375 results about "Stress reduction" patented technology

A nutritional supplement composition for normalizing impaired or deteriorating neurological function in humans is composed of: at least one agent which promotes synthesis of ATP and / or creatine phosphate in the body, at least one antioxidant for scavenging free radicals in at least one pathway in the body; at least one agent for normalizing or maintaining membrane function and structure in the body; at least one agent for normalizing or maintaining normal neurotransmitter function in the body; at least one agent for down-regulating cortisol action; and at least one agent for suppressing activation of apoptotic pathways in the body. The composition may further contain one or more of: at least one agent for suppressing inflammation in the body; at least one agent for normalizing or maintaining vascular wall function and structure in the body; at least one agent for normalizing or maintaining function of nerve growth factors and / or neurotropic factors in the body; at least one agent for suppressing toxic metal ionic effects; at least one agent for normalizing or maintaining methyl metabolism in the body; at least one agent for normalizing or maintaining metabolism of insulin and glucose in the body; and at least one agent for up-regulating activity of heat shock proteins in the body. A method for normalizing impaired neurological function in humans modulating nutrient partitioning in a human involves administering the aforementioned composition to the human, preferably on a daily basis, for a therapeutically effective period of time. Preferably, the method further involves having the human follow a stress reduction program, and / or a cognitive retraining program, and / or a dietary program designed to maximize insulin and glucose metabolism.

The present invention provides polyimide polymer materials for passivating semiconductor wafers and methods for fabricating thereof. The present invention further provides a device that includes a semiconductor wafer and a passivating layer disposed on the surface of the wafer, wherein the passivating layer comprises such polyimide polymers.

The bond between a flip chip integrated circuit and a substrate is subject to mechanical stress from thermal cycles. This problem is exaggerated when the substrate has a rate of thermal expansion which is appreciably different from that of silicon. This problem is further exaggerated when the IC has a large footprint because it will experience a larger absolute expansion. A solution is proposed to this problem which involves creating an anchoring point. The anchoring point can be in either the IC or the substrate and can be a through-hole or a surface indentation such as a groove or a cutout. The anchoring point is filled with the underfill material during the underfill process. The anchoring point thus provides additional mechanical strength to the bond between the IC and the substrate.

A process for assisting in the reduction in the craving of an addictive substance, particularly nicotine is described that includes the following steps: placing at least one pressure pad on a target pressure point on the ear of a patient for a first time period; during a second time period, the patient periodically ingests a craving reduction composition orally; during a third time period overlapping with the first time period, the patient periodically ingests a stress reduction formula in oral form, removing the at least one pressure pad at a time after the first time period and replacing the pressure pad with a replacement pressure pad; lastly, the patient continues with the pressure pad replacement, composition ingestion and oral ingestion of the stress reduction formula until a treatment end time.