Heat-curable eproxy resin composition
a technology of eproxy resin and composition, which is applied in the direction of epoxy resin adhesives, graft polymer adhesives, adhesive types, etc., can solve the problems of insufficient strength at high temperatures and in particular at low temperatures, and the brittleness of conventional epoxy adhesives
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[0061] A few examples are given below which illustrate the invention further but do not limit the scope of the invention in any way. The raw materials used in the examples are as follows:
Raw materials usedSupplierDimerized C18 fatty acid (Pripol 1013)UniquemaAdipic acidBASF2,2-Bis(4-hydroxyphenyl)propaneFluka AGBis(4-hydroxyphenyl)sulfoneFluka AGBisphenol-A diglycidyl ether (= DGEBA)VanticoPolypropylene glycol diglycidyl ether (ED-506)Asahi-Denka KogyoDicyanodiamide (= Dicy)DegussaPolypropylene ether polyol (Mw = 2000 g / mol)BayerIsophorone diisocyanate (= IPDI)Degussa-HülsCaprolactamEMS ChemieN-ButylamineBASF4,4′-Diphenylmethylene diisocyanate (= MDI)BayerCore / shell polymer (F-351)ZeonTriphenylphosphineFlukaDibutyltin dilaurateWitco Europe
[0062] General preparation for preparing epoxy adduct B and its mixture with A (=A / B premix):
[0063] A / B Premix PM1
[0064] Under vacuum and with stirring at 110° C., 123.9 g of a dimeric fatty acid, 1.1 g triphenylphosphine, and 57.3 g adipic aci...
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