1727 results about "Silicone tape" patented technology

A flame retardant, intumescent pressure sensitive adhesive (PSA) composition for EMI shielding gaskets, tapes, wraps, and the like. The composition is formulated as an admixture of: (a) a PSA component; (b) a halogenated first flame retardant component; (c) a metal-based second flame retardant component; and (d) a filler component of expandable, intercalated graphite particles. In a representative embodiment the PSA component (a) is acrylic-based, the halogenated first flame retardant component (b) is a polybrominated diphenyl compound such as decabromodiphenyl oxide or decabromodiphenyl ether, the metal oxide-based second flame retardant component (c) is antimony oxide, antimony trioxide, or antimony pentoxide, and the filler component (d) is graphite flake.

A duct tape and a method of making a duct tape having a customized, printed design on a surface of the duct tape. The method comprises providing a design for printing on the duct tape, digitally printing the design on the surface of the duct tape, and curing the ink printed on the duct tape with ultraviolet light in dual stages. The method further comprises applying on the digitally printed duct tape a material or composition having overcoat properties, release properties, or a combination thereof.

The present invention resides in self adhesive hair extensions and a method of attaching then to the head of a wearer. The self adhesive hair extensions comprise a plurality of either natural or synthetic hair strands attached to a base support unit comprising a strip of woven material or hair attachment weave or welt at one end. A fastener comprising a self adhesive tape portion and removable backing is sewn or otherwise secured by stitching it to the hair extensions in order to prevent the adhesive tape from being separated or repositioned during use. The method of use comprises separating a user's hair along a part line into an upper portion and a lower portion wherein the upper portion is temporarily swept up and away from the part line. The backing is removed from the adhesive hair fastener exposing the removable self adhesive tape, said self adhesive tape is applied to the scalp or back of the head of user.

An adhesive sheet for a semiconductor connecting substrate consisting of a laminate having an adhesive layer on a substrate, wherein said adhesive layer contains a thermoplastic resin (A) and an epoxy resin (B) and said epoxy resin (B) contains at least one epoxy resin (B) selected from (I) dicyclopentadiene skeleton-containing epoxy resins, (II) terpene skeleton-containing epoxy resins, (III) biphenyl skeleton-containing epoxy resins and (IV) naphthalene skeleton-containing epoxy resins as an essential component; an adhesive-backed tape for TAB consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 60 to 110° C. after having been cured and 50 hours or more in the insulation resistance dropping time after having been allowed to stand in an environment of 130° C. and 85% RH with DC 100 V applied; and a tape with adhesive for wire bonding connection consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 120 to 170° C. after having been cured, a storage elastic modulus E' of 20 to 100 MPa at 150° C. and an insulation resistance dropping time of 50 hours or more after having been allowed to stand in an environment of 130° C. and 85% RH with DC 100 V applied. The adhesive sheet for a semiconductor connecting substrate, the adhesive-backed tape for TAB and the adhesive-backed tape for wire bonding connection of the present invention are excellent in adhesive strength, insulatability, dimensional accuracy, etc., and can improve the reliability of a semiconductor integrated circuit connecting substrate and a semiconductor device respectively for high density packaging.

A dicing and die bonding tape, comprising a substrate 1, a pressure sensitive adhesive layer (A) 2 superimposed on the substrate 1, a substrate 3 superimposed on the pressure sensitive adhesive layer (A) 2, a pressure sensitive adhesive layer (B) 4 superimposed on the substrate 3, and an adhesive layer 5 super imposed on the pressure sensitive adhesive layer (B) 4, said dicing and die bonding tape having an adhesion strength between the pressure sensitive adhesive layer (A) 2 and a dicing flame of 0.6 N / 25 mm or larger, and an adhesion strength between the pressure sensitive adhesive layer (B) 4 and the adhesive layer 5 of from 0.05 to 0.5 N / 25 mm.

The invention relates to a nonwoven gown made of a gown body terminating in two edges at a back of the gown. The gown contains a closure member that extends around the gown body and terminates at each edge. Manipulation of the closure member moves at least one of the edges toward the other thereby closing the back of the gown. A fastener located along at least a portion of at least one of the edges may be provided. Some suitable fasteners include tape, hook and loop type fasteners, and / or snaps. Such a gown enables a wearer to close and secure the gown by himself while keeping his hands sterile.

The invention belongs to the field of adhesive tapes and particularly relates to a removable hot-melt pressure-sensitive adhesive tape for temporary fixation. The removable hot-melt pressure-sensitive adhesive tape for the temporary fixation comprises a base material and a hot-melt pressure-sensitive adhesive which is hot-molten and coated on the base material, and is characterized in that the hot-melt pressure-sensitive adhesive consists of the following components in percentage by mass: 40 to 60 percent of thermoplastic rubber, 20 to 40 percent of tackifying resin, 2 to 16 percent of plasticizers and 0.1 to 4 percent of antioxidant and other aids. The tackifying resin is added when the hot-melt pressure-sensitive adhesive tape is prepared, so that the adhesion is improved, and the viscosity of the system is reduced to ensure that the coating is convenient; a plurality of kinds of plasticizers are added, so that soft segment phases (B, I, EB and EP) and a hard segment phase (PS) in elastomer rubber are softened and plasticized, and the affine application property of an adhesive tape product is improved; by using the antioxidant, an adhesive is prevented from pyrolysing and deteriorating in the heating process, so that the adhesion of an adhesive product is stable, the adhesive product can be peeled at high and low rates and can be repeatedly pasted, and the trace of adhesive residue is avoided; and a heating and molten coating process is adopted, so that the release of a volatile organic solvent and the high-temperature energy consumption of an end-of-life process are avoided, and the cost of materials is reduced.

The invention discloses a thermal viscosity loss pressure-sensitive adhesive, which is prepared from the following ingredients in percentage by weight: 20.0 percent to 40.0 percent of macromolecular polymethacrylate, 69.5 percent to 38.5 percent of an organic solvent, 0.50 percent to 1.50 percent of a curing agent and 10.0 percent to 20.0 percent of a thermal expansion additive, wherein the weight percentage of solid content in the thermal viscosity loss pressure-sensitive adhesive is 20 percent to 40 percent. The invention also discloses a thermally peelable adhesive tape and a preparation method of the thermally peelable adhesive tape. When the thermally peelable adhesive tape is adhered onto an adhered object and is heated to foam so that micro spheres expand, the viscosity of a thermal viscosity loss pressure-sensitive adhesive layer is greatly reduced. When the thermally peelable adhesive tape is applied for temporary fixation in electronic devices, the damage of elements can be effectively prevented, and the product yield is improved.

Provided is a double-sided pressure-sensitive adhesive tape for fixing a flexible printed circuit board superior in adhesive power after bonding under low pressure and also in repelling resistance after processing in high-temperature steps. The double sided pressure-sensitive adhesive tape for fixing a flexible printed circuit board according to the present invention has a 180° peel adhesion, as determined by bonding the adhesive tape onto a stainless steel plate under pressure by one reciprocation of a 10-g roller, leaving it still for 5 minutes and measuring it at a tensile speed of 300 mm / minute, of 6.5 N / 20 mm or more and a terminal separation distance after reflow of 2.5 mm or less.

The invention discloses a high-performance repairing adhesive tape for a photovoltaic module back panel. The high-performance repairing adhesive tape comprises a base material layer, a functional adhesive layer and a release material layer which are arranged in sequence from top to bottom, wherein the base material layer is composed of a polyester thin film type material; the functional adhesive layer is composed of a high-weather-resistance adhesive. According to the high-performance repairing adhesive tape for the photovoltaic module back panel and the preparation method, disclosed by the invention, the weather-resistance base material layer is selected so that the effects of water resistance, insulation, ultraviolet radiation resistance and the like can be realized and the effect of anindependent back panel is realized; the high-weather-resistance adhesive is selected for the functional adhesive layer, so that the weather resistance, high temperature resistance and yellowing resistance of the adhesive tape can be improved; the adhesive tape has great bonding strength and is not easy to fall off; meanwhile, the adhesive tape is convenient to stick and convenient to construct.

The invention discloses a detection method for an adhesive tape on paper money. The detection method comprises the following steps: extracting thickness detection data of each channel thickness sensor one by one when paper money is detected; adopting the mean of the thickness detection data of each channel as the threshold value of the channel, and initially detecting the adhesive tape area and the non-adhesive tape area; as for the channel in which a suspected adhesive tape area is detected, conducting edge detection according to the set edge detection threshold value so as to determine the start-stop position of the suspected adhesive tape area, and determining the suspected adhesive tape area and the non-adhesive tape area according to the start-stop position of the suspected adhesive tape area; using the thickness mean of the suspected adhesive tape area to subtract the thickness mean of the non-adhesive tape area to obtain the thickness of the calculated adhesive tape; determining that an adhesive tape is stuck in the suspected adhesive tape area of the paper money when the thickness value of the calculated adhesive tape is greater than the set thickness value. The detection method is low in misjudgment rate, simple in algorithm and capable of accurately judging the specific position of the adhesive tape.

Film-forming means are coextruded to form all plastic multilayer liners and facestocks for pressure-sensitive labels, tapes, decals, signs, bumper stickers, and other products formed from sheet and roll stock. Fill means in a charge for the liner coextrusion affects stiffness and dimensional stability of the liner and / or affects the roughness of a liner face or faces. The film materials of the layers of the constructions are selected according to the cost / benefit characteristics of candidate materials considering the functional or operational requirements of the layer in question.