771results about How to "Reduce tensile stress" patented technology

A method for fabricating a thermally stable ultralow dielectric constant film comprising Si, C, O and H atoms in a parallel plate chemical vapor deposition process utilizing a plasma enhanced chemical vapor deposition (“PECVD”) process is disclosed. Electronic devices containing insulating layers of thermally stable ultralow dielectric constant materials that are prepared by the method are further disclosed. To enable the fabrication of a thermally stable ultralow dielectric constant film, specific precursor materials are used, such as, silane derivatives, for instance, diethoxymethylsilane (DEMS) and organic molecules, for instance, bicycloheptadiene and cyclopentene oxide.

A method for cutting a tempered glass includes the following steps. First, a shielding layer is formed on a part of a surface of a glass substrate, and a predetermined cutting path passes through the part of the surface. Then, a glass substrate is given an ion-exchange strengthening treatment, and the part of the surface covered by the shielding layer substantially does not undergo ion-exchange. Finally, the glass substrate is cut along the predetermined cutting path.

A fluid end for a reciprocating pump including a body having a base, a side and a longitudinal opposing side, a cylinder bore formed horizontally through the body and a vertical bore intersecting the cylinder bore defining a high stress region proximate the intersection, and a tension member extending through the body substantially parallel to the longitudinal axis of the body, wherein the tension member provides a compressive load on the body reducing the stresses encountered in the region during operation of the fluid end.

In a fabrication method for forming an electrical interconnection of CVD tungsten film, a contact hole is formed in a dielectric layer. A lower conductive layer is formed in the contact hole and over the dielectric layer. A portion of the lower conductive layer is removed. As a result, the dielectric layer is exposed. An upper conductive layer is formed over the lower conductive layer and over the dielectric layer. The lower conductive layer has a rough surface and the upper conductive layer has a smooth surface. In this manner, following patterning of conductive stripes over the conductive layer, residue is mitigated, and thus, inadvertent interconnection of neighboring stripes is eliminated.

The present disclosure includes a cable for a patient monitoring system. The cable can have a flexible and durable overall construction that enables the cable to withstand repeated winding and unwinding and prevent kinks from developing. The cable may include multiple bundles encased in inner jackets that reduce the amount of friction against other cable elements and allows the bundle to move more freely inside an outer jacket of the cable. The multiple bundles may include multiple wires or cords. The cable can include a flexible core that runs through the middle of the cable. The multiple bundles can be twisted, weaved, or untwisted around the core.

A semiconductor device and method for forming the device wherein the device includes a substrate; a dielectric insulating layer formed overlying the substrate; a metal filled dual damascene structure formed in the dielectric insulating layer, wherein the metal filled dual damascene structure includes a via portion and a trench portion; and at least one intervening dielectric layer in compressive stress formed in the dielectric insulating layer and disposed at a level adjacent to at least one of the via portion and the trench portion of the metal filled dual damascene structure.

A flexible display device and a method of manufacturing the same are provided. The flexible display device comprises a first flexible substrate including a display area including an organic light emitting layer, and a peripheral circuit area, and a second flexible substrate coming in contact with the first flexible substrate and including a pattern for facilitating bending thereof, wherein the second flexible substrate has a certain shape according to the pattern, and the first flexible substrate has a shape corresponding to the certain shape. Various embodiments of the present invention provide a flexible display device capable of realizing a narrow bezel-type or bezel-free display device and simultaneously realizing improved types of design, facilitating bending of a bezel area so as to realize a narrow bezel-type or bezel-free display device, and minimizing damage to an area to be bent.

A light absorption layer is formed over a substrate, the light absorption layer is selectively irradiated with a laser beam, and a region of the light absorption layer, which is irradiated with the laser beam, is removed. By adding an impurity element imparting one conductivity type or an inert element to a remaining part of the light absorption layer, a tensile stress of the light absorption layer is made lower than that before irradiation with the laser beam.

An apparatus for increasing the forming limit of plate part is composed of a fluid medium cavity, a lower female die, an edge pressing ring, and a male die or a forming female die. Its forming method includes such steps as filling fluid medium in said cavity, putting a raw plate on the working position, applying an edge-pressing force, and controlling the male die to move downward.

Provided are a semiconductor structure and a forming method thereof. The forming method comprises the steps that a semiconductor layer is formed in a source region and a drain region of a first fin part, covers the top surface and part of the side wall surface of the first fin part and is provided with protruded first ridge corners and second ridge corners, the first ridge corners are located on the top surface of the first pin part, and the second ridge corners are located on the surface of a side wall of the first fin part; a barrier layer is formed on a substrate, the first fin part and the surface of the semiconductor layer and fills a space between the adjacent second ridge corners, so that the adjacent second ridge corners are connected through the barrier layer; a dielectric layer is formed on the surface of the barrier layer, a first opening in the dielectric layer is exposed out of the barrier layer on the surfaces of at least two adjacent first ridge corners, the position of a side wall of the first opening in contact with the barrier layer is higher than the horizontal positions of the second ridge corners; the barrier layer at the bottom of the first opening is etched until the barrier layer is exposed out of the surface of the semiconductor layer, and a first conductive layer is formed on the surface of the semiconductor layer in the first opening. The performance of a formed semiconductor device is improved.

The invention belongs to the field of building materials, in particular to a paying method of a steel box girder bridge deck payment layer. The paying method of the steel box girder bridge deck payment layer is characterized by comprising the following steps: (1) bridge deck pre-cleaning; (2) welding of shearing rivets; (3) binding of reinforcing mats; (4) payment of a high-toughness high-strengthlight aggregation concrete layer: paying high-toughness high-strength light aggregation concrete on steel plates of a steel box girder bridge deck and forming the high-toughness high-strength light aggregation concrete layer, wherein the high-toughness high-strength light aggregation concrete is higher than the shearing rivets by 1-2 cm and the thickness of the high-toughness high-strength lightaggregation concrete is 5-8 cm; (5) payment of a waterproof bonding stress absorbing layer, wherein the thickness of the waterproof bonding stress absorbing layer is 1-2 cm; and (6) payment of a payment layer for resisting slipping, reducing noise and draining: preparing the payment layer for resisting slipping, reducing noise and draining, wherein the thickness of the pavement layer is 3-5 cm. The payment layer has the characteristics of stress absorption, lightness and excellent slipping resistance.

An stretch resistant plantar fascia support system is provided. The stretch resistant plantar fascia support system is adhesively applied to the foot of a patient for providing relief from plantar fasciitis. A portion of the stretch resistant plantar fascia support system is adhesively attached to the bottom surface of the foot for reducing stress on the plantar fascia.

An embodiment of the invention discloses a flexible substrate, a manufacturing method thereof and a display device, relates to the technical field of display, and is used for reducing breaking risks of metal wires in the flexible substrate when the flexible substrate is bent. The flexible substrate comprises a flexible substrate body as well as a wiring layer and a back film which are arranged onthe two sides of the flexible substrate body respectively; a plane area for reserving the back film and a bending area for removing the back film are formed on one side, opposite to the wiring layer,of the flexible substrate body; a photocuring adhesive film is arranged in the bending area, elasticity modulus of the photocuring adhesive film is smaller than that of the back film. The flexible substrate, the manufacturing method thereof and the display device provided in the embodiment are applied to border narrowing of the display device.

A method and a system for continuously in-line annealing a forwarding ferromagnetic amorphous alloy ribbon in a curved shape to improve its magnetic properties without causing the ribbon to become brittle and which operates at significant high ribbon feeding rates. The amorphous alloy ribbon is fed forward, tensioned and guided along a path at a preset feeding rate and is heated at a point along the path at a rate greater than 103° C. / sec to a temperature to initiate a thermal treatment. Then the ribbon is initially cooled at a rate greater than 103° C. / sec until the thermal treatment ends. During the thermal treatment, a series of mechanical constraints is applied on the ribbon until the amorphous alloy ribbon adopts a specific shape at rest after the thermal treatment is ended. After the initial cooling, the amorphous alloy ribbon is subsequently cooled at a sufficient rate to a temperature that will preserve the specific shape.