861 results about "Silylation" patented technology

A precursor source mixture useful for CVD or ALD of a film comprising: at least one precursor composed of an element selected from the group consisting of Li, Na, K, Rb, Cs, Fr, Be, Mg, Ti, Zr, Hf, Sc, Y, La, V, Nb, Ta, Cr, Mo, W, Mn, Re, Fe, Ru, Os, Co, Rh, Ir, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Hg, B, Al, Ga, In, Tl, Si, Ge, Sn, Pb, As, P, Sb and Bi, to which is bound at least one ligand selected from the group consisting of hydride, alkyl, alkenyl, cycloalkenyl, aryl, alkyne, carbonyl, amido, imido, hydrazido, phosphido, nitrosyl, nitryl, nitrate, nitrile, halide, azide, alkoxy, siloxy, silyl, and halogenated, sulfonated or silyated derivatives thereof, which is dissolved, emulsified or suspended in an inert liquid selected from the group consisting of aliphatic hydrocarbons, aromatic hydrocarbons, alcohols, ethers, aldehydes, ketones, acids, phenols, esters, amines, alkylnitrile, halogenated hydrocarbons, silyated hydrocarbons, thioethers, amines, cyanates, isocyanates, thiocyanates, silicone oils, nitroalkyl, alkylnitrate, and mixtures thereof. The precursor source mixture may be a solution, emulsion or suspension and may consist of a mixture of solid, liquid and gas phases which are distributed throughout the mixture.

Methods for the repair of damaged low k films are provided. Damage to the low k films occurs during processing of the film such as during etching, ashing, and planarization. The processing of the low k film causes water to store in the pores of the film and further causes hydrophilic compounds to form in the low k film structure. Repair processes incorporating ultraviolet (UV) radiation and silylation compounds remove the water from the pores and further remove the hydrophilic compounds from the low k film structure.

Methods for the repair of damaged low k films are provided. Damage to the low k films occurs during processing of the film such as during etching, ashing, and planarization. The processing of the low k film causes water to store in the pores of the film and further causes hydrophilic compounds to form in the low k film structure. Repair processes incorporating ultraviolet (UV) radiation and silylation compounds remove the water from the pores and further remove the hydrophilic compounds from the low k film structure.

Often used to reduce the RC delay in integrated circuits are dielectric films of porous organosilicates which have a silica like backbone with alkyl or aryl groups (to add hydrophobicity to the materials and create free volume) attached directly to the Si atoms in the network. Si—R bonds rarely survive an exposure to plasmas or chemical treatments commonly used in processing; this is especially the case in materials with an open cell pore structure. When Si—R bonds are broken, the materials lose hydrophobicity, due to formation of hydrophilic silanols and low dielectric constant is compromised. A method by which the hydrophobicity of the materials is recovered using a novel class of silylation agents which may have the general formula (R2N)XSiR′Y where X and Y are integers from 1 to 3 and 3 to 1 respectively, and where R and R′ are selected from the group of hydrogen, alkyl, aryl, allyl and a vinyl moiety. Mechanical strength of porous organosilicates is also improved as a result of the silylation treatment.

Protective caps residing at an interface between copper lines and dielectric diffusion barrier layers are used to improve various performance characteristics of interconnects. The caps, such as cobalt-containing caps or manganese-containing caps, are selectively deposited onto exposed copper lines in a presence of exposed dielectric using CVD or ALD methods. The deposition of the capping material is affected by the presence of carbon-containing contaminants on the surface of copper, which may lead to poor or uneven growth of the capping layer. A method of removing carbon-containing contaminants from the copper surface prior to deposition of caps involves contacting the substrate containing the exposed copper surface with a silylating agent at a first temperature to form a layer of reacted silylating agent on the copper surface, followed by heating the substrate at a higher temperature to release the reacted silylating agent from the copper surface.

A process for treating silica dielectric film on a substrate, which includes reacting a suitable hydrophilic silica film with an effective amount of a multifunctional surface modification agent. The film is present on a substrate and optionally has a pore structure with hydrophilic pore surfaces, and the reaction is conducted for a period of time sufficient for said surface modification agent to penetrate said pore structure and produce a treated silica film having a dielectric constant of about 3 or less, wherein the surface modification agent is hydrophobic and suitable for silylating or capping silanol moieties on such hydrophilic surfaces. Dielectric films and integrated circuits including such films are also disclosed.

A method for restoring hydrophobicity to the surfaces of organosilicate glass dielectric films which have been subjected to an etchant or ashing treatment. These films are used as insulating materials in the manufacture of integrated circuits to ensure low and stable dielectric properties in these films. The method deters the formation of stress-induced voids in these films. An organosilicate glass dielectric film is patterned to form vias and trenches by subjecting it to an etchant or ashing reagent in such a way as to remove at least a portion of previously existing carbon containing moieties and reduce hydrophobicity of said organosilicate glass dielectric film. The vias and trenches are thereafter filled with a metal and subjected to an annealing treatment. After the film is subjected to the etchant or ashing reagent, but before being subjected to an annealing treatment, the film is contacted with a toughening agent composition to restore some of the carbon containing moieties and increase the hydrophobicity of the organosilicate glass dielectric film.

The present invention provides a method for the preparation of 5-azacytidine, wherein 5-azacytidine is represented by the structure: The method involves the silylation of 5-azacytosine, followed by the coupling of silylated 5-azacytosine to a protected β-D-ribofuranose derivative. The coupling reaction is catalyzed by trimethylsilyl trifluoromethanesulfonate (TMS-Triflate).

This invention relates to a moisture-curable silylated resin-containing composition containing, inter alia, moisture-curable silylated resin, the cured composition exhibiting low permeability to gas(es).

Leakage, capacitance and reliability degradation of interconnects fabricated in low-k dielectric materials, particularly porous low-k dielectric material, due to penetration by a barrier metal and / or barrier metal precursor during damascene processing is prevented by depositing a conformal, heat stable dielectric sealant layer on sidewalls of the low-k dielectric material defining the damascene opening. Embodiments include forming a dual damascene opening in a porous, low-k organosilicate layer, the organosilicate having a pendant silanol functional group, depositing a siloxane polymer having a silylating functional group which bonds with the pendant silanol group to form the sealant layer, depositing a Ta and / or TaN barrier metal layer by CVD or ALD and filling the opening with Cu or a Cu alloy.

An image sensor includes a double-microlens structure with an outer microlens aligned over an inner microlens, both microlenses aligned over a corresponding photosensor. The inner or outer microlens may be formed by a silylation process in which a reactive portion of a photoresist material reacts with a silicon-containing agent. The inner or outer microlens may be formed by step etching of a dielectric material, the step etching process including a series of alternating etch steps including an anisotropic etching step and an etching step that causes patterned photoresist to laterally recede. Subsequent isotropic etching processes may be used to smooth the etched step structure and form a smooth lens. A thermally stable and photosensitive polymeric / organic material may also be used to form permanent inner or outer lenses. The photosensitive material is coated then patterned using photolithography, reflowed, then cured to form a permanent lens structure.

The present invention is directed to implants that include therapeutic molecules bonded to their surfaces. The therapeutic molecules interact with cells that are adjacent, near, or adhering to the implant. The covalently-bonded therapeutic molecules may be released from the implant surface by changes in pH or enzymes characteristic of cells adjacent to the implant. Preferably the covalently-bonded agents include an antibiotics that are released from the implant surface by bacteria and in this way ensures that the antibiotic is released at sites on the implant that would serve as centers for both bacterial colonization and biofilm formation.

The invention relates to silicon dioxide which bears partially or fully silylated polysilicic acid chains on its surface, wherein the sum of silanol groups of the silicon dioxide surface (SiOH) and grafted-on silylating agent radicals (SiRa) is greater than the number of silanol groups on the surface of untreated silicon dioxide, where a can be 1, 2 or 3 and R can be identical or different and are each a substituted or unsubstituted hydrocarbon radical.

A method for preparing a functionalized polymer, the method comprising the steps of (i) polymerizing monomer with a coordination catalyst to form a reactive polymer; and (ii) reacting the reactive polymer with a carboxylic or thiocarboxylic ester containing a silylated amino group.

A moisture-curable composition includes a silane-terminated polyurethane-polyurea polymer made by reacting a polyol, polyisocyanate, and polyamine together to provide an isocyanate-terminated polyurethane-polyurea polymer with at least two urethane linkages and at least two urea linkages in the polymer chain, and capping at least a portion of the isocyanate-terminated polymer with a silane having at least one alkoxy group to provide the moisture-curable silane-terminated polymer.

Moisture-curable compositions are provided which comprises a moisture-curable silylated resin, a flexibilizer and at least one curing catalyst. The cured compositions possess enhanced elongation and tear properties, and are highly suitable for applications such as adhesives, sealants, coatings, gaskets, industrial rubber goods, and the like.

Often used to reduce the RC delay in integrated circuits are dielectric films of porous organosilicates which have a silica like backbone with alkyl or aryl groups (to add hydrophobicity to the materials and create free volume) attached directly to the Si atoms in the network. Si—R bonds rarely survive an exposure to plasmas or chemical treatments commonly used in processing; this is especially the case in materials with an open cell pore structure. When Si—R bonds are broken, the materials lose hydrophobicity, due to formation of hydrophilic silanols and low dielectric constant is compromised. A method by which the hydrophobicity of the materials is recovered using a novel class of silylation agents which may have the general formula (R2N)XSiR′Y where X and Y are integers from 1 to 3 and 3 to 1 respectively, and where R and R′ are selected from the group of hydrogen, alkyl, aryl, allyl and a vinyl moiety. Mechanical strength of porous organosilicates is also improved as a result of the silylation treatment.

The invention relates to a method for preparing alcohols by selectively hydrogenating aldehydes, belonging to hydrogenation technologies. In order to meet the requirements of people on two aspects, i.e. the improving of the selectivity on preparing the alcohols by hydrogenating the aldehydes and the prolonging of the service life of a catalyst currently, the method proposes that: the aldehydes are taken as raw materials; the reaction temperature is 20-300 DEG C; the reaction pressure is 0.1-7.0 MPa; the weight space velocity of the aldehydes is 0.02-20 h<-1>; the aldehydes and hydrogen gas are in contact with a hydrogenation catalyst; and the aldehydes are produced into corresponding alcohols through selectively hydrogenating. In the method, the hydrogenation catalyst comprises a carrier, a metal active component and silane groups; the silane groups are grafted through a silylanizing treatment; and the content of the silane groups in the total weight of the catalyst is 0.05 wt% to 25 wt%. Compared with the existing method, with the adoption of the catalyst in the method provided by the invention, the selectivity is high, the amount of byproducts, such as ethers, esters and acetals is greatly lowered; and meanwhile, the generation amount of carbon deposit is little, so that the catalyst has longer service life.

A two-part moisture-curable resin composition comprises:a) a first part substantially free of moisture comprising:(1) moisture-curable silylated resin and,(2) optionally, one or more additional components selected from the group consisting of plasticizer, solvent, thixotropic agent, particulate material, moisture scavenger, isocyanate scavenger, crosslinker, adhesion promoter, U.V. stabilizer and antioxidant; and,b) a second part comprising:(1) water in an amount sufficient to cure moisture-curable silylated resin (a)(1);(2) at least one plasticizer and / or particulate material,(3) nonionic surfactant in an amount sufficient to provide a stable emulsion of plasticizer (b)(2), if present, and a stable suspension of particulate material (b)(2), if present,(4) optionally, one or more additional components selected from the group consisting of solvent, thixotropic agent, pH adjuster, U.V. stabilizer and antioxidant,provided, the first part and / or the second part further comprises catalyst (c) for the condensation reaction of hydrolyzed moisture-curable silylated resin (a)(1).

Leakage, capacitance and reliability degradation of interconnects fabricated in low-k dielectric materials, particularly porous low-k dielectric material, due to penetration by a barrier metal and / or barrier metal precursor during damascene processing is prevented by depositing a conformal, heat stable dielectric sealant layer on sidewalls of the low-k dielectric material defining the damascene opening. Embodiments include forming a dual damascene opening in a porous, low-k organosilicate layer, the organosilicate having a pendant silanol functional group, depositing a siloxane polymer having a silylating functional group which bonds with the pendant silanol group to form the sealant layer, depositing a Ta and / or TaN barrier metal layer by CVD or ALD and filling the opening with Cu or a Cu alloy.

A toughening agent composition for increasing the hydrophobicity of an organosilicate glass dielectric film when applied to said film. It includes a component capable of alkylating or arylating silanol moieties of the organosilicate glass dielectric film via silylation, and an activating agent selected from the group consisting of an amine, an onium compound and an alkali metal hydroxide.

A substantially uniform polyurethane-polysiloxane resin mixture is obtained from a two-part curable composition in which the first part contains a moisture-curable silylated polyurethane resin and a crosslinker for silanol-terminated diorganopolysiloxane, the second part contains silanol-terminated diorganopolysiloxane and a condensation catalyst is present in the first and / or second part.

A process for making a thermoplastic vulcanizate includes blending a thermoplastic first polymer, an elastomeric second polymer, a carboxylic anhydride, a free radical generator, and a tackifier to provide a tacky first blend containing the thermoplastic first polymer and grafted elastomeric second polymer with the tackifier dispersed therein; then, reacting the first blend with a silane to provide a non-tacky thermoplastic vulcanizate product.

Organomodified silylated surfactant compositions that exhibit resistance to hydrolysis over a wide pH range

The invention relates to a preparation method of a protein magnetic imprinting nano sphere, in particular to a preparation method of a protein magnetic imprinting nano sphere which takes one of hemoglobin, muramidase or serum protein as template molecules; the preparation method includes the following steps: synthesizing magnetic nano particles which are Fe3O4 nano particles covered with silicon dioxide on the surfaces; carrying out silanization to the amino-groups on the surface of the magnetic sphere; using glutaric dialdehyde to connect protein; using silylation agent to fix the space structure of template protein; alkaline eluting the protein on the surface of the magnetic sphere to form imprinting sites. The hemoglobin, muramidase or serum protein magnetic nano imprinting polymer sphere prepared by the invention combines the precise and specific identification property of molecular imprinting and the quick separation property of the magnetic nano sphere under the action of an external magnetic field, integrates the advantages of molecular imprinting and the magnetic nano sphere, avoids complex centrifugation operation, plays vital roles in the separation of cells, protein and nucleic acid, the detection of biomolecules, tumor diagnosis and medicine targeting therapy and has promising application prospect in the field of isolation analysis.

Organomodified silylated surfactant compositions that exhibit resistance to hydrolysis over a wide pH range.

This invention discloses a method for synthesizing organic-inorganic bentonite composite. The method comprises: utilizing bentonite as the main material, performing inorganic modification through cation-exchange reaction by using hydroxyl aluminum aqueous solution, torrefying to obtain hydroxyl-containing aluminum-pillared bentonite with high porosity and high specific surface area, and reacting between the hydroxyls and silylation agent to graft silane groups onto aluminum-pillared bentonite and obtain organic-inorganic bentonite composite. The organic-inorganic bentonite composite has both the advantages of inorganic pillared bentonite such as high porosity and high specific surface area, and those of organic bentonite such as high organic carbon content and high hydrophobicity thus can be used to treat organic waste gases and wastewater with a good effect by surface adsorption as well as distribution.

This invention relates to a moisture-curable silylated resin-containing composition containing, inter alia, moisture-curable silylated resin and organic nanoclay(s), the cured composition exhibiting low permeability to gas(es).

A method for producing propylene oxide by reacting propylene with ethylbenzene hydroperoxide, wherein the reaction is conducted in the presence of a catalyst comprising a titanium-containing silicon oxide and satisfying all of the following conditions (1) to (6):(1) there is at least one peak showing a interplanar spacing (d) larger than 18 Å in X-ray diffraction;(2) an average pore size is 10 Å or more;(3) a pore size of 90% or more of the total pore volume is 5 to 200 Å;(4) a specific pore volume is 0.2 cm3 / g or more;(5) a quaternary ammonium ion represented by the following general formula (I) is used as a template and then said template is removed by calcination operation:wherein R1 represents a linear or branched hydrocarbon chain having 2 to 36 carbon atoms, and R2 to R4 represent an alkyl group having 1 to 6 carbon atoms; and(6) The catalyst has been subjected to silylation treatment.