753 results about "Quartz substrate" patented technology

An antenna component (200) with a dielectric substrate and two radiating antenna elements. The elements are located on the upper surface of the substrate and there is a narrow slot (260) between them. The antenna feed conductor (241) is connected to the first antenna element (220), which is connected also to the ground by a short-circuit conductor (261). The second antenna element (230) is parasitic; it is galvanically connected only to the ground. The component is preferably manufactured by a semiconductor technique by growing a metal layer e.g. on a quartz substrate and removing a part of it so that the antenna elements remain. In this case the component further comprises supporting material (212) of the substrate chip. The antenna component is very small-sized because of the high dielectricity of the substrate to be used and mostly because the slot between the antenna elements is narrow. The efficiency of an antenna made by the component is high.

There is disclosed a hybrid circuit in which a circuit formed by TFTs is integrated with an RF filter. The TFTs are fabricated on a quartz substrate. A ceramic filter forming the RF filter is fabricated on another substrate. Terminals extend through the quartz substrate. The TFTs are connected with the ceramic filter via the terminals. Thus, an RF module is constructed.

A large scale polarizer comprises one or more quartz substrate parts formed as a rectangle, a triangle, or a parallelogram, and a polarizer holder supporting the quartz substrate part. The polarizer holder may be in a lattice structure holding a plurality of quartz substrate parts. A polarizer system employing the large scale polarizer comprises a lens making an incident light to a parallel light, the large scale polarizer, and a moving control part coupled to and moving the large scale polarizer.

A method of manufacturing an electro-optical device having a curved display surface with high reliability is provided. A liquid crystal panel 100 comprising a TFT array substrate 10 and a counter substrate 20, each composed of a glass substrate or a quartz substrate, is thinned down to, for example, a thickness of 25 μm by a polishing process or an etching process. Subsequently, a first polarizing plate 140, first spacers 260, the liquid crystal panel 100, second spacers 270, and a second polarizing plate 150 are superposed on a base 210 having a curved surface 220 in this order, and then the outer circumference of the second polarizing plate 150 is pressed against the base 210 while curving the second polarizing plate 150 along the curved surface 220 of the base 210. Then, in order to maintain such a curved state, the second polarizing plate 150 is fixed to the base 210 by a double-faced tape 280.

An extreme ultra violet (EUV) mask is disclosed, which prevents defects from shot overlap encountered in wafer exposure as well as reflection of unnecessary EUV and DUV generated in a black border region, such that a pattern CD is reduced and defects are not created. The EUV mask includes a quartz substrate, a multi-layered reflection film formed over the quartz substrate to reflect exposure light, an absorption layer formed over the multi-layered reflection film, a black border region formed over the quartz substrate that does not include the multi-layered reflection film, and a blind layer formed in a position including at least one of over the absorption layer, over the quartz substrate, and below the quartz substrate.

PCT No. PCT / JP98 / 01526 Sec. 371 Date Dec. 14, 1998 Sec. 102(e) Date Dec. 14, 1998 PCT Filed Apr. 2, 1998 PCT Pub. No. WO98 / 47226 PCT Pub. Date Oct. 22, 1998In an AT-cut quartz resonator having excitation electrodes formed on two principal surfaces of an AT-cut quartz substrate, the two electrodes are displaced a predetermined amount apart in a direction orthogonal to the X-axis direction so that a frequency deviation in a temperature range of from -10 DEG C. to 50 DEG C. is less than + / -2.5 ppm. Further, in an AT-cut quartz resonator in which vertically opposed electrodes on both principal surfaces of a quartz substrate are slightly displaced apart in opposite directions along the Z' axis of quartz crystal, a balancing load is formed on a piezoelectric substrate on the side opposite to the direction of displacement of the electrodes. Thus, the present invention dispenses with the need for raising the ratio of conforming to nonconforming quartz substrates by eliminating variations in their cutting angle, but makes it possible to use nonconforming quartz substrates to offer customers low-cost quartz resonators of oscillation frequencies following various specs, by making easy, simple structural modifications of slightly changing the electrode arrangement or structure, or by making simple improvements to the conventional quartz resonator manufacturing process. In the manufacture of oscillators for use in consumer-electronics equipment, it is possible to fulfill any particular specs without inserting a temperature compensating circuit in the oscillation circuit. In regards to industrial equipment, any adjustments need not be made to the temperature compensating circuit in the oscillation circuit, and this improves the productivity of various communications equipment and various electronics equipment and reduces their manufacturing costs.

The invention relates to a mold that has an improved releasability for a photocured resin and an improved robustness. First, an electron beam resist 17 is coated on a quartz substrate 15 having the nature of being transmissive to ultraviolet light. A resist pattern 17a is formed by irradiation with electron beams. Thereafter, the quartz substrate is dry etched using etching gas such as carbon tetrafluoride to form a pattern 15a on the quartz substrate 15. A photocatalytic titanium oxide film 11 is formed as by sputtering on the surface of the quartz substrate 15 with the pattern 15a formed on it to fabricate an NIL mold 10.

To form a driver circuit to be mounted to a liquid crystal display device or the like on a glass substrate, a quartz substrate, etc., and to provide a display device mounting driver circuits formed from different TFTs suited for their respective operational characteristics. A stick driver circuit on the scanning line side and a stick driver circuit on the data line side are different in structure, and have different TFTs in which the thickness of a gate insulating film, the channel length and other parameters are varied depending on required circuit characteristics. In the stick driver on the scanning line side, which is composed of a shift register circuit, a level shifter circuit, and a buffer circuit, the buffer circuit has a TFT with a thick gate insulating film because it is required to have a withstand voltage of 30 V. The stick driver circuit on the data line side, which is composed of a shift register circuit, a latch circuit, a level shifter circuit, and a D / A converter circuit, is driven at a high frequency, and hence its shift register circuit and latch circuit have thin gate insulating films and the channel length thereof is shorter than that of the TFT of the buffer circuit.

An antenna component (200) with a dielectric substrate and two radiating antenna elements. The elements are located on the upper surface of the substrate and there is a narrow slot (260) between them. The antenna feed conductor (241) is connected to the first antenna element (220), which is connected also to the ground by a short-circuit conductor (261). The second antenna element (230) is parasitic; it is galvanically connected only to the ground. The component is preferably manufactured by a semiconductor technique by growing a metal layer e.g. on a quartz substrate and removing a part of it so that the antenna elements remain. In this case the component further comprises supporting material (212) of the substrate chip. The antenna component is very small-sized because of the high dielectricity of the substrate to be used and mostly because the slot between the antenna elements is narrow. The efficiency of an antenna made by the component is high.