High heat-conducting thin graphene-based composite material, as well as preparation method and application thereof

A technology of thin-layer graphene and composite materials, applied in the field of material science, can solve the problems of unsatisfactory performance, large amount of addition, high cost, etc., and achieve the effects of low cost, good mechanics, and excellent thermal conductivity

Inactive Publication Date: 2013-05-29
苏州格瑞丰纳米科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these high thermal conductivity materials still have defects such as high cost and large amount of addition, and the performance cannot meet the requirements.

Method used

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  • High heat-conducting thin graphene-based composite material, as well as preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Example 1 Preparation of graphene / graphite / acrylic resin thermally conductive composite

[0026] 1) Take 1g of thin-layer graphene, add it to 28g of acrylic resin, stir it mechanically for 15 minutes, add 5g of graphite flakes and continue mechanical stirring for 45 minutes to obtain a thermally conductive compound, process the compound into a film, and form a thermally conductive adhesive , thermal conductivity greater than 1.5w / mK.

[0027] 2) Take 1.5g thin-layer graphene, add it to 25g acrylic acid resin, stir mechanically for 15 minutes, add 13.5g graphite sheet and continue stirring for 45 minutes to obtain a thermally conductive resin compound, and process the compound into a film , forming a thermally conductive adhesive with a thermal conductivity of 2W / mK.

Embodiment 2

[0028] Example 2 Preparation of graphene / magnesia / silicone rubber thermally conductive compound

[0029] 1) Add 0.5g thin-layer graphene to 50g silicone rubber, add 9.5g magnesium oxide powder after mechanical stirring for 15 minutes, continue mechanical stirring for 45 minutes, then add 10g curing agent, and cure at 70°C for 12 hours to obtain a thermally conductive compound things. The compound is processed into a thermal pad with a thermal conductivity greater than 3W / mK

[0030] 2) Add 1g of thin-layer graphene to 45g of silicone rubber, stir mechanically for 15 minutes, add 9g of magnesium oxide powder, continue stirring for 45 minutes, then add 9g of curing agent, and cure at 70°C for 12 hours to obtain a thermally conductive silicone rubber compound . The compound is processed into a thermal pad with a thermal conductivity greater than 3.5W / mK.

Embodiment 3

[0031] Embodiment 3 Graphene / aluminum oxide / epoxy resin thermally conductive compound

[0032] 1) Add 1.5g of thin-layer graphene to 50g of epoxy resin, stir mechanically for 15 minutes, add 8.5g of alumina, continue stirring for 45 minutes, add 50g of curing agent, and cure for 12 hours to obtain an epoxy resin thermally conductive compound . The compound is processed into a block, and the thermal conductivity is greater than 1.5W / mK

[0033] 2) Add 1g of thin-layer graphene to 60g of epoxy resin, stir mechanically for 15 minutes, add 9g of alumina, continue stirring for 45 minutes, add 60g of curing agent, and cure for 12 hours to obtain an epoxy resin thermally conductive compound. The compound is processed into a block, and the thermal conductivity is greater than 1.2W / mK.

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Abstract

The invention discloses a high heat-conducting thin graphene-based composite material, as well as a preparation method and an application thereof. The composite material comprises a base body component and a packing component, wherein the base body component and the packing component respectively include thin graphene, polymer and / or polymer monomer and a high heat-conducting material; the preparation method comprises a step of compounding the base body component with the packing component; the compounding method comprises fusing, ball-milling, solution blending, electrostatic spinning, solution spinning, melt-spinning, extruding by double screws, mixing by an open mill or powder metallurgy. The polymer, the thin graphene, the traditional high heat-conducting material and the like are compounded by a simple process, so as to form the product with excellent heat conducting property, and good mechanical and electrical properties. Therefore, the process is easy to perform and control, and cost is low; and the obtained product has a wide application prospect in the aspects such as efficient heat conduction and radiation.

Description

technical field [0001] The invention particularly relates to a high thermal conductivity thin-layer graphene-based composite material, its preparation method and application, and belongs to the field of material science. Background technique [0002] Due to the characteristics of easy processing, light weight, stable properties, and low cost, polymers are widely used in production and life, especially in thermal interface. However, their thermal conductivity is poor, and it is difficult to meet the requirements of practical applications. Therefore, it is necessary to add some high thermal conductivity fillers to increase its thermal conductivity. Currently commonly used fillers are boron nitride, aluminum oxide, magnesium oxide, aluminum nitride, silicon nitride and some metal particles. However, these high thermal conductivity materials still have defects such as high cost and large amount of addition, and the performance cannot meet the requirements. Contents of the inv...

Claims

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Application Information

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IPC IPC(8): C08K3/04C08K7/00C08K7/06C08K3/38C08K3/28C08K3/34C08K3/08C08K3/22C08K3/02C08L79/02C08L79/04C08L65/00C08L63/00C08L83/04C08L23/06C08L23/12C08L27/06C08L27/16C08L27/18C08L39/06C08L29/04C08L33/02C08L61/06C08L33/12C08L71/08C08L69/00C08L79/08C08L77/00C09K5/14
Inventor 刘立伟李伟伟邱胜强郭玉芬魏相飞高嵩龙明生刘平
Owner 苏州格瑞丰纳米科技有限公司
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