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5701 results about "Ceramic substrate" patented technology

Curamik® high temperature/ high voltage substrates consist of pure copper bonded to a ceramic substrate such as Al2O3 (Alumina), AlN (Aluminum Nitride), HPS (ZrO2 doped) or silicon based Si3N4 (Silicon Nitride). curamik provides two technologies to attach the substrate with the copper.

High conducting thin-film nanoprobe card and its fabrication method

A conducting thin-film nanoprobe card fabrication method includes the steps of: (a) arranging nanotubes on a substrate in vertical; (b) covering the nanotubes with a liquid polymeric resin and then hardening the polymeric resin to form a conducting nanomembrane; (c) removing a part of the polymeric resin from the conducting nanomembrane to expose one end of each nanotube to outside; (d) removing the substrate and preparing a ceramic substrate having contacts at one side and metal bumps at the other side and plated through holes electrically respectively connected with the contacts and the metal bumps; (e) mounting the nanomembrane on the ceramic substrate to hold the nanotubes in contact with the contacts of the ceramic substrate, and (f) forming recessed holes in the nanomembrane by etching and inserting a metal rod in each recessed hole to form a respective probe.
Owner:IND TECH RES INST

Copper circuit junction substrate and method of producing the same

A highly reliable copper circuit-joined board that, in mounting a semiconductor element, a lead frame or the like on a ceramic substrate, enables the semiconductor element, the lead frame or the like to be strongly joined to the substrate without breaking or deformation of the substrate found in conventional joining methods, such as brazing and joining using a copper/copper oxide eutectic crystal. Any one of an interposing layer comprising a brazing material layer comprising silver and/or copper as a main component and an active metal or an interposing layer having a two-layer structure comprising a first interposing layer comprising the brazing material layer or a high-melting metallizing layer and a second interposing layer, having a melting point of 1000.degree. C. or below, comprising Ni, Fe, Cu as a main component in that order from the substrate side, is formed on a ceramic substrate, and a conductor layer, comprising copper as a main component, which, in both the lengthwise and widthwise directions, is at least 0.05 mm shorter than the interposing layer, is formed on the interposing layer to prepare a copper circuit-joined board. The copper circuit-joined board may comprise the base board having thereon an outer layer comprising Ni as a main component. A semiconductor element is mounted on the copper circuit-joined board to prepare a semiconductor device.
Owner:SUMITOMO ELECTRIC IND LTD

Gas component sensor for gas oxides

InactiveUS7001495B2Additional sensorExcellent chemical stability and thermal compatibilityWeather/light/corrosion resistanceElectrolytic capacitorsElectrochemical responseGas composition
The present invention is a gas component sensor comprising novel electrolyte compositions. The electrolyte compositions in bulk, sintered or thin film embodiments are capable of forming with different-metal sensing and reference electrodes a highly stable gas oxide sensors. The novel electrolyte composition changes electrochemical reactions at the sensing and reference electrodes and the overall reaction of the electrodes and electrolyte. The novel electrolyte compositions have: (1) excellent chemical stability and thermal compatibility as to the electrodes and a preferred ceramic substrate, (2) excellent chemical stability with the environment as to the reference and sensing electrodes, which need not be sealed against the atmosphere to be sensed, (3) effective adherence to the substrate and electrode metals.
Owner:AIR Q

Light emitting device

A light emitting device includes: a ceramic substrate; a plurality of LED chips; a printed resistor(s) connected in parallel with the plurality of LED chips; a dam resin made of a resin having a low optical transmittance; a fluorescent-material-containing resin layer; and an anode-side electrode and a cathode-side electrode, (a) which are provided on a primary surface of the ceramic substrate so as to face each other along a first direction on the primary surface and (b) which are disposed below at least one of the dam resin and the fluorescent-material-containing resin layer. With the configuration in which a plurality of LEDs, which are connected in a series-parallel connection, are provided on a substrate, it is possible to provide a light emitting device which can achieve restraining of luminance unevenness and an improvement in luminous efficiency.
Owner:HEAVY DUTY LIGHTING LLC
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