342 results about "Cohesive strength" patented technology

A porous composite material useful in semiconductor device manufacturing, in which the diameter (or characteristic dimension) of the pores and the pore size distribution (PSD) is controlled in a nanoscale manner and which exhibits improved cohesive strength (or equivalently, improved fracture toughness or reduced brittleness), and increased resistance to water degradation of properties such as stress-corrosion cracking, Cu ingress, and other critical properties is provided. The porous composite material is fabricating utilizing at least one bifunctional organic porogen as a precursor compound

A low-k dielectric material with increased cohesive strength for use in electronic structures including interconnect and sensing structures is provided that includes atoms of Si, C, O, and H in which a fraction of the C atoms are bonded as Si—CH3 functional groups, and another fraction of the C atoms are bonded as Si—R—Si, wherein R is phenyl, —[CH2]n— where n is greater than or equal to 1, HC═CH, C═CH2, C═C or a [S]n linkage, where n is a defined above.

Consistent with the present invention, tissue adhesive compositions and an associated laser exposure system are provided for bonding or sealing biological tissues. The compositions are comprised of chemically derivatized soluble collagen which is formulated to concentrations ranging from 300 mg / ml (30%) to 800 mg / ml (80%) collagen protein. In particular, Type I collagen, for example, is first prepared by extraction from bovine or porcine hide and purified. The collagen preparations are then chemically derivatized with sulfhydryl reagents to improve cohesive strength and with secondary derivatizing agents, such as carboxyl groups, to improve the adhesive strength of the solder to the tissue. The compositions are then formed into viscous solutions, gels or solid films, which when exposed to energy generated from an infrared laser, for example, undergo thermally induced phase transitions. Solid or semi-solid protein compositions become less viscous enabling the high concentration protein to penetrate the interstices of treated biological tissue or to fill voids in tissue. As thermal energy is released into the surrounding environment, the protein compositions again become solid or semi-solid, adhering to the treated tissue or tissue space.

Hot-melt processable adhesive, such as pressure-sensitive-adhesive (PSA) or heat-activatable adhesive, compositions of the present invention possess a broad formulation latitude and adequate cohesive strength after application for use in high performance applications. Hot-melt processable adhesives of the invention comprise at least one block copolymer comprising at least two A blocks and at least one B block. The A and B blocks are derived from monoethylenically unsaturated monomers, which monomers result in saturated polymer backbones without the need for subsequent hydrogenation upon their polymerization. Preferably, the block copolymer is a (meth)acrylate block copolymer.

Methods of forming dielectric films comprising Si, C, O and H atoms (SiCOH) or Si, C, N and H atoms (SiCHN) that have improved cohesive strength (or equivalently, improved fracture toughness or reduced brittleness), and increased resistance to water degradation of properties such as stress-corrosion cracking, Cu ingress, and other critical properties are provided. Electronic structures including the above materials are also included herein.

Dielectric materials including elements of Si, C, O and H having specific values of mechanical properties (tensile stress, elastic modulus, hardness cohesive strength, crack velocity in water) that result in a stable ultra low k film which is not degraded by water vapor or integration processing are provided. The dielectric materials have a dielectric constant of about 2.8 or less, a tensile stress of less than 45 MPa, an elastic modulus from about 2 to about 15 GPa, and a hardness from about 0.2 to about 2 GPa. Electronic structures including the dielectric materials of the present invention as well as various methods of fabricating the dielectric materials are also provided.

A process for printing images by means of an electrographic or electrostatic device using a toner that is cured by multiple applications of energy. The toner has energy-activated reactive components such as radiation-curable sites and reactive functional groups. An image is formed on a substrate by the toner without materially activating the reactive components. The reactive components are subsequently activated by applying a first energy source to adhere the image to the substrate by cross-linking and bonding the image permanently to the substrate, or by transferring the image to a second substrate. A second energy source is applied simultaneously with, or subsequently to, the first energy source, to promote cohesive strength of the image by cross-linking within the toner particles that form the image. The resulting image is permanently bonded to the substrate, yielding substantially enhanced image durability and fastnesses.

Dielectric materials including elements of Si, C, O and H having specific values of mechanical properties (tensile stress, elastic modulus, hardness cohesive strength, crack velocity in water) that result in a stable ultra low k film which is not degraded by water vapor or integration processing are provided. The dielectric materials have a dielectric constant of about 2.8 or less, a tensile stress of less than 45 MPa, an elastic modulus from about 2 to about 15 GPa, and a hardness from about 0.2 to about 2 GPa. Electronic structures including the dielectric materials of the present invention as well as various methods of fabricating the dielectric materials are also provided.

Dielectric materials including elements of Si, C, O and H having specific values of mechanical properties (tensile stress, elastic modulus, hardness cohesive strength, crack velocity in water) that result in a stable ultra low k film which is not degraded by water vapor or integration processing are provided. The dielectric materials have a dielectric constant of about 2.8 or less, a tensile stress of less than 45 MPa, an elastic modulus from about 2 to about 15 GPa, and a hardness from about 0.2 to about 2 GPa. Electronic structures including the dielectric materials of the present invention as well as various methods of fabricating the dielectric materials are also provided.

A mechanically robust semiconductor structure with improved adhesion strength between a low-k dielectric layer and a dielectric-containing substrate is provided. In particular, the present invention provides a structure that includes a dielectric-containing substrate having an upper region including a treated surface layer which is chemically and physically different from the substrate; and a low-k dielectric material located on a the treated surface layer of the substrate. The treated surface layer and the low-k dielectric material form an interface that has an adhesion strength that is greater than 60% of the cohesive strength of the weaker material on either side of the interface. The treated surface is formed by treating the surface of the substrate with at least one of actinic radiation, a plasma and e-beam radiation prior to forming of the substrate the low-k dielectric material.

The tantalum powder for capacitors of the present invention has a specific surface area SB as determined by the BET method of 1.3 m<2> / g or more, and an SB / SF ratio between the specific surface area SB as determined by the BET method and the specific surface area SF determined by the FSS method of 4 to 10. This tantalum powder not only has a large specific surface area SB, but also has suitable cohesive strength and uniform porosity.Consequently, a solid state electrolytic capacitor having high capacitance and low ESR can be obtained by providing with a capacitor anode formed from a sintered body of this tantalum powder. In addition, whether or not this tantalum powder is suitable for the production of a tantalum capacitor having high capacitance and low ESR can be determined easily and reliably by evaluating the tantalum powder using the specific surface area SB as determined by the BET method and the SB / SF ratio between SB and the specific surface area SF determined by the FSS method.

The tantalum powder for capacitors of the present invention has a specific surface area SB as determined by the BET method of 1.3 m2 / g or more, and an SB / SF ratio between the specific surface area SB as determined by the BET method and the specific surface area SF determined by the FSS method of 4 to 10. This tantalum powder not only has a large specific surface area SB, but also has suitable cohesive strength and uniform porosity. Consequently, a solid state electrolytic capacitor having high capacitance and low ESR can be obtained by providing with a capacitor anode formed from a sintered body of this tantalum powder. In addition, whether or not this tantalum powder is suitable for the production of a tantalum capacitor having high capacitance and low ESR can be determined easily and reliably by evaluating the tantalum powder using the specific surface area SB as determined by the BET method and the SB / SF ratio between SB and the specific surface area SF determined by the FSS method.

Acrylate copolymer pressure-sensitive adhesive constructions are described which provide excellent retention of rivet properties. Tenting around rivets is minimized even after undergoing thermal aging while in contact with additive rich films like PVC. This is achieved by the inclusion of a synergistic amount of an N-vinyl lactam monomer and acid monomer with the bulk of the monomers being an alkyl acrylate save and / or methacrylate esters. A concomitant increase in cohesive strength is also achieved which affords good removal characteristics. The use of appropriate adhesive blends is further disclosed which allows retention of these features while also improving cold temperature properties.

The invention relates to a super early strength polymer rapid-patching motar material prepared from the following components in percentage by weight: 36-50 rapid hardening cement, 42-54 quartz sand, 2-10 polymer tackifier, 0.1-0.5 thickener, 0.1-0.8 early strength agent, 0.15-0.9 set-controlling admixture, 0.1-0.6 water reducing agent, 0.02-0.1 antifoaming agent and 0.01-0.08 chemical staple. Thesuper early strength rapid-patching motar has excellent construction performance and is characterized by rapid hardening and slow setting, the initial setting time is more than or equal to 30 minutes, the final setting time is smaller than or equal to 2 hours, the compression strength in 3 hours can reach more than 25 MPa, the later strength is stably increased, the pulling cohesive strength between the motar and a concrete interface can reach more than 2.5MPa, and the super early strength rapid-patching motar also has the advantages of good waterproofness and impermeability, strong crack resistance, convenient use, and the like, and can be used for the rapid patching of bridge and road surfaces, especially for the rapid patching of beam surfaces and beam bodies of passenger special lines.

A mechanically robust semiconductor structure with improved adhesion strength between a low-k dielectric layer and a dielectric-containing substrate is provided. In particular, the present invention provides a structure that includes a dielectric-containing substrate having an upper region including a treated surface layer which is chemically and physically different from the substrate; and a low-k dielectric material located on a the treated surface layer of the substrate. The treated surface layer and the low-k dielectric material form an interface that has an adhesion strength that is greater than 60% of the cohesive strength of the weaker material on either side of the interface. The treated surface is formed by treating the surface of the substrate with at least one of actinic radiation, a plasma and e-beam radiation prior to forming of the substrate the low-k dielectric material.

The invention discloses an organic silicon potting adhesive with a high heat conduction capacity. The curing time of the additive type organic silicon potting adhesive with a high heat conduction capacity can be controlled by the temperature and the amount of the catalyst. The condensate has good mechanical and electrical properties, especially outstanding cohesive strength, high and low temperature resistance and radiation resistance. The inventive heat-conducting organic silicon potting adhesive includes component A and B: said component A is mixed by following parts by weight: 100 shares of organic silica-base adhesive, 10-80 shares of heat-conducting filling, 3-20 shares of reinforced-filling, 1-10 shares of catalyst; said component A is mixed by following parts by weight: 100 shares of organic silica-base adhesive, 10-80 shares of heat-conducting filling, and 1-10 shares curing agent.

The present invention relates generally to synthetic polymer compositions that form interpenetrating polymer networks. In a preferred embodiment, the compositions comprise two multifunctionally activated synthetic polymers, along with a tensile strength enhancer. Such compositions form matrices that exhibit superior cohesive strength and in many instances can serve as adequate replacements for surgical means of attaching tissues, such as sutures, sponges and medical staples.

Compositions and methods of their use to adhere a variety of materials together are disclosed herein. The compositions include at least multivalent metal compound, an effective amount of a compound that is structurally similar to phosphoserine, and can be mixed with an aqueous solution. The compositions provide adhesive and cohesive strength in both wet and dry environments which exhibit bond strength upon curing with the possible usage as bone cement for bone filler applications.

Hydrocolloid-containing pressure-sensitive adhesive compositions for medical use are disclosed which contain networks of fibrillated polymeric fibers that have surface areas of at least 4 square meters per gram and which have superior properties of low cold flow and high cohesive strength.

Consistent with the present invention, tissue adhesive compositions and an associated laser exposure system are provided for bonding or sealing biological tissues. The compositions are comprised of chemically derivatized soluble collagen which is formulated to concentrations ranging from 300 mg / ml (30%) to 800 mg / ml (80%) collagen protein. In particular, Type I collagen, for example, is first prepared by extraction from bovine or porcine hide and purified. The collagen preparations are then chemically derivatized with sulfhydryl reagents to improve cohesive strength and with secondary derivatizing agents, such as carboxyl groups, to improve the adhesive strength of the solder to the tissue. The compositions are then formed into viscous solutions, gels or solid films, which when exposed to energy generated from an infrared laser, for example, undergo thermally induced phase transitions. Solid or semi-solid protein compositions become less viscous enabling the high concentration protein to penetrate the interstices of treated biological tissue or to fill voids in tissue. As thermal energy is released into the surrounding environment, the protein compositions again become solid or semi-solid, adhering to the treated tissue or tissue space.

A bioadhesive for bonding to wet skin is disclosed, including a novel non-Hevea-based resin, which serves as a tackifier for the rubber, possessing strong wet adhesion to human skin and the remarkable property of bonding to it underwater, and a novel non-Hevea rubber that provides cohesive strength to the adhesive. Pressure-sensitive adhesive tapes are used in many applications where there is a need to adhere to skin, for example, medical tapes, wound or surgical dressings, athletic tapes, surgical drapes, or tapes or tabs used in adhering medical devices such as sensors, electrodes, ostomy appliances, and so on.

Treatment compositions in the shape of a strip or patch include a substantially solid adhesive layer and a treatment gel. A barrier layer may be included on an outer surface of the adhesive layer to form a treatment strip. The adhesive layer comprises a substantially solid adhesive composition that has increased adhesiveness to oral tissue when moistened with saliva or water. The adhesive layer is formed from an intermediate composition that is heated to drive off the solvent. Using a treatment gel separate from the adhesive layer improves the potency and stability of an active agent that is sensitive to heat, as the treatment gel is typically not heated prior to use like the adhesive layer. The adhesiveness of the treatment composition or strip facilitates placement over a person's teeth. The moistened adhesive composition reliably adheres the treatment composition or strip against a user's teeth during a desired procedure. Because a substantial portion of the adhesive composition remains solid or semi-solid during treatment, the adhesive composition maintains a substantial portion of its adhesive properties and internal cohesive strength compared to, e.g., a treatment gel used by itself.

An optical fingerprint imaging system comprises an optically transparent platen and a protective film removably attached to the platen with an adhesive. The protective film protects the platen from scratches, pits, and other surface damage and is substantially chemically inert to petroleum-based substances which may come into contact when receiving a finger pressed to take a fingerprint image. The adhesive has a selected cohesive strength that allows the protective film and adhesive to be removed from the platen without leaving behind an adhesive residue. The protective film can be replaced periodically as part of maintenance of the platen to allow continued acquisition of accurate fingerprint images. A method for protecting a platen is also disclosed.

Dental bleaching devices in the shape of a dental tray or tray-like form include an outer barrier layer and an inner bleaching layer. The bleaching layer comprises a substantially solid dental bleaching composition that has increased adhesiveness to teeth when moistened with saliva or water. The shape of the dental bleaching device facilitates placement of the device over a person's teeth with substantially less manipulation compared to the use of initially flat bleaching strips. The substantially solid dental bleaching composition becomes more adhesive when moistened with saliva or water, yet remains intact and coherent after the dental bleaching device is placed over a person's teeth during bleaching. The result is that the moistened dental bleaching composition is able to reliably adhere the dental bleaching device against a user's teeth during a bleaching procedure. However, because a substantial portion of the dental bleaching composition remains solid or semi-solid during bleaching, the bleaching composition maintains a substantial portion of its adhesive properties and internal cohesive strength.

An apparatus includes a connection sheet having a separator layer and an adhesive film layer formed on the separator layer such that said adhesive film layer can be peeled from the separator layer. The cohesive strength of the adhesive film layer decreases when the adhesive film layer is heated to a predetermined temperature. Electronic parts each have an electrode surface and at least one electrode on the electrode surface. The electrode surface of each of the electronic parts is affixed to the adhesive film layer such that the adhesive film layer coats all exposed portions of the electrode surface and coats all exposed surfaces of the at least one electrode.

Compositions and methods of their use to adhere a variety of materials together are disclosed herein. The compositions include at least tetra calcium phosphate, an effective amount of a compound that is structurally similar to phosphoserine, and can be mixed with an aqueous solution. The compositions provide adhesive and cohesive strength in both wet and dry environments and exhibit significant bond strength upon curing.

A process for printing images by means of an electrographic or electrostatic device using a toner that is cured by multiple applications of energy. The toner has energy-activated reactive components such as radiation-curable sites and reactive functional groups. An image is formed on a substrate by the toner without materially activating the reactive components. The reactive components are subsequently activated by applying a first energy source to adhere the image to the substrate by cross-linking and bonding the image permanently to the substrate, or by transferring the image to a second substrate. A second energy source is applied simultaneously with, or subsequently to, the first energy source, to promote cohesive strength of the image by cross-linking within the toner particles that form the image. The resulting image is permanently bonded to the substrate, yielding substantially enhanced image durability and fastnesses.

An optical fingerprint imaging system comprises an optically transparent platen and a protective film removably attached to the platen with an adhesive. The protective film protects the platen from scratches, pits, and other surface damage and is substantially chemically inert to petroleum-based substances which may come into contact when receiving a finger pressed to take a fingerprint image. The adhesive has a selected cohesive strength that allows the protective film and adhesive to be removed from the platen without leaving behind an adhesive residue. The protective film can be replaced periodically as part of maintenance of the platen to allow continued acquisition of accurate fingerprint images. A method for protecting a platen is also disclosed.

The invention provides a water-based room temperature crosslinking acrylic acid emulsion and a preparation method thereof, wherein, the water-based room temperature crosslinking acrylic acid emulsion comprises the following components by weight percent: 10-40% of methylmethacrylate, 0-40% of styrene, 0-3% of methacrylic acid, 0.5-1.5% of acrylic acid, 0.5-2% of N-hydroxylacrylamide, 1-3% of ethylmethacrylate, 1-23% of butyl methacrylate, 1-3% of emulsifier, 0.3-1% of initiator, 0.1-0.5% of sodium bicarbonate, 3-9% of neutralizer, 30-60% of water, 0.1-1% of inhibition stabilizer and 0.05-2% of crosslinking agent. In the process of polymerization, the crosslinking monomers (modified monomers) like acrylic acid, methacrylic acid and N-hydroxylacrylamide are introduced to perform carboxyl crosslinking, hydroxyl crosslinking and amido crosslinking with copolymer so that the cohesive strength, heat resistance and ageing resistance of emulsion are obviously increased and the stability of emulsion is increased; the inhibition stabilizer is used so as to prolong the service life.