94results about How to "Suppression resistance" patented technology

In a method of manufacturing a semiconductor device, a first wiring line composed of a copper containing metal film is formed on or above a semiconductor substrate. A first interlayer insulating film is formed on a whole surface of the semiconductor substrate to cover the first wiring line. The first interlayer insulating film is selectively removed to form a connection hole reaching the first wiring line. A barrier metal film is formed to cover an inner surface of the connection hole and then a copper containing metal film is formed to fill the connection hole. The copper containing metal film formed outside the connection hole is removed. A second interlayer insulating film is formed on a whole surface of the semiconductor substrate to cover the copper containing metal film formed in the connection hole. The second interlayer insulating film is selectively removed to form a wiring line groove such that the copper containing metal film formed in the connection hole is exposed at a bottom. A barrier metal film is formed to cover an inside of the wiring line groove and then a copper containing metal film is formed to fill the wiring line groove. Then, the copper containing metal film outside the wiring line groove is removed to form a second wiring line.

The present invention is directed to a power supply apparatus in which a battery and a circuit wiring board or boards are electrically connected by using lead terminals. The lead terminal (3) is adapted so that thickness of a welding portion (3a) is caused to be thinner than the thickness of a conductive portion (3b). Thus, current for welding flows to much degree in a thickness direction so that electric resistance of the welding portion becomes large, and heat based on the electric resistance also becomes large. From this fact, welding nugget (63) can be enlarged. As the result of the fact that large welding nugget is formed, the lead terminals are welded to terminal portions (37a) of the battery (2) with high reliability.

The present invention provides a high corrosion resistance hot dip galvannealed steel material comprised of a Zn-based hot dip plated steel material achieving both a higher corrosion resistance of the plated layer itself by the added elements and sacrificial protection of iron metal by the plated layer or workability free of degradation caused of formation of intermetallic compounds by added elements, that is, a high corrosion resistance hot dip Zn plated steel material characterized in that an alloy plated layer containing Zn: 35 mass % or more, preferably 40 mass % or more, contains a non-equilibrium phase having a heat capacity by differential scanning calorimetry of 1 J/g or more. Furthermore, 5% or more, preferably 50% or more in terms of vol % is an amorphous phase. The alloy layer may contain, by mass %, Mg: 1 to 60% and Al: 0.07 to 59%, may further contain one or more elements selected from Cr, Mn, Fe, Co, Ni, and Cu in a total of 0.1 to 10%, and may in addition contain one or more elements of 0.1 to 10% of La, 0.1 to 10% of Ce, 0.1 to 10% of Ca, 0.1 to 10% of Sn, 0.005 to 2% of P, and 0.02 to 7% of Si.

One of factors that increase the contact resistance at the interface between a first semiconductor layer where a channel is formed and source and drain electrode layers is a film with high electric resistance formed by dust or impurity contamination of a surface of a metal material serving as the source and drain electrode layers. As a solution, a first protective layer and a second protective layer including a second semiconductor having a conductivity that is less than or equal to that of the first semiconductor layer is stacked successively over source and drain electrode layers without exposed to air, the stack of films is used for the source and drain electrode layers.

Provided is a printing device which prints an image using a metallic ink and a color ink, the device including: an input unit which inputs image data; a metallic dot formation unit which forms dot concentration dots on a printing medium using the metallic ink; and a color print unit which prints the image indicated by the image data using the color ink on the printing medium on which the dots using the metallic ink are formed.

To suppress a decrease in photosensitivity of a photoelectric conversion element provided in a semiconductor device by reducing the parasitic resistance of an amplifier circuit. In addition, the amplifier circuit which amplifies the output current of the photoelectric conversion element is operated stably. A semiconductor device includes a photoelectric conversion element, a current mirror circuit having at least two thin film transistors, a high-potential power supply electrically connected to each of the thin film transistors, and a low-potential power supply electrically connected to each of the thin film transistors. When a reference thin film transistor is an n-type, the reference thin film transistor is placed closer to the low-potential power supply than an output thin film transistor is. When a reference thin film transistor is a p-type, the reference thin film transistor is placed closer to the high-potential power supply than an output thin film transistor is.

A motor stator (10) is provided with a stator core (11) having a plurality of slots (16), insulation members (12) which are disposed in the plurality of slots, and coils of a plurality of phases (13) which are respectively formed by distributed-winding wires (20) in prescribed slots of the plurality of slots disposed spaced apart at intervals of a predetermined number of slots via the insulation members. The wires are disposed within the insulation members in a condition that tensions are applied to the wires. The stator core, the insulation members and the coils are physically fixed together by the tensions of the wires.

The objective of this invention is to provide a head substrate capable of increasing the layout efficiency by arranging circuit elements in a free area of the head substrate on which ink supply channels are staggered. More specifically, the circuit elements connected to a plurality of element arrays are arranged on the free area.

The control apparatus 10 of a servo motor of the present invention has a position control unit 11 controlling the position of a servo motor 33, a speed control unit 12 controlling a speed of the servo motor 33, a distributing unit 13 dividing the speed command output by the position control unit 11 into a filtered part Vf which is filtered to suppress vibration and a nonfiltered part Vnf, a filtering unit 14 receiving as input the filtered part Vf and filtering and outputting the filtered part Vf, and an adder unit 15 adding the filtered part Vf filtered by the filtering unit 14 and the nonfiltered part Vnf and outputting the result to the speed control unit 12.

The method of manufacturing a semiconductor memory includes a process of forming a projection by performing an insulator forming process on the exposed side surface of a reactive conductive material and a non-reactive conductive material that are stacked above a substrate so as to change a predetermined length of the side surface of the reactive conductive material into an insulator, and thereby causing the side surface of the non-reactive conductive material to project outward from the side surface of the reactive its conductive material. The insulator forming process is an oxidation process or a nitridation process, the reactive conductive material is a material that reacts chemically and changes into the insulator in the oxidation process or nitridation process, and the non-reactive conductive material is a material that does not change into the insulator in the oxidation process or nitridation process.

To provide a method of manufacturing a quartz resonator element having a small CI value, a quartz resonator element manufactured by this method, a quartz resonator, and a quartz oscillator.

In a method of manufacturing a quartz resonator element in which on a surface of a plate-shaped quartz piece, a thin film-shaped electrode in order to excite the quartz piece is provided, a first metal layer that is composed of chromium and whose thickness is not less than 20 Å nor more than 45 Å is formed on the surface of the quartz piece (P4), and next, a second metal layer that is composed of gold or silver and whose thickness is not less than 500 Å nor more than 950 Å is formed on an upper surface of the first metal layer (P5), and then, the electrode made up of the first metal layer and the second metal layer is provided (P6). Thereafter, a quartz substrate on which the electrode is formed is heated at a temperature range of not less than 200° C. nor more than 400° C., and the chromium composing the first metal layer is diffused into the second metal layer (P7).

A terminal fitting (10) includes a tubular connecting portion (11) into which a male tab (90) is to be inserted. A plate-shaped resiliently deflectable contact (14) is formed separately from the connecting portion (11) and extends in a front-back direction in the connecting portion (11) for contacting the male tab (90) inserted into the connecting portion (11). The connecting portion (11) includes locks (24) for locking the resilient contact (14) to the connecting portion (11). A support (42) as a deflection supporting point of the resilient contact (14) is provided on a rear end of the resilient contact portion (14). The support (42) is located behind the front ends of receiving portions (41) of the resilient contact (14) to be locked by the locks (24).

To effectively operate a pretensioner using a plurality of balls and an energy absorption mechanism, to simplify the structure of an exhaust passage in the pretensioner, and to facilitate the working process of the exhaust passage. A pretensioner 15 includes a plurality of balls 20 serving as force transmission members and a piston 21 in a pipe 17. A piston body 21a of the piston 21 includes a shaft portion 21c and a substantially hemispherical head portion 21d. The piston body 21a is provided with an exhaust hole 21e extending in the axial direction and exhaust grooves 21f communicating with the exhaust hole 21e that define an exhaust passage. The exhaust grooves 21f prevent the exhaust hole 21e from being closed even if the head portion 21d of the piston 21 contacts the ball 20. Since the exhaust hole 21e and the exhaust grooves 21f are simply provided in the piston body 21a formed as a single member, the structure of the exhaust passage is simple, and working of the exhaust passage is easy.

A multilayer printed wiring board is equipped with a core board 20, a build-up layer 30 formed on the core board 20 so as to have a conductor pattern 32 on the upper surface thereof, a low-elasticity layer 40 formed on the build-up layer 30, lands 52 that are provided on the upper surface of the low-elasticity layer 40 and connected to an IC chip 70 via solder bumps 66, and conductor posts 50 that penetrate through the low-elasticity layer 40 and electrically connect the lands 52 to the conductor pattern 32. The low-elasticity layer 40 is formed of resin composition containing epoxy resin, phenol resin, cross-linked rubber particles and a hardening catalyst.

A gas discharge panel having plural pairs of display electrodes disposed so as to extend through a plurality of cells, each pair being formed from a sustain electrode and a scan electrode. The sustain and scan electrodes each include a plurality of line parts, and an aggregate width of the line parts included in the sustain and scan electrodes is in a range of 22% to 48% inclusive of pixel pitch.