The invention discloses a low-temperature curing high temperature-resistant inorganic / organic
hybrid epoxy adhesive and a preparation method thereof, which relate to an inorganic / organic
hybrid epoxy adhesive and a preparation method thereof. The invention solves the problems that inorganic / organic
hybrid epoxy adhesive prepared by the prior art has poor high-temperature
thermal aging resistance and needs high curing temperature. The low-temperature curing high temperature-resistant inorganic / organic hybrid
epoxy adhesive is prepared by an epoxy resin, an epoxy resin low-temperature curing agent, a
coupling agent, an inorganic active
hybrid material and a dispersant. The preparation method comprises the following steps: the epoxy resin, the epoxy resin low-temperature curing agent and the
coupling agent are mixed and stirred evenly, and then the inorganic active
hybrid material and the dispersant are added into the mixture to be stirred evenly to obtain the low-temperature curing high temperature-resistant inorganic / organic hybrid
epoxy adhesive. The low-temperature curing high temperature-resistant inorganic / organic hybrid
epoxy adhesive has high high-temperature
bonding strength, good high-temperature
thermal aging performance and low curing temperature. The low-temperature curing high temperature-resistant inorganic / organic hybrid epoxy adhesive has the advantages of simple production technology, convenient operation and broad application.