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Low temperature curing high temperature resistant inorganic / organic hybridization epoxy adhesive and preparation thereof

An epoxy adhesive, organic hybrid technology, used in inorganic adhesives, adhesives, epoxy resin adhesives, etc., can solve the problems of poor high temperature heat aging resistance and high curing temperature, and achieve high temperature and heat aging resistance. The effect of simple production process and convenient operation

Inactive Publication Date: 2009-05-27
INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the problems of poor high temperature thermal aging resistance and high curing temperature of inorganic / organic hybrid epoxy adhesive prepared in the prior art, and provide a low temperature curing high temperature resistant inorganic / organic hybrid epoxy adhesive and its preparation method

Method used

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specific Embodiment approach 1

[0010] Specific embodiment 1: In this embodiment, the low-temperature curing high-temperature resistant inorganic / organic hybrid epoxy adhesive consists of 100 parts of epoxy resin, 20-100 parts of epoxy resin low-temperature curing agent, and 1-20 parts of coupling agent. , 20-500 parts of inorganic active hybrid materials and 0.5-10 parts of dispersant.

specific Embodiment approach 2

[0011] Specific embodiment two: In this embodiment, the low-temperature curing high-temperature resistant inorganic / organic hybrid epoxy adhesive consists of 100 parts of epoxy resin, 20-100 parts of epoxy resin low-temperature curing agent, and 0.001-50 parts of toughening agent , 1-20 parts of coupling agent, 20-500 parts of inorganic active hybrid material and 0.5-10 parts of dispersant; wherein the toughening agent is liquid nitrile rubber with active end group or polyorganosiloxane with active end group; Among them, the active terminal liquid nitrile rubber is selected from liquid nitrile rubber X820, liquid nitrile rubber X840, liquid nitrile rubber X350; organosiloxane.

[0012] Toughener can reduce the brittleness after curing and improve its impact strength and elongation.

specific Embodiment approach 3

[0013] Specific embodiment three: the difference between this embodiment and specific embodiment one or two is that the epoxy resin is bisphenol A type epoxy resin E-54, bisphenol A type epoxy resin E-51, bisphenol A type epoxy resin Resin E-44, bisphenol A epoxy resin E-42, bisphenol A epoxy resin E-35, bisphenol A epoxy resin E-31, bisphenol A epoxy resin E-20, bisphenol A epoxy resin Phenol A epoxy resin E-14, bisphenol A epoxy resin E-12, bisphenol A epoxy resin E-06, bisphenol A epoxy resin E-04, bisphenol A epoxy resin E-03, novolac epoxy resin F-51, novolac epoxy resin F-44, novolac epoxy resin F-46, bisphenol S epoxy resin 185S, bisphenol S epoxy resin 300SS, Tetrabromobisphenol A epoxy resin EX-28, Tetrabromobisphenol A epoxy resin EX-25, Tetrabromobisphenol A epoxy resin EX-21, Tetrabromobisphenol A epoxy resin EX- 14. Resorcinol diglycidyl ether epoxy resin 680#, ethylene glycol glycidyl ether epoxy resin, diethylene glycol glycidyl ether epoxy resin, polyethylene ...

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Abstract

The invention discloses a low-temperature curing high temperature-resistant inorganic / organic hybrid epoxy adhesive and a preparation method thereof, which relate to an inorganic / organic hybrid epoxy adhesive and a preparation method thereof. The invention solves the problems that inorganic / organic hybrid epoxy adhesive prepared by the prior art has poor high-temperature thermal aging resistance and needs high curing temperature. The low-temperature curing high temperature-resistant inorganic / organic hybrid epoxy adhesive is prepared by an epoxy resin, an epoxy resin low-temperature curing agent, a coupling agent, an inorganic active hybrid material and a dispersant. The preparation method comprises the following steps: the epoxy resin, the epoxy resin low-temperature curing agent and the coupling agent are mixed and stirred evenly, and then the inorganic active hybrid material and the dispersant are added into the mixture to be stirred evenly to obtain the low-temperature curing high temperature-resistant inorganic / organic hybrid epoxy adhesive. The low-temperature curing high temperature-resistant inorganic / organic hybrid epoxy adhesive has high high-temperature bonding strength, good high-temperature thermal aging performance and low curing temperature. The low-temperature curing high temperature-resistant inorganic / organic hybrid epoxy adhesive has the advantages of simple production technology, convenient operation and broad application.

Description

technical field [0001] The invention relates to an inorganic / organic hybrid epoxy adhesive and a preparation method thereof. Background technique [0002] In recent years, with the rapid development of high-tech industries such as aerospace, aircraft manufacturing, precision electronics, and machining, higher requirements have been placed on the high strength and heat resistance of adhesives, such as sensors for internal combustion engines, rocket engines, and nuclear reactors. The locking of threaded parts such as joints, flanges and pipe threads has put forward the demand for high-strength and high-temperature resistant adhesives. [0003] Epoxy adhesives have the characteristics of high bonding strength, small volume shrinkage, low temperature curing and wide applicability, so they have been widely used in various fields. However, due to the relatively poor heat resistance of epoxy glue, it is greatly limited in application. Inorganic adhesives have good heat resistance...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J1/00
Inventor 刘晓辉王刚张大勇朱金华赵颖李欣
Owner INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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