Removable hot-melt pressure-sensitive adhesive tape for temporary fixation
A technology of melting pressure-sensitive tape and hot-melt pressure-sensitive adhesive, which is applied in the field of removable temporary fixing hot-melt pressure-sensitive tape, which can solve the problems of high temperature, high energy consumption and pollution in the later process, and achieve improved affinity application Good performance, easy coating and processing, and stable adhesive performance
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
specific Embodiment 1
[0031] Prepare materials SIS D1161 70kg, SBS D1118 30kg, C5 tackifying petroleum resin 40kg, antioxidant and other additives 1.67kg, add in a mixer, pulverize and stir at room temperature for 30min, then control the temperature of the material at about 170°C to melt, add 10kg of solid terpene tackifying resin, 15kg of naphthenic oil 4010 (that is, rubber naphthenic naphthenic oil), melted and stirred for 40 minutes under a certain vacuum degree and discharged. Coat the surface of the paper substrate by a hot-melt coater to form a tape product with a thickness of 75 μm. In this embodiment, the mass percentage of thermoplastic rubber is 60%, the tackifying resin is 30%, the plasticizer is 9%, and the antioxidant and other additives are 1%.
[0032] The test results of relevant mechanical properties are as follows: 1. The initial adhesion force (ring initial adhesion method) is about 9N; Around 12N (adhesive layer thickness 40μm); 3. According to GB-T4851-1998 pressure-sensitive...
specific Embodiment 2
[0034]Prepare materials: SIS 1209 50kg, SBS YH792 50kg, C9 petroleum resin 60kg, antioxidant and other additives 6kg, add to the mixer, grind and stir at room temperature for 30min, then control the temperature of the material at about 170°C to melt, add liquid to increase viscosity Resin Eastman 2520 10kg, naphthenic oil 4010 24kg, melt and stir for 40min under a certain vacuum degree and discharge. It is coated on a plastic film substrate by a hot-melt coater to form a tape product with a thickness of 70 μm. In this embodiment, the mass percentage of thermoplastic rubber is 50%, the tackifying resin is 35%, the plasticizer is 12%, and the antioxidant and other additives are 3%.
[0035] The test results of relevant mechanical properties are as follows: 1. The initial adhesion force (ring initial adhesion method) is about 12N; 2. According to GB-T2792-1998, when the sample strip width is 25mm, the 180° peeling force of the pressure-sensitive adhesive About 15N (adhesive laye...
specific Embodiment 3
[0037] Prepare materials: SEBS Yuehua YH501 50kg, SEPS kratonG1730 50kg, C9 petroleum resin 80kg, antioxidant and other additives 10kg, add to the mixer, pulverize and stir at room temperature for 30min, then control the temperature of the material at about 170°C to melt, add liquid Tackifying resin Eastman 2520 20kg, DOP 40kg, melted and stirred under a certain vacuum for 40min to discharge. It is coated on a plastic film substrate by a hot-melt coater to form a tape product with a thickness of 90 μm. In this embodiment, the mass percentage of thermoplastic rubber is 40%, the tackifying resin is 40%, the plasticizer is 16%, and the antioxidant and other additives are 4%.
[0038] The test results of relevant mechanical properties are as follows: 1. The initial adhesion force (circular initial adhesion method) is about 16N; 2. According to GB-T2792-1998, when the sample strip width is 25mm, the 180° peeling force of the pressure-sensitive adhesive About 18N (adhesive layer th...
PUM
Property | Measurement | Unit |
---|---|---|
Peel force | aaaaa | aaaaa |
Melt index | aaaaa | aaaaa |
Peel force | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com