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26285 results about "Heat treating" patented technology

Heat treating (or heat treatment) is a group of industrial and metalworking processes used to alter the physical, and sometimes chemical, properties of a material. The most common application is metallurgical. Heat treatments are also used in the manufacture of many other materials, such as glass. Heat treatment involves the use of heating or chilling, normally to extreme temperatures, to achieve the desired result such as hardening or softening of a material. Heat treatment techniques include annealing, case hardening, precipitation strengthening, tempering, carburizing, normalizing and quenching. It is noteworthy that while the term heat treatment applies only to processes where the heating and cooling are done for the specific purpose of altering properties intentionally, heating and cooling often occur incidentally during other manufacturing processes such as hot forming or welding.

Fabrication of biocompatible polymeric composites

Composite materials formed from biocompatible polymer fibers and biodegradable polymers are disclosed. The heat treatment conditions for the reinforcing fibers are described so that the mechanical properties of the fibers can be retained during composite consolidation process. The processing conditions and set-ups to consolidations are constrained to the temperatures lower than fiber heat treatment temperatures. The reinforcing fibers are restrained under tension so that the minimum relaxation occurs during consolidation process.
Owner:ETHICON INC

Heat Treating Apparatus

[Problems] To prevent both slips caused by damage from projections, and slips caused by adhesive force occurring due to excessive smoothing.[Means for Solving the Problems] The heat treating apparatus includes a processing chamber for heat treating wafers and a boat for supporting the wafers in the processing chamber. The boat further includes a wafer holder in contact with the wafer and a main body for supporting the wafer holder. The wafer holder diameter is 63 to 73 percent of the wafer diameter, and the surface roughness Ra of the portion of the wafer holder in contact with the wafer is set from 1 μm to 1,000 μm. The wafer can be supported so that the amount of wafer displacement is minimal and both slips due to damage from projections on the wafer holder surface, and slips due to the adhesive force occurring because of excessive smoothing can be prevented in that state.
Owner:KOKUSA ELECTRIC CO LTD +1

Temperature measuring system, heating device using it and production method for semiconductor wafer, heat ray insulating translucent member, visible light reflection membner, exposure system-use reflection mirror and exposure system, and semiconductor device produced by using them and vetical heat treating device

Oppositely of a temperature measuring surface of an object-to-be-measured 16, a reflecting member 28 is disposed while being spaced by a reflection gap 35 from the temperature measuring surface. The reflecting member 28 is composed of a heat ray reflecting material capable of reflecting heat ray in a specific wavelength band, in a portion including a reflection surface 35a. A heat ray extraction pathway section 30 is disposed through the reflecting member 28 so that one end thereof faces the temperature measuring surface. Heat ray extracted through the heat ray extraction pathway section from the reflection gap is detected by a temperature detection section 34. The heat ray reflecting material is configured in a form of a stack comprising a plurality of element reflecting layers composed of a material having transparent properties to the heat ray, in which every adjacent two element reflecting layers are composed of a combination of materials having refractive indices which differ from each other by 1.1 or more. This makes the measurement be hardly affected by radiation ratio of the object-to-be-measured when temperature of the object-to-be-measured is measured by a radiation thermometer, enables to measure its temperature more correctly irrespective of the surface state thereof, and can simplify configuration of a measurement system.
Owner:SHIN-ETSU HANDOTAI CO LTD

Devices and methods for annular repair of intervertebral discs

Devices and methods for treating a damaged intervertebral disc to reduce or eliminate associated back pain. The present invention provides disc reinforcement therapy (DRT) which involves implanting one or more reinforcement members in and preferably around the annulus of the disc. The reinforcement members may be used to stabilize the annulus and / or compresses a portion of the annulus so as to reduce a bulge and / or close a fissure. The implantable devices and associated delivery tools may incorporate heating capabilities to thermally treat the annular tissue. Alternatively or in combination, other devices may be specifically employed for such thermal treatment.
Owner:KRT INVESTORS

Anti-sulfur well mouth valve body welding repair method

The invention belongs to the welding industry, and particularly relates to an anti-sulfur well mouth valve body welding repair method, and in particular to a welding repair method of 4130 medium-carbon alloy steel in an anti-sulfur valve body with the hardness being 197 HBW -237 HBW. The anti-sulfur well mouth valve body welding repair method is characterized by comprising the following steps that a product to be repaired is cleaned to determine a damage position; a pit badly eroded needs to be polished; a workpiece is totally preheated to 130 DEG C before welding; filling of the pit is firstly achieved by adopting the argon tungsten-arc welding; then, the machined surface is subject to repair welding; the local or total heat treatment insulation is performed for 3 hours at 640 DEG C; in the welding repair method, preheating is performed to reach 130 DEG C before welding; the local or total heat treatment insulation is performed for 3 hours at 640 DEG C after welding; and the Ar+CO2 mixed gas arc welding is adopted in the method, and the method greatly increases the product utilization rate and improves the comprehensive efficiency.
Owner:YANTAI JEREH PETROLEUM EQUIP & TECH

Method for preparing medical porous tantalum implant material

The invention discloses a method for preparing a medical porous tantalum material. The method comprises the following steps of: mixing a poly ethanol aqueous solution and tantalum powder to obtain slurry, wherein the mass concentration of the poly ethanol aqueous solution is 2 to 8 percent; injecting the slurry into an organic foam by vibrating and pressurizing, wherein the vibrating frequency is 20 to 80 times/min; drying; degreasing; sintering, namely raising temperature to 1,500 to 1,800 DEG C at the speed of 10 to 20 DEG C/min under the vacuum degree of 10<-4> to 10<-3>Pa, preserving heat for 120 to 240 minutes, cooling to 200 to 300 DEG C along with a furnace, raising temperature to 1,500 to 1,800 DEG C at the speed of 10 to 20 DEG C/min again, preserving heat for 180 to 240 minutes, raising temperature to 2,000 to 2,200 DEG C at the speed of 5 to 10 DEG C/min, and preserving heat for 120 to 360 minutes; cooling; and performing thermal treatment, namely raising temperature to 800 to 900 DEG C at the speed of 10 to 20 DEG C/min under the vacuum degree of 10<-4> to 10<-3> Pa, preserving heat for 240 to 480 minutes, cooling to 400 DGE C at the speed of 2 to 5 DGE C/min, preserving heat for 120 to 300 minutes, and cooling to room temperature along with the furnace. The porous tantalum prepared by the method is very suitable to be used for the medical implant material for replacing bearing bone tissues, and biocompatibility and the mechanical property can be guaranteed simultaneously.
Owner:CHONGQING RUNZE PHARM CO LTD
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