775results about How to "Reduce tensile stress" patented technology

A method for fabricating a thermally stable ultralow dielectric constant film comprising Si, C, O and H atoms in a parallel plate chemical vapor deposition process utilizing a plasma enhanced chemical vapor deposition (“PECVD”) process is disclosed. Electronic devices containing insulating layers of thermally stable ultralow dielectric constant materials that are prepared by the method are further disclosed. To enable the fabrication of a thermally stable ultralow dielectric constant film, specific precursor materials are used, such as, silane derivatives, for instance, diethoxymethylsilane (DEMS) and organic molecules, for instance, bicycloheptadiene and cyclopentene oxide.

A flexible display device and a method of manufacturing the same are provided. The flexible display device comprises a first flexible substrate including a display area including an organic light emitting layer, and a peripheral circuit area, and a second flexible substrate coming in contact with the first flexible substrate and including a pattern for facilitating bending thereof, wherein the second flexible substrate has a certain shape according to the pattern, and the first flexible substrate has a shape corresponding to the certain shape. Various embodiments of the present invention provide a flexible display device capable of realizing a narrow bezel-type or bezel-free display device and simultaneously realizing improved types of design, facilitating bending of a bezel area so as to realize a narrow bezel-type or bezel-free display device, and minimizing damage to an area to be bent.

The present disclosure includes a cable for a patient monitoring system. The cable can have a flexible and durable overall construction that enables the cable to withstand repeated winding and unwinding and prevent kinks from developing. The cable may include multiple bundles encased in inner jackets that reduce the amount of friction against other cable elements and allows the bundle to move more freely inside an outer jacket of the cable. The multiple bundles may include multiple wires or cords. The cable can include a flexible core that runs through the middle of the cable. The multiple bundles can be twisted, weaved, or untwisted around the core.

A preparatory tempered glass structure for a cutting treatment includes a glass substrate and at least one trench. The glass substrate is given a strengthening treatment to form, from a surface to the inside of the glass substrate, at least one compression stress layer and a tensile stress layer corresponding to the compression stress layer. The trench is formed in the compression stress layer of the glass substrate and overlaps a predetermined cutting path for the cutting treatment.

A method for cutting a tempered glass includes the following steps. First, a shielding layer is formed on a part of a surface of a glass substrate, and a predetermined cutting path passes through the part of the surface. Then, a glass substrate is given an ion-exchange strengthening treatment, and the part of the surface covered by the shielding layer substantially does not undergo ion-exchange. Finally, the glass substrate is cut along the predetermined cutting path.

A fluid end for a reciprocating pump including a body having a base, a side and a longitudinal opposing side, a cylinder bore formed horizontally through the body and a vertical bore intersecting the cylinder bore defining a high stress region proximate the intersection, and a tension member extending through the body substantially parallel to the longitudinal axis of the body, wherein the tension member provides a compressive load on the body reducing the stresses encountered in the region during operation of the fluid end.

A fracture resistant friction stir welding tool includes a pin for plunging into one or more workpiece(s) to be welded and a shoulder for preventing plasticized material from flowing out of the joint being welded. The friction stir welding tool includes a tool body including a cavity for receiving the shoulder and exerting a compressive stress on the shoulder, and the pin is placed in compression by an axial tension member in the pin.

In a fabrication method for forming an electrical interconnection of CVD tungsten film, a contact hole is formed in a dielectric layer. A lower conductive layer is formed in the contact hole and over the dielectric layer. A portion of the lower conductive layer is removed. As a result, the dielectric layer is exposed. An upper conductive layer is formed over the lower conductive layer and over the dielectric layer. The lower conductive layer has a rough surface and the upper conductive layer has a smooth surface. In this manner, following patterning of conductive stripes over the conductive layer, residue is mitigated, and thus, inadvertent interconnection of neighboring stripes is eliminated.

The present disclosure includes a cable for a patient monitoring system. The cable can have a flexible and durable overall construction that enables the cable to withstand repeated winding and unwinding and prevent kinks from developing. The cable may include multiple bundles encased in inner jackets that reduce the amount of friction against other cable elements and allows the bundle to move more freely inside an outer jacket of the cable. The multiple bundles may include multiple wires or cords. The cable can include a flexible core that runs through the middle of the cable. The multiple bundles can be twisted, weaved, or untwisted around the core.

A semiconductor device and method for forming the device wherein the device includes a substrate; a dielectric insulating layer formed overlying the substrate; a metal filled dual damascene structure formed in the dielectric insulating layer, wherein the metal filled dual damascene structure includes a via portion and a trench portion; and at least one intervening dielectric layer in compressive stress formed in the dielectric insulating layer and disposed at a level adjacent to at least one of the via portion and the trench portion of the metal filled dual damascene structure.

A semiconductor device includes a substrate, a buffer layer on the substrate, and a plurality of nitride semiconductor layers on the buffer layer. The semiconductor device further includes at least one masking layer and at least one inter layer between the plurality of nitride semiconductor layers. The at least one inter layer is on the at least one masking layer.

An stretch resistant plantar fascia support system is provided. The stretch resistant plantar fascia support system is adhesively applied to the foot of a patient for providing relief from plantar fasciitis. A portion of the stretch resistant plantar fascia support system is adhesively attached to the bottom surface of the foot for reducing stress on the plantar fascia.

The invention discloses an air and water hybrid cooling high-speed permanent-magnet motor and belongs to the technical field of motors. The large-power high-speed permanent-magnet motor comprises a casing, a cooling water jacket, a stator core, a stator radial air duct, a stator inner air duct, a motor rotor, an outer rotor axial fan, an outer rotor fan fixing frame and two sliding bearings. The stator core is divided into two sections, the radial air duct is reserved in the middle, and the inner air duct is reserved in a stator slot close to the air gap position. The cooling water jacket is arranged outside the stator casing, a spiral water way is arranged in the water jacket, and water flows into the water way from the middle of the water way and flows out from a left spiral water outlet and a right spiral water outlet which are arranged at two ends of the water way. The air and water hybrid cooling high-speed permanent-magnet motor can mechanically solve the problem that a permanent magnet is broken when bearing large pulling stress during high-speed rotating, further solves the problems that the large-power high-speed motor is large in loss density, difficult in heat dissipation and over high in temperature rising, and prevents the permanent magnet from having irreversible demagnetization easily at high temperature.

A flexible display device and a method of manufacturing the same are provided. The flexible display device comprises a first flexible substrate including a display area including an organic light emitting layer, and a peripheral circuit area, and a second flexible substrate coming in contact with the first flexible substrate and including a pattern for facilitating bending thereof, wherein the second flexible substrate has a certain shape according to the pattern, and the first flexible substrate has a shape corresponding to the certain shape. Various embodiments of the present invention provide a flexible display device capable of realizing a narrow bezel-type or bezel-free display device and simultaneously realizing improved types of design, facilitating bending of a bezel area so as to realize a narrow bezel-type or bezel-free display device, and minimizing damage to an area to be bent.

The invention relates to recycled concrete and a preparation method thereof, and belongs to the technical field of concrete. The recycled concrete comprises (by weight): 150-280 parts of cement, 90-130 parts of water, 800-950 parts of modified recycled coarse aggregate, 400-530 parts of fine aggregate, 40-85 parts of fly ash, 80-100 parts of mineral powder, 50-140 parts of zeolite powder, 30-60 parts of epoxy resin, 4-10 parts of a water reducing agent and 2-6 parts of an air entraining agent. The preparation method of the modified recycled coarse aggregate comprises the following steps: S1, crushing and screening waste concrete to obtain recycled coarse aggregate; S2, soaking the recycled coarse aggregate obtained in the step S1 in an acetic acid solution with the mass concentration of 2-7%, and airing; S3, stirring 80-110 parts of polyvinyl alcohol, 60-110 parts of silica fume, 40-80 parts of sodium silicate and 800-1,000 parts of water to obtain a modified liquid; and S4, soaking the recycled coarse aggregate obtained in the step S2 in the modified liquid obtained in the step S3, taking out the soaked recycled coarse aggregate, and baking the recycled coarse aggregate to obtainthe modified recycled coarse aggregate. The recycled concrete provided by the invention has a good compressive strength effect.

A metallic coating containing hard carbide particles is described. The coating is applied by an HVOF process using powder particles whose size ranges from about 15 to about 44 microns. The carbide particles are held in a 80% nickel-20% chromium matrix. The coating has a reduced tensile compressive stress relative to similar plasma sprayed coatings and exhibits a high strain to cracking value.

A light absorption layer is formed over a substrate, the light absorption layer is selectively irradiated with a laser beam, and a region of the light absorption layer, which is irradiated with the laser beam, is removed. By adding an impurity element imparting one conductivity type or an inert element to a remaining part of the light absorption layer, a tensile stress of the light absorption layer is made lower than that before irradiation with the laser beam.

The invention discloses an LED epitaxial wafer grown on an Si substrate and a preparation method thereof. The LED epitaxial wafer grown on the Si substrate is prepared through the following preparation method: using the Si substrate, enabling the surface (111) of the Si substrate to deviate from (100) by 0.5 to 1 degree, growing a first AlN buffer layer, and growing a second AlN buffer layer, an AlGaN step buffer layer, a u-GaN layer, an n-GaN layer, an InGaN / GaN quantum well layer and a p-GaN layer in sequence. The LED epitaxial wafer grown on the Si substrate uses Si as the substrate, the preparation method combines a metal organic chemical vapor deposition technique and a pulsed laser deposition technique, a procedure of pre-paving Al for using the metal organic chemical vapor deposition technique to grow the AlN is omitted, the problem that Si is diffused to the AlN buffer layer under a high temperature to damage the surface shape is avoided, and the LED epitaxial wafer is good in performance, high in crystal quality and suitable for LED devices.

The invention relates to a folding mobile terminal comprising a flexible screen, a flexible transparent cover plate and a shell, wherein a first adhesive layer is arranged in full screen between one side surface of the flexible screen and the flexible transparent cover plate, second adhesive layers are partially arranged on edges of two folding ends of one side surface, far away from the flexibletransparent cover plate, of the flexible screen and the edges of two ends, corresponding to the shell, of the flexible screen. The folding mobile terminal provided by the invention is stably fixed during a folding process and does not cause damage to the screen, and is reliable in structure, good in stability and small in damage to screen; furthermore, the flexible screen and the shell are partially adhered, so that the folding area of the flexible screen in touch with the shell has relative displacement, and thus the tensile stress of the shell to the screen can be effectively reduced when the flexible screen is bent.

Provided are a semiconductor structure and a forming method thereof. The forming method comprises the steps that a semiconductor layer is formed in a source region and a drain region of a first fin part, covers the top surface and part of the side wall surface of the first fin part and is provided with protruded first ridge corners and second ridge corners, the first ridge corners are located on the top surface of the first pin part, and the second ridge corners are located on the surface of a side wall of the first fin part; a barrier layer is formed on a substrate, the first fin part and the surface of the semiconductor layer and fills a space between the adjacent second ridge corners, so that the adjacent second ridge corners are connected through the barrier layer; a dielectric layer is formed on the surface of the barrier layer, a first opening in the dielectric layer is exposed out of the barrier layer on the surfaces of at least two adjacent first ridge corners, the position of a side wall of the first opening in contact with the barrier layer is higher than the horizontal positions of the second ridge corners; the barrier layer at the bottom of the first opening is etched until the barrier layer is exposed out of the surface of the semiconductor layer, and a first conductive layer is formed on the surface of the semiconductor layer in the first opening. The performance of a formed semiconductor device is improved.

The invention belongs to the field of building materials, in particular to a paying method of a steel box girder bridge deck payment layer. The paying method of the steel box girder bridge deck payment layer is characterized by comprising the following steps: (1) bridge deck pre-cleaning; (2) welding of shearing rivets; (3) binding of reinforcing mats; (4) payment of a high-toughness high-strengthlight aggregation concrete layer: paying high-toughness high-strength light aggregation concrete on steel plates of a steel box girder bridge deck and forming the high-toughness high-strength light aggregation concrete layer, wherein the high-toughness high-strength light aggregation concrete is higher than the shearing rivets by 1-2 cm and the thickness of the high-toughness high-strength lightaggregation concrete is 5-8 cm; (5) payment of a waterproof bonding stress absorbing layer, wherein the thickness of the waterproof bonding stress absorbing layer is 1-2 cm; and (6) payment of a payment layer for resisting slipping, reducing noise and draining: preparing the payment layer for resisting slipping, reducing noise and draining, wherein the thickness of the pavement layer is 3-5 cm. The payment layer has the characteristics of stress absorption, lightness and excellent slipping resistance.

An stretch resistant plantar fascia support system is provided. The stretch resistant plantar fascia support system is adhesively applied to the foot of a patient for providing relief from plantar fasciitis. A portion of the stretch resistant plantar fascia support system is adhesively attached to the bottom surface of the foot for reducing stress on the plantar fascia.

The invention discloses a method and the die for preparation of a hot forging ring billet of the guard ring of generator, and relates to a forging technique and the device of guard ring part of generator. The prior hot forging technique is flat-die forging, easily to produce crack in the process. The invention using confined shaping in die instead of flat-die forging, it improves the state of stress and prevents the crack effectively. With the symmetry of sphere plunger axis in the process of fan boring, the crystal particles are fine and uniform, which provides a perfect condition for cold strain intensification. With the jacket shaping of billet, it can improve lubrication and decrease friction, and can keep the temperature of the hot billet effectively, improving the plasticity and decreasing the shaping pressure. The invention solves the three problems that the crack is easy to produce, the structure property is not uniform, and the shaping pressure is large; compared with the prior technique, the invention has a projecting progress and a distinctive effect.

The invention discloses a method for preventing strip breakage on startup. The method includes, before strip winding, processing sheets with broken strips at first after stopping of a cold rolling mill due to strip breakage, compressing roll gaps of various frames and regulating the minimum rolling force of the roll gaps of the different frames after finishing the strip winding, generating exit tension of the different frames prior to regulating roll bending force of working rolls and intermediate rolls after finishing compressing of the roll gaps, and then, starting the cold rolling mill. The method for preventing strip breakage on startup includes control of the roll gaps of the cold rolling mill, selection of rolling force and tension and generation of tension, regulation of actual inclination and tension deviation of different frames, control of bending conditions of the working rolls and the intermediate rolls after startup, thereby effectively controlling times of startup strip breakage of sheets with the thickness lower than 0.6mm and improving production efficiency.

An embodiment of the invention discloses a flexible substrate, a manufacturing method thereof and a display device, relates to the technical field of display, and is used for reducing breaking risks of metal wires in the flexible substrate when the flexible substrate is bent. The flexible substrate comprises a flexible substrate body as well as a wiring layer and a back film which are arranged onthe two sides of the flexible substrate body respectively; a plane area for reserving the back film and a bending area for removing the back film are formed on one side, opposite to the wiring layer,of the flexible substrate body; a photocuring adhesive film is arranged in the bending area, elasticity modulus of the photocuring adhesive film is smaller than that of the back film. The flexible substrate, the manufacturing method thereof and the display device provided in the embodiment are applied to border narrowing of the display device.

Provided is a thickened frame type ballastless track plate. The track plate comprises a base plate, bosses and track bearing tables. The base plate is of a cuboid, the two bosses are symmetrically arranged on one face of the base plate along the axis of the cuboid in the length direction, and the track bearing tables are evenly distributed in the length direction of the upper surfaces of the bosses. A through hole is formed in the base plate and is located between the two bosses symmetrically arranged on the base plate, and a frame structure connected between the two bosses through a transverse reinforcement concrete structure is formed. The thickened frame type ballastless track plate can effectively reduce track plate warping caused by temperature stress, eliminate a pull cracking phenomenon, and enhance running safety and comfort. The thickened frame type ballastless track plate is reasonable in structural stress, light, high in structural strength and capable of effectively improving the stress condition of a sleeper structural system, prolonging the service life of the structure and optimizing rack circuit parameters, improves the circuit transmission characteristic of a resonant track, can be directly and effectively connected with a current high-speed railway CRTS-I ballastless track plate, and is suitable for industrial production.

A method and a system for continuously in-line annealing a forwarding ferromagnetic amorphous alloy ribbon in a curved shape to improve its magnetic properties without causing the ribbon to become brittle and which operates at significant high ribbon feeding rates. The amorphous alloy ribbon is fed forward, tensioned and guided along a path at a preset feeding rate and is heated at a point along the path at a rate greater than 103° C. / sec to a temperature to initiate a thermal treatment. Then the ribbon is initially cooled at a rate greater than 103° C. / sec until the thermal treatment ends. During the thermal treatment, a series of mechanical constraints is applied on the ribbon until the amorphous alloy ribbon adopts a specific shape at rest after the thermal treatment is ended. After the initial cooling, the amorphous alloy ribbon is subsequently cooled at a sufficient rate to a temperature that will preserve the specific shape.