The invention provides a halogen-free flame-retardant environment-friendly epoxy electronic encapsulating material. The encapsulating material mainly comprises epoxy resin, microsilica, a curing agent, 2-methylimidazole, a halogen-free flame retardant, a leveling agent, a pigment and cupric oxalate in a weight ratio of 40-43:40-42:5:0.2:3-4:1:2:2.8. The encapsulating material has characteristics of good flame retardance, moisture proofness and laser developing effects. The encapsulating material is free of lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls and polybromodiphenyl ether which are the six toxic and harmful compounds forbidden by directives of the European Union, and meets the newest international halogen-free antimony-free environment protection requirements of the European Union, the International Electrotechnical Commission and the Interconnecting and Packaging Electronic Circuits. The encapsulating material has excellent flame retardance, electric properties, mechanical properties, resistance to temperature shock, and good process using properties, plays roles of moisture proofness, insulation, mechanical protection, and the like, and reaches the level of similar products at abroad.