470 results about "Thin film circuits" patented technology

An integrated chip package structure and method of manufacturing the same is by adhering dies on a ceramic substrate and forming a thin-film circuit layer on top of the dies and the ceramic substrate. Wherein the thin-film circuit layer has an external circuitry, which is electrically connected to the metal pads of the dies, that extends to a region outside the active surface of the dies for fanning out the metal pads of the dies. Furthermore, a plurality of active devices and an internal circuitry is located on the active surface of the dies. Signal for the active devices are transmitted through the internal circuitry to the external circuitry and from the external circuitry through the internal circuitry back to other active devices. Moreover, the chip package structure allows multiple dies with different functions to be packaged into an integrated package and electrically connecting the dies by the external circuitry.

Surface mount components and related methods of manufacture involve one or more thin film circuits provided between first and second insulating substrates. The thin film circuits may include one or more passive components, including resistors, capacitors, inductors, arrays of one or more passive components, networks or filters of multiple passive components. Such thin film circuit(s) can be sandwiched between first and second insulating substrates with internal conductive pads being exposed between the substrates on end and / or side surfaces of the surface mount component. The exposed conductive pads are then electrically connected to external terminations. The external terminations may include a variety of different materials, including at least one layer of conductive polymer and may be formed as termination stripes, end caps or the like. Optional shield layers may also be provided on top and / or bottom device surfaces to protect the surface mount components from signal interference. For embodiments where one or more thin film circuits are provided between insulating base and cover substrates, such thin film circuit(s) can be formed with conductive pads that extend to and are initially exposed along one or more surfaces of the resultant component. The cover substrate is formed with a plurality of conductive elements (e.g., internal active electrodes, internal anchor electrodes and / or external anchor electrodes) that are designed to generally align with the conductive pads formed on the base substrate such that conductive element portions are exposed in groups along one or more peripheral surfaces of a device. External plated terminations are then formed directly to the exposed portions of the conductive elements.

An integrated chip package structure and method of manufacturing the same is by adhering dies on an organic substrate and forming a thin-film circuit layer on top of the dies and the organic substrate. Wherein the thin-film circuit layer has an external circuitry, which is electrically connected to the metal pads of the dies, that extends to a region outside the active surface of the dies for fanning out the metal pads of the dies. Furthermore, a plurality of active devices and an internal circuitry is located on the active surface of the dies. Signal for the active devices are transmitted through the internal circuitry to the external circuitry and from the external circuitry through the internal circuitry back to other active devices. Moreover, the chip package structure allows multiple dies with different functions to be packaged into an integrated package and electrically connecting the dies by the external circuitry.

The present invention provides a keyboard preventable keycaps from breaking off, which comprises a keyboard main body, and a limit board fixed to the keyboard main body. The keyboard main body comprises a base board, a thin film circuit board mounted on the base board, an elastic body mounted above the thin film circuit board, a scissors structure, and a keycap. The center of the scissors structure is provided with a hollow part. The elastic body is located above the thin film circuit board and in the hollow part at the center of the scissors structure. The keycap is located on the elastic body. The scissors structure is mounted to the keycap and passes through the thin film circuit board to be moveably mounted to the base board. The keycap comprises a top surface and side surfaces connected with the top surface, and the side surface is provided with a locking part extending outwards therefrom. The limit board is provided with a plurality of openings corresponding to keycaps, the keycaps pass through the openings, and the limit board covers the locking parts. The present invention can effectively prevent the keycap from breaking off under an external force. Furthermore, the present invention has a certain dustproof function, has more stable keycaps, is efficient and durable to use, and facilitates miniaturization of the keyboard.

An integrated chip package structure and method of manufacturing the same is by adhering dies on a metal substrate and forming a thin-film circuit layer on top of the dies and the metal substrate. Wherein the thin-film circuit layer has an external circuitry, which is electrically connected to the metal pads of the dies, that extends to a region outside the active surface of the dies for fanning out the metal pads of the dies. Furthermore, a plurality of active devices and an internal circuitry is located on the active surface of the dies. Signal for the active devices are transmitted through the internal circuitry to the external circuitry and from the external circuitry through the internal circuitry back to other active devices. Moreover, the chip package structure allows multiple dies with different functions to be packaged into an integrated package and electrically connecting the dies by the external circuitry.

This invention relates to a functional module structural improvement for expanded and enhanced SIM card comprising of an user identification module and a SIM card; the user identification module is formed by thin film circuit board, the surface is installed with electrical connection points and a control chip, the control chip is built in with: operational interface and functional selection items, application information of the original line number, and more than one sets of new number information, operational interfaces, functional selection items, application information; it can provide the user with more diversified and total functional interface application as well as multi-number selection and usage switching, the convenience and effectiveness of usage can thus be greatly enhanced.

To provide a sheet-shaped organic EL display device having a reduced thickness, an organic EL display device includes a substrate serving as both a protective layer to reduce or prevent permeation of moisture, oxygen, and the like into the inside and a support layer for film formation, a laminate which is provided on a under layer by film formation and which includes a thin film circuit layer carrying an electric circuit and an organic EL light emitting layer carrying an organic EL light emitting element, and an adhesive layer joining the above-described laminate and the above-described substrate. The above-described organic EL light emitting element radiates the emitted light toward the above-described under layer side. In this manner, a low-profile organic EL display device can be provided.

An integrated chip package structure and method of manufacturing the same is by adhering dies on an organic substrate and forming a thin-film circuit layer on top of the dies and the organic substrate. Wherein the thin-film circuit layer has an external circuitry, which is electrically connected to the metal pads of the dies, that extends to a region outside the active surface of the dies for fanning out the metal pads of the dies. Furthermore, a plurality of active devices and an internal circuitry is located on the active surface of the dies. Signal for the active devices are transmitted through the internal circuitry to the external circuitry and from the external circuitry through the internal circuitry back to other active devices. Moreover, the chip package structure allows multiple dies with different functions to be packaged into an integrated package and electrically connecting the dies by the external circuitry.

The present invention aims to manufacture a large size semiconductor device with the inter-substrate transcription technology of thin film circuits. Enlargement is enabled by disposing a plurality of second substrates (21) in a tile shape. As the second substrate (21), a print substrate or flexible print circuit having double-sided wiring or multilayer wiring is employed. The plurality of second substrates (21) is driven independently, and the plurality of second substrates (21) is made to mutually overlap, and a drive circuit (23) is disposed at such overlapping portion. Moreover, the plurality of second substrates (21) is made to mutually overlap, and the mutual circuits are connected at such overlapping portion.

The invention discloses a manufacturing method for a curved surface film circuit based on 3D printing technology. The manufacturing method comprises steps of a, arranging a matrix metal film, arranging a matrix metallic film on a curved surface structure, b, coating photoresist, performing spinning coating of the photoresist on the metal film obtained in the step a, c printing out a masking film board with a circuit microstructure through a 3D printer, d exposing, d performing exposure processing by arranging the masking film board on the curved surface coated with the photoresist, and obtaining the curved surface structure after exposure, e developing images, arranging the curved surface structure in the step d in a developing agent for image development and obtaining the curved surface structure after image development, and f corroding, using a corrodent to corrode the curved surface structure obtained from the step 4 after the masking film board is taken off. The invention can realize the film circuit manufacture in a real sense; the cost is low and the batch production can be realized; and the accuracy is high and the realized curved surface film circuit can be in any curved surface shape.

The keyboard structure fids one base board, one light conductor, one thin film circuit board, one button assembly and one light-emitting assembly. The light conductor is set on the base board, and the thin film circuit board is set on the light conductor. The button assembly is set on the thin film circuit board and has one key cap and one elastic body, which is between the key cap and the thin film circuit board. The light-emitting assembly is near the light conductor and below the thin film circuit board, and the light the light-emitting assembly emits is conducted to the elastic body and the key cap via the light conductor.