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19306results about "Edge grinding machines" patented technology

Apparatus for obtaining information for a structure using spectrally-encoded endoscopy teachniques and methods for producing one or more optical arrangements

Exemplary apparatus for obtaining information for a structure can be provided. For example, the exemplary apparatus can include at least one first optical fiber arrangement which is configured to transceive at least one first electromagnetic radiation, and can include at least one fiber. The exemplary apparatus can also include at least one second focusing arrangement in optical communication with the optical fiber arrangement. The second arrangement can be configured to focus and provide there through the first electromagnetic radiation. Further, the exemplary apparatus can include at least one third dispersive arrangement which is configured to receive a particular radiation which is the first electromagnetic radiation and/or the focused electromagnetic radiation, and forward a dispersed radiation thereof to at least one section of the structure. At least one end of the fiber can be directly connected to the second focusing arrangement and/or the third dispersive arrangement. In addition, an exemplary embodiment of a method for producing an optical arrangement can be provided. For example, a first set of optical elements having a first size in a first configuration and a second set of optical elements in cooperation with the second set and having a second size in a second configuration can be provided. The first and second sets can be clamped into a third set of optical elements. The third set can be polished, and a further set of optical elements may be deposited on the polished set.
Owner:THE GENERAL HOSPITAL CORP

Finishing element including discrete finishing members

Unitary finishing elements having discrete finishing members fixedly attached to unitary resilient body are disclosed for finishing semiconductor wafers. The discrete finishing members can be comprised of a multiphase polymeric composition. The new unitary finishing elements have lower cost to manufacture and high precision. The unitary finishing elements can reduce unwanted surface defect creation on the semiconductor wafers during finishing.
Owner:SEMCON TECH +1

High-speed, hand-held reciprocating method for cutting, carving, sawing, chiseling, filing, sanding, and engraving

A high-speed, hand-held attachment for flex rotor shafts of power rotary tools, and also for direct attachment to power rotary tools without flex rotor shafts, that converts rotary motion to reciprocating motion for precision control of cutting, carving, sawing, chiseling, filing, sanding, and engraving on delicate work pieces. The attachment is one assembly comprising a one-piece front one-piece enclosure (20), a rear one-piece enclosure (30), a high-speed bearing (22), a one-piece rotating piece (40) with integral cam groove, a one-piece reciprocating piece (50) with an integral cam follower on one end and with its other, exposed end accomodating the attachment of a chuck or collet and with geometry to prevent rotation, and a thumbscrew (32). Rotating piece (40) attaches directly to the rotary power source and provides the cam action drive to reciprocating piece (50). Bearing (22) provides rotative support for the other end of rotating piece (40). Reciprocating piece (50) slidably mounts in front one-piece enclosure (20). Front one-piece enclosure (20) and rear one-piece enclosure (30) are attached to each other and maintain proper alignment for rotating piece (40), bearing (22), and reciprocating piece (50). Thumbscrew (32) secures the attachment to the flex rotor shaft of a power rotary tool. A tool holder / collet is attached to the exposed end of reciprocating piece (50) whereby numerous types of cutting tools may be utilized. Alternative versions of the rear one-piece enclosure, (30A) and (30B), described herein, allow for attachment directly to power rotary tools without flex rotor shafts. Alternative versions of the reciprocating piece, (50A), (50B), and (50C), and of the rotating piece, (40A), are also described herein.
Owner:JONES WILLIAM RANDOLPH

Manufacturing method for semiconductor wafers, slicing method for slicing work and wire saw used for the same

InactiveUS20060258268A1Reduce unevenness of thickness and warpReduce wavinessMetal sawing devicesEdge grinding machinesCompound (substance)Engineering
In order to omit a lapping process or a double disk grinding process by performing slicing operation so as not to generate long period waviness on the surface of the wafer in a slicing process and by completely removing short period waviness remaining in the surface of the sliced wafer during a polishing process, there is provided a manufacturing method includes a slicing process of slicing a work of the semiconductor wafer by reciprocating a wire of a wire saw at constant cycles of 3 or more and less than 8 per a minute a grinding process of grinding both sides of the sliced wafer by a grinding wheel, one-side by one-side and a polishing process of performing a chemical mechanical polishing on both sides of the ground wafer by a fixed abrasive grain polishing cloth, in which an abrasive grain is fixed, and a abrasive containing no abrasive grains.
Owner:KOMATSU NTC LTD +1

Pre-Processing Techniques to Produce Complex Edges Using a Glass Slumping Process

ActiveUS20110072856A1Effectively be molded into a complex geometryEdge grinding machinesGlass transportation apparatusPre treatmentGlass forming
Apparatus, systems and methods for forming complex edges on a glass member through the use of a glass slumping process are disclosed. According to one aspect of the invention, a method of forming a complex edge in a glass forming process includes grinding an edge of a glass member and polishing the edge of the glass member. Grinding the edge of the glass member causes the edge of the glass member to have a first level of complexity. The method also includes performing a slumping process on the glass member. Performing the slumping process causes the edge of the glass member to have a second level of complexity that is more complex than the first level of complexity.
Owner:APPLE INC

Planarization system with multiple polishing pads

An apparatus for simultaneously polishing wafers including at least a first and a second web of polishing media. At least two polishing heads are provided on a carrier coupled to a drive system such that one polishing head positions a wafer against the first web and a second polishing head positions a second wafer against the second web. The drive system imparts a programmed polishing motion or pattern to the polishing heads.
Owner:APPLIED MATERIALS INC

Method and apparatus for probe tip cleaning and shaping pad

A method and apparatus is provided for cleaning and shaping a probe tip using a multi-layer adhesive and abrasive pad. The multi-layer adhesive and abrasive pad is constructed on the surface of a support structure, such as a silicon wafer, and is made of an adhesive in contact with abrasive particles. Adhesive is applied in layers with abrasive particles in-between each layer of adhesive. Abrasive particles may vary in size and material from layer to layer to achieve cleaning, shaping and polishing objectives.
Owner:SV PROBE PTE LTD

Automatic grinding and polishing system for crystal blanks

The invention discloses an automatic grinding and polishing system for crystal blanks. The automatic grinding and polishing system comprises a first left-right transfer mechanism and a second left-right transfer mechanism, feeding and discharging stations, a plurality of upper hemispherical grinding and polishing stations and butting stations are sequentially arranged from left to right along the first left-right transfer mechanism, butting stations, a plurality of lower hemispherical grinding and polishing stations and feeding and discharging stations are sequentially arranged from right to left along the second left-right transfer mechanism, feeding and discharging machines are arranged on the feeding and discharging stations, grinding and polishing machines are arranged on the grinding and polishing stations, butting machines are arranged on the butting stations, each left-right transfer mechanism comprises a plurality of transfer manipulators and a rail linearly extending left and right, the feeding and discharging machines, the grinding and polishing machines and clamp holders for mounting clamps on the butting machines are arranged in a left-right rowed manner along the length direction of the clamps, and the transfer manipulators push the clamps to slide between the left-right adjacent clamp holders along the length direction of the clamps. By the aid of the technical scheme, the automatic grinding and polishing system is more reasonable in structure, simpler in action, lower in cost, more reliable in operation and higher in efficiency.
Owner:่™ž้›…ไป™

Method and apparatus for monitoring polishing state, polishing device, process wafer, semiconductor device, and method of manufacturing semiconductor device

Prior to the polishing of the wafer 4, a reflective body which has the same shape and dimensions as the wafer 4 is held on the polishing head 2 instead of the wafer 4. A polishing agent 5 is interposed between the window 15 of the polishing head 13 and the reflective body, and the reflective body is pressed against the polishing pad 13 with the same pressure as that applied during the polishing of the wafer 4. In this state, the reflective body is irradiated via the window 15 with a probe light emitted from the light source 31, and the spectroscopic intensity of the reflected light is obtained from the sensor 43 as a reference spectrum. During the polishing of the wafer 4, the spectroscopic intensity of the reflected light from the wafer 4 is successively obtained as measured spectra from sensor 43; the intensity ratio of these measured spectra to the above-mentioned reference spectrum is determined, and the polishing state of the wafer 4 is monitored on the basis of this intensity ratio.
Owner:NIKON CORP
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