The present invention relates to a method of making supports for light emitting diodes, wherein rigid substrates are used as supports for light emitting diodes, it being proposed, in particular, to render the substrates more fragile in order to make certain zones of a lower layer of the said substrate more flexible so that the substrate is able to deform in the region of the zones thus made flexible, the deformation then taking place without causing the electrical conduction of a top layer, on which the diodes are disposed, to be broken. In one particular embodiment of the invention it is proposed to provide as many rigid substrate plates as there are support planes in the three-dimensional environment, and to connect these various substrate plates together by means of deformable conductive components disposed in accordance with surface mounted component technology.