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Low-viscosity and high-heat conduction epoxy resin electronic potting adhesive

An epoxy resin, high thermal conductivity technology, applied in the field of potting glue, can solve the problems of increasing glue viscosity, affecting processing performance, affecting mechanical properties, etc., to reduce thermal expansion coefficient, reduce volume shrinkage, and reduce the impact of viscosity. Effect

Inactive Publication Date: 2011-02-16
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, high filling will lead to negative effects, such as a serious increase in the viscosity of the glue and a decrease in fluidity, which will affect the processing performance; in addition, the mechanical properties will also be affected

Method used

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  • Low-viscosity and high-heat conduction epoxy resin electronic potting adhesive

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] 70 parts of spherical alumina powder (domestic average particle size is 40 μm), 15 parts of bisphenol A epoxy resin, 5 parts of bisphenol F epoxy resin, 3.7 parts of allyl glycidyl ether, hydroxyl-terminated liquid nitrile rubber 5 parts, 0.5 parts of phenyltrimethoxysilane, 0.3 parts of carbon black, 0.5 parts of stearate, stirred evenly at room temperature to obtain component A; the weight ratio of polyamide 300 and polyetheramine D-400 is 1: 1 amine curing agent. Component A and amine curing agent were mixed in a weight ratio of 100:12, stirred evenly at room temperature, and the viscosity was measured; the mixture was cured at 25°C for 24 hours, and the thermal conductivity of the cured product was measured.

Embodiment 2

[0035] 75 parts of spherical alumina powder (domestic average particle size is 40 μm), 14 parts of bisphenol A epoxy resin, 3.5 parts of bisphenol F epoxy resin, 2.9 parts of n-butyl glycidyl ether, hydroxyl-terminated liquid nitrile rubber 3.7 parts, 0.3 parts of phenyltrimethoxysilane, 0.3 parts of carbon black, 0.3 parts of stearate, stirred evenly at room temperature to obtain component A; the weight ratio of polyamide 651 and polyetheramine D-400 is 1: 1 amine curing agent. Component A and amine curing agent were mixed in a weight ratio of 100:9.8, stirred evenly at room temperature, and the viscosity was measured; the mixture was cured at 25°C for 36 hours, and the thermal conductivity of the cured product was measured.

Embodiment 3

[0037] 80 parts of spherical alumina powder (domestic average particle size is 40 μm), 11 parts of bisphenol A epoxy resin, 3 parts of bisphenol F epoxy resin, 2.3 parts of phenyl glycidyl ether, 3 parts of hydroxyl-terminated liquid nitrile rubber 0.2 parts, 0.2 parts of phenyltrimethoxysilane, 0.3 parts of carbon black, 0.2 parts of stearate, stirred at room temperature to obtain component A; D-400 amine curing agent. Component A and amine curing agent were mixed in a weight ratio of 100:7.7, stirred evenly at room temperature, and the viscosity was measured; the mixture was cured at 25°C for 48 hours, and the thermal conductivity of the cured product was measured.

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Abstract

The invention relates to a low-viscosity and high-heat conduction epoxy resin electronic potting adhesive which is formed by mixing a component A with an amine curing agent according to the weight ratio of 100:5-12, wherein the component A comprises the following raw materials in weight ratio: 70-85 parts of spherical alumina powder, 10-20 parts of epoxy resin, 2-4 parts of active thinner, 2.5-5 parts of toughening agent and 0.1-0.5 parts of coupling agent. The invention has the advantages that the spherical alumina of the potting adhesive has higher filling amount compared with non-spherical alumina, the viscosity is less affected, the fluidity is favorable and the construction is convenient; the potting adhesive has good dispersibility and is difficult to sedimentate; a condensate has high heat conductivity and can quickly dissipate accumulated heat of heating parts and components; a high-filling filler can reduce a thermal expansion coefficient and a volumetric shrinkage rate and is very suitable for potting parts and components; and the price is cheaper compared with boron nitride and aluminum nitride, and the cost is low.

Description

technical field [0001] The invention relates to a potting glue, in particular to an epoxy resin electronic potting glue with low viscosity and high thermal conductivity, and belongs to the technical field of potting glue. Background technique [0002] Thermally conductive adhesives are mostly used for bonding and packaging of electronic and electrical components in electrical insulation applications. With the development of integrated circuits and assembly technology in the electronics industry, the volume of electronic components and logic circuits tends to be miniaturized, and their development towards multi-functionalization and integration will inevitably result in a substantial increase in heat generation, which is harmful to bonding and The thermal conductivity of packaging materials puts forward very high requirements, so improving thermal conductivity is an increasingly urgent problem. [0003] There are two ways to improve the thermal conductivity of polymers: 1. S...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J11/06C09J163/02C09J11/08C09J11/04C09J163/00C09J163/04C09K3/10
Inventor 林荣杏王建斌陈田安
Owner YANTAI DARBOND TECH
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