1990results about How to "Good electrical properties" patented technology

The invention belongs to the technical field of a lithium ion battery, and particularly relates to stabilization lithium metal powder. The stabilization lithium metal powder has a core shell structure; and the core layer is formed by lithium metal and is a composition consisting of an electron good conductor and a lithium ion good conductor. Compared with the prior art, the stabilization lithium metal powder provided by the invention has the advantages that: in the process of performing pre-lithiation of the anode-active material by use of the stabilization lithium metal powder, no limitation is imposed on the pressure of the cold pressing process, the 'dead lithium' disabling lithiation reaction is not produced, and the lithiation efficiency of the lithium metal powder is improved; and moreover, since the shell layer left on the electrode surface has good electron and lithium ion conductivity after the pre-lithiation, the electron and ion conductivity of the anode can be effectively improved so as to improve the electrochemical performance of the battery. In addition, the invention also discloses an anode strip performing pre-lithiation by use of the stabilization lithium metal powder, and a lithium ion battery comprising the anode strip.

The invention relates to a halogen-less high frequency resin composition, and a prepreg and a laminate manufactured by using the same. The halogen-less high frequency resin composition comprises the following components based on weight part of the organic solids: (A) 10 to 50 parts of styrene-maleic anhydride oligomer; (B) 10 to 50 parts of at least one compound containing dihydro-benzoxazine ring; (C) 10 to 50 parts of at least one polyepoxide; and (D) 5 to 30 parts of at least one phosphorus-containing flame retardant. The prepreg and the laminate manufactured by using the halogen-less highfrequency resin composition has low dielectric constant, low dielectric loss factor, high glass transition temperature, good heat resistance, low water absorbance, and simple and convenient technological operation.

The leadless tellurate low melting glass is used as binder phase for preparing electron paste. Said glass is mixed with functional powder to produce composite powder, which is then dispersed in organic solution to prepare thick paste, i.e. electron paste, used for making various kinds of electron devices. Said low melting glass, during sintering, melts-out and takes effect of adhering. The sintering temperature is between 350-600deg.C when making electron device. The components of the glass are (mass percentages): TeO2 10-90%,V2O5 0-40%,SiO2 0-5%,B2O3 0-5%,ZnO 0-10%,Bi2O3 0-20%,Sb2O3 0-8%,Al2O3 0-4%,SnO2 0-6%,Ag2O 0-10%,BaO 0-5%,MgO+CaO 0-5%.

The invention discloses an organic silicon potting adhesive with a high heat conduction capacity. The curing time of the additive type organic silicon potting adhesive with a high heat conduction capacity can be controlled by the temperature and the amount of the catalyst. The condensate has good mechanical and electrical properties, especially outstanding cohesive strength, high and low temperature resistance and radiation resistance. The inventive heat-conducting organic silicon potting adhesive includes component A and B: said component A is mixed by following parts by weight: 100 shares of organic silica-base adhesive, 10-80 shares of heat-conducting filling, 3-20 shares of reinforced-filling, 1-10 shares of catalyst; said component A is mixed by following parts by weight: 100 shares of organic silica-base adhesive, 10-80 shares of heat-conducting filling, and 1-10 shares curing agent.

The invention relates to a halogen-free Tg resin composite and a presoaked material and a laminated board made by adopting the composite. Counted by part by weight of organic solid matters, the halogen-free high-Tg resin composite contains the following components according to part by weight: (A) 10 to 50 parts by weight of cyanate resin; (B) 10 to 50 parts by weight of at least one compound withdihydro-benzoxazine ring; (C) 10 to 50 parts by weight of at least one kind of bismaleimides resin; (D) 10 to 50 parts by weight of at least one kind of poly-epoxy compound; and (E) 5 to 30 parts by weight of at least one kind phosphonium flame retardant. The halogen-free high-Tg resin composite has the performances of low water absorption, low CTE (coefficient of thermal expansion), high Tg, good dielectric property and the like, and the presoaked material and laminated board made by adopting the composite has the characteristics of high vitrification transition temperature, low CTE, low dielectric constant, low water absorption, high thermal resistance and the like, thus being application to multi-layer circuit boards.

The invention discloses an additive high-thermal-conductivity organic silicon electronic pouring sealant and a preparation method thereof. The preparation method comprises the following steps of: adding vinyl-ended polydimethylsiloxane, spherical aluminum oxide, boron nitride and silicon carbide whiskers into a kneader, dehydrating and blending at the temperature of 100-150 DEG C and under the vacuum degree of 0.06-0.1MPa, cooling, and grinding for three times to obtain a substrate; adding a hydrogen-containing silicon oil crosslinking agent and a crosslinking inhibitor into the substrate at normal temperature, and fully stirring to prepare a component A; adding a platinum catalyst into the substrate, and fully stirring to prepare a component B; and uniformly blending the component A and the component B having equal part by weight, and defoaming under the vacuum degree of 0.06-0.1MPa to obtain the additive high-thermal-conductivity organic silicon electronic pouring sealant. The pouring sealant has high flowability and thermal conductivity of higher than 1.0 W.m<-1>.K<-1>, and can be widely applied to the fields of electronic apparatuses, automobiles, chip encapsulation, LED (Light-Emitting Diode) encapsulation and the like having high requirements on heat conducting performance; and a condensate has high mechanical property and high electrical property.

A resistive composition for screen printing onto a substrate. The resistive composition, based on total composition has a) 5-30 wt. % of polymer resin, b) greater than 0 up to and including 10 wt. % of thermosetting resin, c) 10-30 wt. % conductive particles selected from the group consisting of carbon black, graphite and mixtures thereof and d) 0.025-20 wt. % carbon nanoparticles, wherein all of (a), (b), (c) and (d) are dispersed in a 60-80 wt. % organic solvent.