831results about How to "Low heat resistance" patented technology

An object of the invention is to provide a method for manufacturing semiconductor devices that are flexible in which elements fabricated using a comparatively low-temperature (less than 500° C.) process are separated from a substrate. After a molybdenum film is formed over a glass substrate, a molybdenum oxide film is formed over the molybdenum film, a nonmetal inorganic film and an organic compound film are stacked over the molybdenum oxide film, and elements fabricated by a comparatively low-temperature (less than 500° C.) process are formed using existing manufacturing equipment for large glass substrates, the elements are separated from the glass substrate.

One feature of the present invention includes first to third steps of holding a voltage, corresponding to a difference between a voltage applied to a first power supply line and a threshold voltage of a first transistor, between both electrodes of first and second storage capacitors; holding a voltage, corresponding to a difference between a voltage applied to the first power supply line and a gate-source voltage of the first transistor, which is necessary to supply a light-emitting element with a current equivalent to a video signal current inputted into a signal line, between both the electrodes of the second storage capacitor; and applying a voltage based on the voltage held in the first and second storage capacitors in the first and second steps to a gate electrode of the first transistor; therefore, a current is supplied to the light-emitting element through the first transistor.

An instrument for fluorometric assays in liquid samples is disclosed. The instrument may include multiple optical channels for monitoring a first fluorophore associated with a target analyte and a second fluorophore associated with a control. The disclosed instrument finds utility in any number of applications, including microfluidic molecular biological assays based on PCR amplification of target nucleic acids and fluorometric assays in general.

The invention provides halogen-free resin composition, and a copper clad laminate and a printed circuit board applying the halogen-free resin composition. The halogen-free resin composition comprises, by weight, (A) 100 parts of epoxy resin, (B) 1 part -100 parts of benzoxazine resin, (C) 1part -100 parts of styrene maleic anhydride, (D) 0.5 part -30 parts of amine curing agents, and (E) 5-150 parts of halogen-free flame retardants. By means of the specified constituents and ration, the halogen-free resin composition achieves the purposes of low dielectric constant, low dielectric loss, high heat resistance, and high flame resistance, can be manufactured into semi-solidified rubber pieces or resin films, and then achieves the purposes of being applied to the copper clad laminate and the printed circuit board.

Disclosed is a photo-curable composition comprising the following components (A) to (C): (A) hydrolyzable silane compound represented by the general formula (1) or a hydrolyzate thereof: (R1)pSi(X)4-p (1) wherein R1 is a non-hydrolyzable organic group having 1 to 12 carbon atoms, X is a hydrolyzable group, and p is an integer of 0 to 3; (B) photo acid generator; and (C) dehydrating agent. By such constitution, it is possible to provide a photo-curable composition which has a rapid photo-curable rate, is excellent in characteristics such as storage stability, heat resistance, weather-ability, scratch resistance and the like, and is applicable to base materials having low heat resistance such as plastics, as well as a cured product obtained therefrom.

A glass pattern that can be used for a substrate provided with a material having low heat resistance and has increased productivity is provided. Further, a sealed body having high hermeticity and increased productivity is provided. Furthermore, a light-emitting device with high reliability including such a sealed body is provided. A glass sheet is used for a main portion of a glass pattern such as a straight line portion and a curved portion. In a joint portion of two glass sheets arranged in the corner portion, the straight line portion, or the like of the glass pattern, a frit paste is provided in contact with the glass sheets and is locally heated to remove the binder from the frit paste and to form a glass layer; thus, the glass sheets are fused to each other without any space provided therebetween.

The invention provides a halogen-free resin composition which comprises (A) 100 parts of cyanate ester resin, (B) 5-50 parts of styrene maleic anhydride, (C), 5-100 parts of polyphenyl ether resin, (D) 5-100 parts of maleimide resin, (E) 10-150 parts of nitrogenous compound, and (F) 10-1000 parts of inorganic filler. As the composition comprises components in special proportion, the halogen-free resin composition is low in dielectric constant, low in dielectric loss, high in heat resistance and high in flame resistance. The halogen-free resin composition can be prepared as a semi-cured film or a resin film, so that the composition can be applied to a copper foil substrate and a printed circuit board.

An SOI substrate having a single crystal semiconductor layer with high surface planarity is manufactured. A semiconductor substrate is doped with hydrogen, whereby a damaged region which contains large quantity of hydrogen is formed. After a single crystal semiconductor substrate and a supporting substrate are bonded together, the semiconductor substrate is heated, whereby the single crystal semiconductor substrate is separated in the damaged region. While a heated high-purity nitrogen gas is sprayed on a separation plane of the single crystal semiconductor layer separated from the single crystal semiconductor substrate, laser beam irradiation is performed. By irradiation with a laser beam, the single crystal semiconductor layer is melted, whereby planarity of the surface of the single crystal semiconductor layer is improved and re-single-crystallization is performed.

The invention relates to a heat-resistant aluminum-alloy conductor material for cables and a manufacture method thereof. The aluminum-alloy conductor material is prepared from the following components in percentage by weight: 0.3-1.0 percent of Fe, 0.01-0.3 percent of Cu, 0.01-0.3 percent of Mg, 0.01-0.3 percent of one, two or three of Mg, Ca, Mo and Sb and 0.05-0.8 percent of one or more rear-earth elements of Sc, Y and Er, not larger than 0.1 percent of Si, not larger than 0.15 percent of other impurities and the balance of Al. The aluminum-alloy conductor material has excellent conductivity, tensile performance, flexible performance and excellent heat resistance, can be used as insulated cable cores of wires and cables and is particularly suitable for overhead insulated conductor wire cores.

A modacrylic shrinkable fiber according to the present invention is containing a polymer composition obtained by mixing 50 to 99 parts by weight of a polymer (A) containing 40 wt % to 80 wt % of acrylonitrile, 20 wt % to 60 wt % of a halogen-ontaining monomer and 0 wt % to 5 wt % of a sulfonic-acid-containing monomer, and 1 to 50 parts by weight of a polymer (B) containing 5 wt % to 70 wt % of acrylonitrile, 20 wt % to 94 wt % of an acrylic ester and 1 wt % to 40 wt % of a sulfonic-acid-containing monomer containing a methallylsulfonic acid or metal salts thereof or amine salts thereof, in which a total amount of the polymer (A) and the polymer (B) is 100 parts by weight. In this way, a modacrylic shrinkable fiber that has a favorable color development property after dyeing and a high shrinkage ratio even after dyeing is obtained.

A cylindrical steam reforming unit comprising a plurality of cylindrical bodies consisting of a first cylindrical body, a second cylindrical body and a third cylindrical body of successively increasing diameters disposed in a concentric spaced relation, a radiation cylinder disposed within and concentrically with the first cylindrical body, a burner disposed in the radial central portion of the radiation cylinder, and a reforming catalyst layer with a reforming catalyst filled in a gap between the first and second cylindrical bodies, wherein a CO shift catalyst layer and a CO removal catalyst layer are disposed in a gap between the second and third cylindrical bodies, the CO shift catalyst layer being formed in a gap with the direction of flow reversed at one axial end of the reforming catalyst layer and through a heat recovery layer of predetermined length. According to this reforming unit, without internally disposing a heat insulation layer, a cooling mechanism or the like, the reforming catalyst layer, CO shift catalyst layer, and CO removal catalyst layer can be integrated, achieving various useful effects, including size and weight reductions and the shortening of startup time.

A structure of a color filter is provided. The color filter structure includes a substrate, in which a number of first pixel regions, a number of second pixel regions, and a number of third pixel regions are defined on the substrate. Each first pixel region includes a first stack layer; each second pixel region includes a second stack layer; and each third pixel region includes the first stack layer and the second stack layer.

An anti-electrostatic rubber plate (desk pad and floor mattress) and its production are disclosed. The anti-electrostatic rubber plate consists of anti-electrostatic layer and conducting layer. It is prepared by preparing anti-electrostatic layer, preparing conducting layer film and vulcanizing to obtain final product.

The invention relates to a low-viscosity and high-heat conduction epoxy resin electronic potting adhesive which is formed by mixing a component A with an amine curing agent according to the weight ratio of 100:5-12, wherein the component A comprises the following raw materials in weight ratio: 70-85 parts of spherical alumina powder, 10-20 parts of epoxy resin, 2-4 parts of active thinner, 2.5-5 parts of toughening agent and 0.1-0.5 parts of coupling agent. The invention has the advantages that the spherical alumina of the potting adhesive has higher filling amount compared with non-spherical alumina, the viscosity is less affected, the fluidity is favorable and the construction is convenient; the potting adhesive has good dispersibility and is difficult to sedimentate; a condensate has high heat conductivity and can quickly dissipate accumulated heat of heating parts and components; a high-filling filler can reduce a thermal expansion coefficient and a volumetric shrinkage rate and is very suitable for potting parts and components; and the price is cheaper compared with boron nitride and aluminum nitride, and the cost is low.

A tetrafluoroethylene copolymer comprising 30 to 81 mole % of tetrafluoroethylene and a 70 to 19 mole % of at least one other monomer, and having terminal carbonate groups at polymer chain ends, which has a melt flow rate of 0.1 to 100 g/10 min. at 200.degree. C. under a load of 5 kg, and a melting point of 90 to 200.degree. C., a laminate comprising a layer of the above tetrafluoroethylene copolymer, and a layer of other material, and a surface film or a transparent filler material for a solar cell, which comprises the above tetrafluoroethylene copolymer is disclosed. The fluororesin can be firmly adhered directly to other materials such as resins, metals, glass, crystalline silicon, polycrystalline silicon and amorphous silicon, while maintaining characteristics such as chemical resistance, solvent resistance, non-tackiness, electrical insulation properties, stain-proofing properties and flame retardance. The fluororesin can also be molded at a lower temperature than conventional fluororesins, and thus can be heat bonded or co-extruded with general purpose resins having low heat resistance.

The invention discloses a colorless and transparent polyimide resin material. 1,2,3,4-cyclohexanetetracarboxylic dianhydride is chosen as dianhydride monomer or comonomer to carry out polycondensation reaction with primary diamine, so that the polyimide resin material is prepared. Because the 1,2,3,4-cyclohexanetetracarboxylic dianhydride comonomer has a distorted molecular structure, a large free volume exists between polymer molecular chains, and thereby the formation of charge transfer complex (CTC) in and between polyimide molecules is inhibited; and meanwhile, because of the introductionof a lipid structure, the electron-stimulated transition mode in the polyimide molecular chains is changed, the absorption of the aromatic polyimide in the visible light region is remarkably weakened, and thereby the transparency of the polymer is greatly increased. The ultraviolet light transmission cutoff wavelength of a produced polyimide film is 280nm to 380nm, the light transmissivity at 450nm is 86 to 94 percent, moreover, the glass-transition temperature is 250 DEG C to 400 DEG C, and the polyimide resin material has a good application prospect in the fields of flexible substrate materials for solar cells, flexible transparent conducting film substrate materials, liquid crystal display materials and the like.

The invention provides a phosphorus-containing flame retardant composition, including: a hypophosphite compound, a DOPO derivative and a polyphosphazene compound. The composition as a flame retardant can play a synergistic effect of several phosphorus-containing compounds, realizes halogen-free flame retardance under small addition amount and reaches level V-0. The invention also provides a contains a polyphenyl ether resin composition containing the above phosphorus-containing flame retardant compositions and a prepreg and a copper clad laminated board prepared from the same. After curing, the polyphenyl ether resin composition achieves flame retardance of V-0 grade under the condition to which the halogen flame retardant does not apply and keeps good dielectric property and heat resistance of polyphenyl ether resin; the prepreg and copper clad laminated board made from the composition have good dielectric property and heat resistance, and realize halogen-free flame retardance to UL 94-V0 grade while ensuring excellent heat resistance and dielectric property; and the composition is applicable to the field of high speed and high frequency printed circuit board, and is in line with the future requirements of green and environmental protection.

A polymer film substrate is irradiated with ions to make a large number of nano-sized through-holes and the substrate is further irradiated with an ionizing radiation so that a functional monomer is grafted or co-grafted onto a surface of the film and within the holes; in addition, the sulfonic acid group is introduced into the graft chains, thereby producing a polymer ion-exchange membrane that has high oxidation resistance, dimensional stability, electrical conductivity and methanol resistance, as well as an ion-exchange capacity controlled over a wide range.

A light emitting diode (LED) device includes a stacked epitaxial structure, a heat-conductive plate and a seed layer. The stacked epitaxial structure sequentially includes a first semiconductor layer (N—GaN), a light emitting layer, and a second semiconductor layer (P—GaN). The heat-conductive plate is disposed on the first semiconductor layer, and the seed layer is disposed between the first semiconductor layer and the heat-conductive plate. Also, the present invention discloses a manufacturing method thereof including the steps of: forming at least one temporary substrate, which is made by a curable polymer material, on an LED device, and forming at least a heat-conductive plate on the LED device.

Rare-earth alloy is cast into a sheet (6) or the like by using a tundish (3, 13). The refractory material of the tundish used for casting does not necessitate preheating for improving the flowability of the melt (2). The refractory material used essentially consists of 70 wt % or more of Al2O3 and 30 wt % or less of SiO2, or 70 wt % or more of ZrO2 and 30 wt % or less of one or more of Y2O3, Ce2O3, CaO, MgO, Al2O3, TiO2 and SiO2. The refractory material has 1 g/cm3 or less of bulk density, has 0.5 kca/(mh° C.) or less of thermal conductivity in the temperature range of from 1200 to 1400° C., and has 0.5 wt % or less of ratio of ignition weight-loss under the heating condition of 1400° C. for 1 hour.