled Figure 5 A perspective view of the state of the semiconductor device. In addition, the same code|symbol is attached to the same part as 1st Embodiment, and description is abbreviate|omitted.

[0050] exist Figure 5 , Image 6 Among them, the frame portion 6 is formed of, for example, a metal material with high rigidity such as iron, aluminum, and magnesium, and can be manufactured by casting, die casting, or the like. Since the frame portion 6 itself is formed of a conductive material, the structure of the first embodiment, that is, insert molding of the bus bar as the conductive portion, exposed conne...

no. 3 approach

[0055] In the first and second embodiments, the frame portion and the reinforcing beam are formed as separate members and fixed with screws or the like, but in the third embodiment, the frame portion and the reinforcing beam are integrally formed. Further, the material of the frame portion may be a synthetic resin material as in the first embodiment, or a metal material as in the second embodiment, according to the purpose, but a case where a metal material is used will be described in the third embodiment.

[0056] Figure 7 It is an exploded perspective view of the configuration of the semiconductor device according to the third embodiment of the present invention. Figure 8 is assembled Figure 7 A perspective view of the state of the semiconductor device. In addition, the same code|symbol is attached to the same part as 1st Embodiment, and description is abbreviate|omitted.

[0057] like Figure 7 , Figure 8 As shown, the semiconductor module 2 and the leaf spring 30...

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Abstract

The present invention is intended to obtain a semiconductor device that is reduced in size, weight, and cost and improved in performance stability and productivity. The semiconductor device (1) includes a semiconductor module (2) in which a semiconductor element is sealed with a resin, a reinforcing beam (4) fixed to an upper surface of the semiconductor module (2) via a plate-like spring (3), and a frame part (6) to which both ends of the reinforcing beam (4) are fixed, the frame part (6) being disposed in such a fashion as to enclose from four directions an outer periphery of the semiconductor module (2), plate-like spring (3), and the reinforcing beam (4).

Description

technical field [0001] The present invention relates to a semiconductor device having a semiconductor module mounted on a moving body such as a vehicle, and more particularly, to a semiconductor device capable of reducing the influence of thermal stress due to heat generation. Background technique [0002] A conventional semiconductor device includes: a resin-sealed semiconductor element, a semiconductor module provided with a screw through hole in a central portion; a pressing leaf spring provided on one side of the semiconductor module; a reinforcing beam for reinforcing the pressing leaf spring; On the heat sink on the other side of the semiconductor module, the semiconductor module is a semiconductor device fixed to the heat sink by screws inserted into the screw through holes of the semiconductor module via the reinforcing beam and the pressing plate spring from the side of the reinforcing beam. A slit for dividing the peripheral edge portion of the plate spring is form...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/00H01L23/40
CPCH01L2924/0002H01L23/16H05K7/2049H01L2924/12044H01L2924/00H01L23/40H01L23/48
Inventor 木村享白形雄二
Owner MITSUBISHI ELECTRIC CORP
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