Room-temperature curing epoxy structural adhesive composition and preparation method thereof
A room temperature curing and adhesive technology, applied in the direction of adhesives, epoxy glue, adhesive types, etc., can solve the problems of poor toughness, poor high temperature strength, etc., and achieve high shear strength, good adhesion, and T-peeling high intensity effect
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Embodiment 1
[0031] The preparation step of the CTBN modified epoxy resin used in embodiment 1 is: 100g liquid nitrile rubber (Hypro CTBN 1300 * 16, Emerald company) is joined in the 250g EPON828 epoxy resin, then adds 2g fumed silica ( TS-720, Cabot Company) and 2g of phenyltrimethoxysilane, firstly mix these components thoroughly at room temperature, then heat the mixture to 60°C at a heating rate of 2°C / min, at 60°C The reaction was carried out for 3 hours, then cooled to room temperature, and discharged.
[0032] The epoxy resin grade MX125 with core-shell structure polymer toughening is manufactured by Japan KANEKA Company.
[0033] Example 1:
[0034] Preparation of Room Temperature Curing Epoxy Structural Adhesive Composition:
[0035] (a) 10 grams of bisphenol A type Epon828 epoxy resin by weight ratio, 5.5 grams of core-shell structure polymer modified epoxy resin, 0.45 grams of phenyltrimethoxysilane, 0.6 grams of fumed silica, oxidized 0.1 g of iron, mechanically stirred and ...
Embodiment 2~10
[0050] Part A and Part B were prepared separately. The preparation method of component A and component B is as follows: according to the ingredients and dosage listed in Table 4, carry out mechanical stirring and dispersion at room temperature, and then put it into a high-speed shear mixing instrument with a vacuum device, first with 500 Stir mechanically at a speed of 300 rpm for 30 minutes, mix for 2 minutes while vacuuming at a speed of 300 rpm, and then mix for 60 seconds while vacuuming at a speed of 3000 rpm, then package and store.
[0051] The preparation steps of the CTBN modified epoxy resin used in embodiment 2,4 are: 100g liquid nitrile rubber (Hypro CTBN 1300 * 16, Emerald company) is joined in the 240g EPON826 epoxy resin, then add 3g gas phase dioxide Silicon (TS-720, Cabot Company) and 3g of phenyltrimethoxysilane, these components are mixed thoroughly at room temperature first, and then the mixture is heated to 70°C at a heating rate of 5°C / min. It was reacte...
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