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Epoxy resin embedding glue and method for producing the same

A technology of epoxy resin and potting glue, which is applied in the direction of chemical instruments and methods, and other chemical processes, can solve the problems of poor impact toughness, insufficient heat resistance, and easy fatigue, and achieve low cost and glass transition The effect of high temperature and long storage time

Active Publication Date: 2009-08-19
NICHE TECH KAISER SHANTOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the high cross-linking structure of pure epoxy resin, there are disadvantages such as brittleness, fatigue, insufficient heat resistance, and poor impact toughness.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Prepare the epoxy potting compound as follows:

[0021] (1) Preparation of component A: 95 grams of bisphenol A type epoxy resin E-51, 16 grams of diluent (8.5 grams of glycerol triglycidyl ether, 7.5 grams of 1,4-butanediol diglycidyl ether) gram), 11 grams of polyurethane toughening agent (using commercially available "Kiss" toughening agent) and 1.1 gram of defoamer (both polysiloxane) are mixed and stirred until uniformly mixed (the mixer speed is 1000rpm , stirring time is 15 minutes); Then add 0.9 gram of carbon black and 240 gram fillers (wherein 190 grams of active silicon micropowder, 40 grams of calcium carbonate, 10 grams of aluminum hydroxide) while stirring (stirrer rotating speed is 120rpm); Carbon black and After adding all the fillers, continue to stir (the speed of the mixer is 1800rpm, and the stirring time is 25 minutes), so that the bisphenol A epoxy resin E-51, diluent, polyurethane toughener, defoamer, carbon black and filler are mixed evenly Carr...

Embodiment 2

[0027] Prepare the epoxy potting compound as follows:

[0028] (1) Preparation of component A: 130 grams of bisphenol A epoxy resin (wherein 90 grams are bisphenol A epoxy resin E-51, 40 grams are bisphenol A epoxy resin E-44), 20 gram diluent (wherein trimethylol propane glycidyl ether 12.5 grams, hexanediol diglycidyl ether 7.5 grams), 18 grams of polyurethane toughening agent (adopting commercially available " Qi Shi " toughening agent) and 1.5 grams of antifoaming agents (both polysiloxane) were mixed and stirred until they were evenly mixed (the speed of the mixer was 1400 rpm, and the stirring time was 6 minutes); then 1.5 grams of carbon black and 318 grams of carbon black were added while stirring (the speed of the mixer was 300 rpm). Filler (wherein active silicon micropowder 220 grams, calcium carbonate 58 grams, aluminum hydroxide 40 grams); After carbon black and filler all add, continue to stir (stirrer speed is 2000rpm, stirring time is 20 minutes), make bispheno...

Embodiment 3

[0034] Prepare the epoxy potting compound as follows:

[0035] (1) Preparation of component A: 115 grams of bisphenol A epoxy resin E-44, 25 grams of diluent (10 grams of hexanediol diglycidyl ether, 15 grams of glycerol triglycidyl ether), 25 grams 1 gram of polyurethane toughening agent (using "Kiss" toughening agent available on the market) and 2.4 grams of defoamer (both polysiloxane) are mixed and stirred until evenly mixed (the mixer speed is 1200rpm, and the stirring time is 10 minutes); then add 2 grams of carbon black and 295 grams of filler (wherein 250 grams of active silicon micropowder, 20 grams of calcium carbonate, and 25 grams of aluminum hydroxide) while stirring (the speed of the mixer is 200 rpm); Continue to stir again (the speed of the mixer is 1500rpm, and the stirring time is 30 minutes), so that bisphenol A type epoxy resin E-44, diluent, polyurethane toughening agent, defoamer, carbon black and filler are mixed uniformly; Then carry out vacuum Degassi...

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Abstract

The invention relates to an epoxy resin potting adhesive which consists of component A and component B. By weight portion, the component A consists of 90-130 portions of bisphenol A type epoxy resin, 240-320 portions of filling, 15-25 portions of thinner, 10-25 portions of toughener, 1-2.5 portions of defoamer and 0.8-2 portions of black pigment, and the component B consists of 60-130 portions of estolide and 1-3 portions of imidazole accelerator. The mixing proportion of the component A and the component B is (3-5):1. The invention also provides a preparation method of the epoxy resin potting adhesive. The epoxy resin potting adhesive provided by the invention has low cost and long resting period; after being mixed, the component A and the component B have low viscidity, good wetting quality, good heat resistance, good defoaming performance, good fluidity and long operating time and are solidified between 70 DEG C and 160 DEG C; a product after solidifying has bright surface, good mechanical performance and insulating performance and high glass transition temperature; and the quality of a potting component is stable.

Description

technical field [0001] The invention relates to an epoxy resin potting glue and a preparation method thereof. The epoxy resin potting glue can be applied to the potting of ignition coils of motor vehicles. Background technique [0002] Epoxy resin is a thermosetting resin with excellent adhesion, mechanical strength and electrical insulation, so it is widely used in casting and potting of electronic components, transformers and other devices. However, due to the high cross-linking structure of pure epoxy resin, there are disadvantages such as brittleness, fatigue, insufficient heat resistance, and poor impact toughness. In order to ensure the reliability, good heat dissipation capability and excellent electrical properties of potted devices, it is necessary to modify the epoxy resin in terms of toughness, heat resistance, flame retardancy and internal stress reduction. Contents of the invention [0003] The technical problem to be solved by the present invention is to pro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/02C08K13/02C08K3/36C08K3/26C08K3/22C08K5/09C08K5/3445C08L75/04C08L83/04C09K3/10
Inventor 周振基周博轩
Owner NICHE TECH KAISER SHANTOU
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