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Low-stress epoxy/organic silicon/POSS nano hybrid material, and preparation method and application thereof

A nano-hybrid material and organosilicon technology, used in the preparation of low-stress epoxy/organosilicon/POSS nano-hybrid materials, low-stress epoxy/organosilicon/POSS nano-hybrid materials and their preparation, low-stress ring In the field of oxygen/organosilicon/POSS nano-hybrid materials, it can solve the problems of difficult solvent purification, poor mechanical properties, and complicated processes, and achieve the effects of excellent thermal stability, low production cost, and simple production process.

Inactive Publication Date: 2011-02-16
FUDAN UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the simple blending method is prone to phase separation and has poor mechanical properties; the disadvantage of the chemical modification method is that the process is complicated, and solvents are usually used to make purification difficult, and it is difficult to control the degree of reaction

Method used

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  • Low-stress epoxy/organic silicon/POSS nano hybrid material, and preparation method and application thereof
  • Low-stress epoxy/organic silicon/POSS nano hybrid material, and preparation method and application thereof
  • Low-stress epoxy/organic silicon/POSS nano hybrid material, and preparation method and application thereof

Examples

Experimental program
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Effect test

example 1

[0046] In a 250ml four-necked flask, add 30 grams of bisphenol A epoxy resin, react for 5 hours under acidic conditions at 80-100 ° C, to partially open the ring and hydroxylate the epoxy resin, and then add 60 grams of epoxy resin with a molecular weight of 2000 Methoxy polyorganosiloxane, 5 grams of hexaisobutyl-diepoxy POSS, 2 grams of epoxy dimethoxysilane, stirring at 20-40 ° C, condensation reaction for 72 hours, to obtain a homogeneous epoxy / Organosilicon / POSS composition, add 10 grams of phthalic anhydride epoxy curing agent, and cure at 100° C. for 3 hours to obtain a low-stress epoxy / organosilicon / POSS nano-hybrid material. The hardness of the material is 3H, the flexibility is 1mm, and the visible light transmittance is 95%.

example 2

[0048] In a 250ml four-necked flask, add 10 grams of cycloaliphatic epoxy resin, and react for 8 hours under acidic conditions at 70-80 ° C to partially open and hydroxylate the epoxy resin, and then add 40 grams of epoxy resin with a molecular weight of 1000 Phenylmethoxy polyorganosiloxane, 45 grams of hexaepoxy-dimethoxy POSS, stirred at 60-70°C, and condensed for 24 hours to obtain a homogeneous epoxy / organosilicon / POSS composition, adding 3 grams of Aradur830 epoxy curing agent and 2 grams of ethanol additive were cured at 150°C for 3 hours to obtain a low-stress epoxy / organic silicon / POSS nano-hybrid material. The hardness of the material is 2H, the flexibility is 1mm, and the visible light transmittance is 99%.

example 3

[0050] In a 250ml four-necked flask, add 5 grams of bisphenol A epoxy resin, 5 grams of bisphenol F epoxy resin, and 5 grams of silicone epoxy resin, and react under acidic conditions at 100-120°C for 5 hours to make the epoxy Partial ring-opening hydroxylation of the resin, then adding 30 grams of epoxyethoxy polyorganosiloxane with a molecular weight of 5000, 10 grams of epoxy-heptamethyl POSS, 10 grams of diisobutyl-hexaepoxide POSS, Add 20 grams of methanol additives, stir at 50-60 ° C, and condense for 48 hours to obtain a homogeneous epoxy / organic silicon / POSS composition, add 15 grams of methyl tetrahydrophthalic anhydride epoxy curing agent, in Curing at 180°C for 5 hours to obtain a low-stress epoxy / organic silicon / POSS nano-hybrid material. The hardness of the material is 4H, the flexibility is 1mm, and the visible light transmittance is 97%.

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Abstract

The invention relates to the technical fields of photoelectricity and chemical industry, in particular to a low-stress epoxy / organic silicon / POSS nano hybrid material, and a preparation method and application thereof. The epoxy / organic silicon / POSS nano hybrid material comprises (a) an epoxy resin, (b) a polyorganosiloxane, (c) a cage-type polysilsesquioxane (POSS), (d) an epoxy hardener, (e) non-essential silane oxycompound and (f) non-essential assistants, wherein the polyorganosiloxane contains epoxy groups and silane oxygen groups. The cured nano hybrid system has excellent reticular cross-linked structure and does not have microphase separation. The epoxy / organic silicon / POSS nano hybrid material has the advantages of high mechanical strength, favorable heat resistance, favorable cohesive property, high chemical stability, favorable ultraviolet aging resistance, favorable optical transparency and other excellent properties, has the functions of low internal stress and pressure buffer, and can be used as an LED packaging material, optical protection material, circuit protection coating material, adhesive paint and the like.

Description

technical field [0001] The invention relates to the technical fields of photoelectricity and chemical industry, and relates to a low-stress epoxy / organosilicon / POSS nano-hybrid material and its preparation method and application. More specifically, the present invention relates to a low stress epoxy / organosilicon / POSS nano-hybrid material comprising epoxy resin, polyorganosiloxane, cage polysilsesquioxane (POSS), epoxy cured agent, non-essential siloxyl compound and non-essential auxiliary agent; the present invention also relates to the preparation method and application of low-stress epoxy / organosilicon / POSS nano-hybrid material. The nano-hybrid material of the invention can be applied to the fields of LED packaging materials, optical protection materials, circuit protection coating materials, adhesives, coatings and the like. Background technique [0002] At present, the protective materials for photoelectric substrates are mainly epoxy resin and silicone resin, both of ...

Claims

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Application Information

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IPC IPC(8): C09J183/06C09J163/00C08L83/06C09D163/00C09J163/02C09D183/06C08G77/42C08G59/14C08L63/02H01L33/56C09D163/02C08L63/00
Inventor 游波潘倩唐勇费佳曾宇辉武利民
Owner FUDAN UNIV
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