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Method for conducting surface chemical copper plating on inorganic particles through dopamine

A technology of inorganic particles and surface chemistry, applied in the direction of liquid chemical plating, metal material coating process, coating, etc., can solve the problems of easy sedimentation of fillers, reduce pollution, prevent fillers from settling, and reduce cumbersome processes Effect

Active Publication Date: 2015-12-02
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention mainly aims at the problem that fillers in electromagnetic shielding coatings and wave-absorbing coatings are easy to settle, and provides a method for preparing lightweight conductive fillers by using inorganic particles as a matrix and polydopamine as an intermediate layer to reduce metal copper ions on the surface

Method used

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  • Method for conducting surface chemical copper plating on inorganic particles through dopamine
  • Method for conducting surface chemical copper plating on inorganic particles through dopamine
  • Method for conducting surface chemical copper plating on inorganic particles through dopamine

Examples

Experimental program
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Effect test

Embodiment 1

[0032] (1) Sonicate the alumina microspheres with an average particle size of 10 μm in absolute ethanol for 20 minutes, filter, collect the filter cake, and air-dry at 110°C for 4 hours before use;

[0033](2) Use tris (trishydroxymethylaminomethane) and hydrochloric acid to prepare a buffer solution with a pH of 8.5, use the buffer solution to prepare a dopamine solution with a concentration of 2g / L, take 50mL of the dopamine solution, add 2g of pretreated alumina micro Balls, stirred in the air atmosphere at a speed of 300r / min for 24h, filtered, collected filter cake, vacuum dried at 60°C for 4h and then used for later use;

[0034] (3) Preparation of electroless copper plating solution: first prepare an aqueous solution with copper chloride as the main salt, then add ethylenediaminetetraacetic acid as a complexing agent, boric acid as a stabilizer, and dimethylamine borane as a reducing agent. The concentrations of salt copper chloride, complexing agent EDTA, stabilizer bo...

Embodiment 2

[0038] (1) Same as step (1) of Example 1;

[0039] (2) Use tris and hydrochloric acid to prepare a buffer solution with a pH of 8.0, and use the buffer solution to prepare a dopamine solution with a concentration of 2 g / L. Take 50 mL of the dopamine solution, add 2 g of pretreated alumina microspheres, and stir for 12 hours in an oxygen atmosphere. Filter, collect the filter cake, and dry it under vacuum at 60°C for 4 hours for later use;

[0040] (3) Same as step (3) of Example 1;

[0041] (4) Same as step (4) of Example 1.

Embodiment 3

[0043] (1) Same as step (1) of Example 1;

[0044] (2) Same as step (2) of Example 1;

[0045] (3) Prepare 30mM, 40mM, and 60mM copper chloride aqueous solutions respectively, add EDTA with the same concentration as copper chloride as complexing agent, 0.2M boric acid as stabilizer, 0.08MDMAB as reducing agent, and use sodium hydroxide Adjust the pH to 7.0. Take 100mL of the prepared electroless copper plating solution, add 1g of alumina microspheres coated with dopamine, stir magnetically for 3h, and the stirring speed is 400r / min;

[0046] (4) Same as step (4) of Example 1.

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Abstract

The invention discloses a method for conducting surface chemical copper plating on inorganic particles through dopamine. The method comprises the steps that poly-dopamine layers are made to subside on the surfaces of the inorganic particles in an alkaline solution through the oxidative polymerization effect of the dopamine, then by utilizing functional groups of the poly-dopamine layers, and meanwhile under the effect of an additional auxiliary reducing agent of dimethylamine broane (DMAB), copper ions are reduced to pure copper on the surfaces of the inorganic particles, and a continuous and compact metal copper layer is formed. The method is simple to operate, low in equipment requirement and low in cost; the prepared copper-plated inorganic particles have the characteristics of being low in density, good in conductivity and the like; the method can be used for preparing electricity and thermal conductive coatings, electromagnetic shielding paint, wave-absorbing materials and the like.

Description

technical field [0001] The invention relates to the field of powder electroless plating, in particular to a method for performing electroless copper plating on the surface of inorganic particles through dopamine. Background technique [0002] A major problem brought about by the rapid development of modern society is the problem of electromagnetic wave pollution. On the one hand, the electromagnetic waves emitted by different electronic and electrical equipment will interfere with each other and affect the stability of the equipment; on the other hand, a large number of electromagnetic waves will endanger human health. In some fields of national defense and military industry, the leakage of electromagnetic waves will also cause some safety problems. In order to solve these problems, various electromagnetic shielding materials and wave-absorbing materials have emerged. Among them, electromagnetic shielding coatings are widely used in the field of electromagnetic shielding bec...

Claims

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Application Information

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IPC IPC(8): C23C18/40C23C18/18
Inventor 吴叔青胡佳勋陈根宝
Owner SOUTH CHINA UNIV OF TECH
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