The invention relates to a high power LED
package, in which a
package body is integrally formed with resin to have a recess for receiving an LED
chip. A first sheet
metal member is electrically connected with the LED
chip, supports the LED
chip at its upper partial portion in the recess, is surrounded by the
package body extending to the side face of the package body, and has a
heat transfer section for transferring heat generated from the LED chip to the
metal plate of the board and extending downward from the inside of the package body so that a lower end thereof is exposed at a bottom face of the package body thus to contact the board. A second sheet
metal member is electrically connected with the LED chip spaced apart from the first sheet metal member for a predetermined gap, and extends through the inside of the package body to the side face of the package body in a direction opposite to the first sheet metal member. A transparent
sealant is sealingly filled up into the recess. The LED package raises
thermal radiation efficiency with a simplified structure in order to reduce the size and thickness thereof.