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Halogen-free resin composition as well as copper foil substrate and printed circuit board applying same

A halogen resin and composition technology, applied in printed circuit components, circuit substrate materials, etc., can solve environmental pollution and other problems, and achieve good moisture resistance stability, high Tg temperature, and low hygroscopicity

Active Publication Date: 2013-04-03
ELITE MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this manufacturing method must use flame retardants containing halogen (such as bromine), such as tetrabromocyclohexane, hexabromocyclodecane, and 2,4,6-tris(tribromophenoxy)-1 , 3,5-Triazabenzene, and these bromine-containing flame retardants are easy to cause pollution to the environment when the product is manufactured, used, or even recycled or discarded

Method used

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  • Halogen-free resin composition as well as copper foil substrate and printed circuit board applying same
  • Halogen-free resin composition as well as copper foil substrate and printed circuit board applying same
  • Halogen-free resin composition as well as copper foil substrate and printed circuit board applying same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0055] Example 1 (E1)

[0056] A resin composition comprising the following components:

[0057] (A) cyanate ester resin BA-230S of 100 parts by weight;

[0058] (B) the styrene maleic anhydride EF-40 of 50 weight parts;

[0059] (C) 100 parts by weight of polyphenylene ether resin MX-90;

[0060] (D) the maleimide resin BMI-2300 of 100 weight parts;

[0061] (E) 65 parts by weight of the phosphorus nitrogen-based compound SPB-100;

[0062] (F) fused silica (filler) of 125 parts by weight;

[0063] (G) 200 parts by weight of methyl ethyl ketone (solvent);

[0064] (H) 0.01 parts by weight of zinc octoate (catalyst).

Embodiment 2

[0065] Example 2 (E2)

[0066] A resin composition comprising the following components:

[0067] (A) cyanate ester resin BA-230S of 100 parts by weight;

[0068] (B) styrene maleic anhydride EF-40 of 5 weight parts;

[0069] (C) 100 parts by weight of polyphenylene ether resin MX-90;

[0070] (D) the maleimide resin BMI-2300 of 100 weight parts;

[0071] (E) 55 parts by weight of the phosphorus nitrogen-based compound SPB-100;

[0072] (F) fused silica (filler) of 110 parts by weight;

[0073] (G) 170 parts by weight of methyl ethyl ketone (solvent);

[0074] (H) 0.01 parts by weight of zinc octoate (catalyst).

Embodiment 3

[0075] Example 3 (E3)

[0076] A resin composition comprising the following components:

[0077] (A) cyanate ester resin BA-230S of 100 parts by weight;

[0078] (B) the styrene maleic anhydride EF-40 of 50 weight parts;

[0079] (C) polyphenylene ether resin MX-90 of 5 parts by weight;

[0080] (D) the maleimide resin BMI-2300 of 100 weight parts;

[0081] (E) 45 parts by weight of the phosphorus nitrogen-based compound SPB-100;

[0082] (F) fused silica (filler) of 90 parts by weight;

[0083] (G) 130 parts by weight of methyl ethyl ketone (solvent);

[0084] (H) 0.01 parts by weight of zinc octoate (catalyst).

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PUM

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Abstract

The invention provides a halogen-free resin composition which comprises (A) 100 parts of cyanate ester resin, (B) 5-50 parts of styrene maleic anhydride, (C), 5-100 parts of polyphenyl ether resin, (D) 5-100 parts of maleimide resin, (E) 10-150 parts of nitrogenous compound, and (F) 10-1000 parts of inorganic filler. As the composition comprises components in special proportion, the halogen-free resin composition is low in dielectric constant, low in dielectric loss, high in heat resistance and high in flame resistance. The halogen-free resin composition can be prepared as a semi-cured film or a resin film, so that the composition can be applied to a copper foil substrate and a printed circuit board.

Description

technical field [0001] The invention relates to a halogen-free resin composition, in particular to a halogen-free resin composition applied to copper foil substrates and printed circuit boards. Background technique [0002] In response to the world's environmental protection trends and green regulations, Halogen-free is the current environmental protection trend of the global electronics industry. Countries around the world and related electronics manufacturers have successively formulated production schedules for halogen-free electronic products. After the implementation of the European Union's Restriction of Hazardous Substances (RoHS), substances including lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyls and polybrominated diphenyl ethers are no longer used in the manufacture of electronic products or its components. Printed Circuit Board (PCB) is the basis of electronic and electrical products. Halogen-free PCBs are the first priority to be regulate...

Claims

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Application Information

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IPC IPC(8): C08L79/04C08L35/06C08L71/12C08K13/02C08K5/5399C08K3/36H05K1/03
Inventor 余利智李泽安
Owner ELITE MATERIAL
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