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Two-step all-component recycling method of waste circuit boards

A technology for waste circuit boards and components, applied in plastic recycling, electronic waste recycling, recycling technology and other directions, can solve the problem of not being able to achieve full component recovery of waste circuit boards, and achieve the recyclability of solvents and catalysts. Strong operability, no secondary pollution effect

Inactive Publication Date: 2020-02-07
SHANXI INST OF COAL CHEM CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Aiming at the problem that the existing high-temperature pyrolysis method, supercritical fluid technology and mechanical treatment method cannot realize the full component recovery of waste circuit boards, the present invention provides a two-step method for full component recovery of waste circuit boards

Method used

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  • Two-step all-component recycling method of waste circuit boards
  • Two-step all-component recycling method of waste circuit boards

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Step 1, waste and old circuit board is cut to 1cm, adds dichloromethane (the mass ratio of waste and old circuit board and methylene chloride is 1:20) the epoxy resin-glass fiber composite material in the circuit board substrate is swelled, at 0 Swelling at ℃ for 72 hours makes the epoxy resin-glass fiber composite material swell and fluffy, and at the same time, makes the interface between the epoxy resin-glass fiber composite material and the copper foil of the circuit board substrate partly separated.

[0027] Step 2, immerse the swollen circuit board substrate in AlCl with a catalyst mass fraction of 10% 3 -Acetic acid system, degraded at 180°C for 8h, degraded the epoxy resin-glass fiber composite material, degraded the epoxy resin into soluble oligomers, and dissolved the epoxy resin oligomers by acetone (epoxy resin oligomers The mass ratio to acetone is 1:50), which can recycle glass fiber, polybrominated biphenyls, copper foil and other metal components in wast...

Embodiment 2

[0029] Step 1, cut the waste circuit board to 0.5m, add chloroform (the mass ratio of waste circuit board and chloroform is 1:1) to swell the epoxy resin-glass fiber composite material in the circuit board substrate, and swell at 50°C After 48 hours, the epoxy resin-glass fiber composite material is swollen and fluffy, and at the same time, the interface between the epoxy resin-glass fiber composite material and the copper foil of the circuit board substrate is partially separated.

[0030] Step 2, immerse the swollen circuit board substrate in FeCl with a mass fraction of catalyst of 20% 3 -Formic acid system, degraded at 200°C for 12h, degraded the epoxy resin-glass fiber composite material, degraded the epoxy resin into soluble oligomers, and dissolved the epoxy resin oligomers by tetrahydrofuran (epoxy resin oligomers The mass ratio to THF is 1:80), which can recycle glass fiber, polybrominated biphenyls, copper foil and other metal components in waste circuit boards.

Embodiment 3

[0032]Step 1, cut the waste circuit board to 1m, add toluene (the mass ratio of waste circuit board and toluene is 1:60) to swell the epoxy resin-glass fiber composite material in the circuit board substrate, and swell at 100°C for 36h , so that the epoxy resin-glass fiber composite material is swollen and fluffy, and at the same time, the interface between the epoxy resin-glass fiber composite material and the copper foil of the circuit board substrate is partially separated.

[0033] Step 2, immerse the swollen circuit board substrate in a toluenesulfonic acid-acetic acid system with a catalyst mass fraction of 1%, and degrade it at 250°C for 30 minutes to degrade the epoxy resin-glass fiber composite material, and the epoxy resin is degraded into a low-soluble Polymers, dissolving epoxy resin oligomers by N,N-dimethylformamide (the mass ratio of epoxy resin oligomers and N,N-dimethylformamide is 1:100), which can recycle waste Glass fiber, polybrominated biphenyls, copper f...

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Abstract

The invention belongs to the field of recycling and resource recovery of electronic solid wastes and particularly relates to a two-step all-component recycling method of waste circuit boards. The method includes the steps that (1) the waste circuit boards are cut, a non-proton organic swelling agent is added so that epoxy resin-glass fiber composite materials in substrates of the circuit boards can be subjected to swelling, the epoxy resin-glass fiber composite materials are swelled and become fluffy, and meanwhile the interface portions between the epoxy resin-glass fiber composite materialsand copper foils on copper-clad plates are separated; and (2) the swelled circuit board substrates are immersed in a proper catalyst-solvent system, then the epoxy resin-glass fiber composite materials are degraded, the epoxy resins are degraded into soluble low polymers, the epoxy resin low polymers are dissolved through the non-proton organic solvent, and glass fibers, polybrominated biphenyls,the copper foils and other metal components in the waste circuit boards can be recycled. By means of the two-step all-component recycling method of the waste circuit boards, all-component recycling ofthe waste circuit boards is achieved.

Description

technical field [0001] The invention belongs to the field of recycling and resource utilization of electronic solid waste, and in particular relates to a two-step method for recovering waste circuit boards with all components. Background technique [0002] Printed circuit board (PCB for short) is the core component of electronic and electrical products, mainly composed of copper foil substrate, conductive graphics and electronic components. The copper foil substrate is the substrate of the circuit board, which is made of copper foil, resin adhesive, glass fiber cloth, etc. under high temperature conditions. At present, the resin adhesive in the manufacture of copper foil substrates mostly uses brominated epoxy resin or Phenolic Resin. Since the 1950s, circuit boards have been gradually used in various electronic products, and the application field has gradually changed from military industry to civilian use, prompting the rapid development of the electronics industry. Howe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29B17/02B09B3/00C22B7/00
CPCB29B17/02C22B7/00B09B3/40Y02P10/20Y02W30/62Y02W30/82
Inventor 王玉琪侯相林田梓赏王英雄
Owner SHANXI INST OF COAL CHEM CHINESE ACAD OF SCI
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