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Multi-beam tile type TR component

A multi-beam and component technology, applied in electrical components, transmission systems, etc., can solve the problems that hinder the wide application of multi-beam phased arrays, low integration, and high application costs, and achieve wide application value and applicability, great flexibility. scalability and scalability, the effect of improving integration

Active Publication Date: 2018-08-24
CHENGDU T-RAY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] This application provides a multi-beam tile-type TR assembly, which is used to solve the existing problems in the prior art that the TR assembly of the multi-beam phased array has low integration, large volume and weight, high assembly difficulty, high application cost and many obstacles. Technical Problems of Wide Application of Beam Phased Array

Method used

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  • Multi-beam tile type TR component
  • Multi-beam tile type TR component
  • Multi-beam tile type TR component

Examples

Experimental program
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Embodiment 1

[0048] Please refer to figure 1 , figure 2 , image 3 , Figure 4 , Figure 5 , Embodiment 1 of the present application provides a multi-beam tiled TR component, including:

[0049] The TR active amplification module includes a TR active amplification board 101 and an antenna connection terminal 102, the TR active amplification board is used for amplifying and digital-to-analog conversion of radio frequency signals, and the antenna connection terminal is used for connecting the TR active The source amplifier board is connected to the antenna;

[0050] The multi-beam amplitude-phase modulation module is connected with the TR active amplification module 101, and includes a multi-beam amplitude-phase modulation board 103 and a radio frequency connection terminal 104, and the multi-beam amplitude-phase modulation board is used to form multi-beam signals and to the The multi-beam signals are independently adjusted and combined in amplitude and phase, and the radio frequency c...

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Abstract

The invention discloses a multi-beam tile type TR component, which can separately set an amplification processing module and a multi-beam amplitude-phase modulation module in a TR component, and thencan integrate a multi-beam forming function and an amplitude-phase modulation function through the multi-beam amplitude-phase modulation module. Thereby, the miniaturization and high-level integrationof a multi-beam phased array TR component can be achieved; and meanwhile, as a multi-beam vector modulation chip in the technical scheme of the embodiment of the application can perform independent amplitude modulation and phase modulation on multi-beam signals, great flexibility and scalability can be brought to the design of the multi-beam TR component, the size, weight and versatility of TR component application system equipment can be adjusted according to actual needs, and the technical effects of very extensive application values and applicability can be achieved in the field of microwave and millimeter wave radar communication with strict requirements for the above applications.

Description

technical field [0001] The invention relates to the technical field of wireless communication, in particular to a multi-beam tiled TR component. Background technique [0002] TR (Transmitter and Receiver, referred to as TR) refers to the part between the intermediate frequency and the antenna of the wireless transceiver system. [0003] In a multi-beam phased array radar, the TR component needs to be equipped with an independent amplitude-phase modulation and feeding unit for each beam signal. When the number of beam signals increases, more amplitude-phase control devices and feeding networks are required. At the same time, there are more radio frequency interfaces, control interfaces and power supply interfaces for the TR components to be interconnected with external components. Therefore, the traditional multi-beam phased array radar has complex design, low scalability, large volume and weight, high assembly difficulty, and high cost, which has caused many obstacles to pr...

Claims

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Application Information

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IPC IPC(8): H04B1/40
CPCH04B1/40
Inventor 罗烜喻涛
Owner CHENGDU T-RAY TECH CO LTD
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