26999results about "Grinding drives" patented technology

A tool and method for assessing whether a disk carrier, and especially a carrier for holding semiconductor disks, is properly dimensioned. The tool has a body that includes a socket in which a portion of the disk carrier will seat fully if the disk carrier is properly dimensioned. Alignment structures may be provided in the socket to align with features of the carrier to assist in determining whether the disk carrier is properly dimensioned. The socket may include two spaced apart cavities that correspond with end portions of walls of the disk carrier.

In a process for polishing the chamfered peripheral part of a wafer using a polishing cloth while supplying a polishing slurry in order to improve productivity of the process by reducing a polishing time, at least two steps of polishing processes are performed in sequence. The process comprises a first polishing process to polish a particular part, e.g. the part corresponding to the {110} plane of a peripheral part of the wafer and a second polishing process in which the whole part of a peripheral part of the wafer is polished for finishing by means of varying a hardness of the polishing clothes and / or a particle size of abrasives in the slurry such as the hardness of the polishing cloth in the second polishing process being softer than that of in the first polishing process and a particle size of abrasives in the slurry in the second polishing process being finer than that of in the first polishing process.

An adapter is disclosed for mounting a tool on an oscillating drive having a drive shaft that can be driven to oscillate about its longitudinal axis, wherein the adapter is passed by a central opening, and has at its drive end at least one positive-locking element for positive connection with the tool, the positive-locking element having the shape of a regular polygon, or a plurality of positive-locking elements arranged on a circle concentric to the center axis, or a plurality of outwardly extending convex projections having rounded tips and being connected with neighboring projections via rounded concave lateral flanks, wherein the positive-locking elements on the drive end are configured for positive-locking connection with a matching positive-locking counter-element on the drive shaft, and wherein the adapter has a second receptacle on its tool end for effecting connection with a tool having a shape different from the first receptacle and being configured as a circle, or as a plurality of positive-locking elements arranged along a circle concentric to the center axis, or as plurality of outwardly extending convex projections with rounded tips and being connected with neighboring projections via rounded concave lateral flanks.

A system for conditioning rotatable polishing pads used to planarize and polish surfaces of thin film integrated circuits deposited on semiconductor wafer substrates, microelectronic, and optical system. The system has a pad conditioning apparatus, process fluids, a vacuum capability to pull waste material out of the conditioning pad, self-contained flushing means, and a piezo-electric device for vibrating the pad conditioning apparatus.

A power sanding machine (10) has three circumferentially spaced cogged belts (40) to drive three discs (52) rotatably mounted to an inner bowl (30) which is rotatably mounted to a housing (12), which in turn is connected to an operating handle (14). Mechanical lock can rotationally affix the inner bowl (30) to the housing to circumferentially position a pulley at the left or right edge (326, 322) of the sanding machine or at the front end (330) of the sanding machine. Power cleaning and sanding machines (412, 500, 600) incorporate the three disc (52) arrangement or a direct-drive one disc arrangement (572, 672). The machines (412, 500, 600) include multiple floor finishing units (420, 514, 614) ganged together in unique arrangements.

CMP pad dressers with increased pad dressing work loads on the centrally located abrasive particles during dressing of a CMP pad, and methods associated therewith are disclosed and described. The increase in work load on centralized particles improves pad dressing performance and also extends the service life of the pad dresser.

The present invention discloses a CMP pad dresser which has a plurality of uniformly spaced abrasive particles protruding therefrom. The abrasive particles are super hard materials, and are typically diamond, polycrystalline diamond (PCD), cubic boron nitride (cBN), or polycrystalline cubic boron nitride(PcBN). The abrasive particles are brazed to a substrate which may be then coated with an additional anti-corrosive layer. The anti-corrosive layer is usually a diamond or diamond-like carbon which is coated over the surface of the disk to prevent erosion of the brazing alloy by the chemical slurry used in conjunction with the CMP pad. This immunity to chemical attack allows the CMP pad dresser to dress the pad while it is polishing a workpiece. In addition to even spacing on the substrate, the abrasive particles extend for a uniform distance away from the substrate, allowing for even grooming or dressing of a CMP pad both in vertical and horizontal directions. A method of producing such a CMP pad dresser is also disclosed.

The invention discloses a device for simultaneously grinding the inner walls and the outer walls of steel pipes. The device comprises a workbench, a support, a collecting tank, a clamping mechanism, an outer grinding mechanism and an inner grinding mechanism; the support is arranged at the upper end of the workbench, and the clamping mechanism is arranged at the left end of the inner side of the support and comprises a clamping plate, a rotating motor, an annular gear, a gear, electric telescopic rods, supporting plates, rubber pads and springs; the outer grinding mechanism is installed at thelower end of a moving block; and the inner grinding mechanism is arranged under the outer grinding mechanism and comprises an inner grinding wheel, a threaded rod B, a fixing sleeve, a threaded sleeve, a second sliding groove, an electric hydraulic cylinder, a drive gear, a driven gear A, a driven gear B, a rectangular block and a connecting rod. The device is novel in design, simple in structure, capable of simultaneously grinding the inner walls and the outer walls of steel pipes with different thicknesses, high in grinding efficiency, wide in application range, capable of effectively preventing impurities such as scrap iron from polluting the environment, high in practicality and worthy of popularization.

The disclosure relates to abrasive articles useful in chemical-mechanical polishing (CMP), the articles including a substrate with opposite major surfaces, an abrasive material overlaying at least a portion of at least one of the major surfaces, and at least one of a radio frequency identification (RFID) tag, a RFID tag reader, or a sensor for providing CMP information to a transmitter positioned near the substrate, the transmitter positioned near the substrate and adapted to wirelessly receive CMP information and wirelessly transmit the CMP information to a remote receiver. The disclosure also relates to a CMP pad conditioner for wirelessly communicating CMP information to a remote receiver, a CMP process monitoring system for wirelessly communicating CMP information to a remote receiver, and a method for conditioning a CMP pad using a CMP process monitoring system for wireless communicating CMP information to a remote receiver.

A cutting device comprises a plurality of individual polycrystalline cutting elements secured in a solidified organic material layer. Each of the plurality of individual polycrystalline cutting elements has a substantially matching geometric configuration.

CMP pad dressers and their methods of manufacture are disclosed. One aspect of the present invention provides a CMP pad dresser having improved superabrasive grit retention in a resin layer. The CMP pad includes a resin layer, superabrasive grit held in the resin layer such that an exposed portion of each superabrasive grit protrudes from the resin layer, and a metal coating layer disposed between each superabrasive grit and the resin layer, where the exposed portions are substantially free of the metal coating layer. The metal coating layer acts to increase the retention of the superabrasive grit in the resin layer as compared to superabrasive grit absent the metal coating layer.

A cascaded disk scrubbing system and method are provided. The cascaded disk scrubbing system includes an array of rows of brush pairs. Each row includes a plurality of counter-rotating brush pairs that are arranged horizontally and longitudinally, and configured to receive and process a disk in a vertical orientation through disk preparation zones defined by each pair of brushes. Below and between the pairs of brushes is a track that is configured to apply a rotation to the disk and to transition the disk in a vertical orientation through the brush pairs. Nozzles dispense fluids on and over the brush pairs, and the brush pairs are configured such that fluids are dispensed through the brush pairs. Nozzles dispense a curtain of fluid between each disk preparation zone, and the cascaded disk scrubbing system is configured to progress from dirtiest to cleanest as the disk transitions through each disk preparation zone.

A method of reducing a degree of compression of a CMP pad during conditioning of the CMP pad comprises engaging the CMP pad with at least one superhard cutting element, the cutting element including a cutting face, the cutting face being angled at 90 degrees or less relative to a finished surface of the CMP pad; and moving the CMP pad and the cutting element relative to one another in a direction resulting in removal of material from the CMP pad with the cutting face to thereby condition the CMP pad.