Bi-component epoxide-resin adhesive and preparation method thereof

Abstract

The invention relates to a two-component epoxy resin adhesive, including the following components: novolac epoxy resin, lipid ring type epoxy resin and terminal carboxylic acrylonitrile butadiene rubber in component A, and 1, 4-di-benzene (2, 4-diaminobenzene oxygen) in component B, wherein, the mass percentage of the lipid ring type epoxy resin is 20-35 percent of the novolac epoxy resin, the mass percentage of the terminal carboxylic acrylonitrile butadiene rubber CTBN is 12 percent of the novolac epoxy resin and the mass percentage of the 1, 4-di-benzene (2, 4-diaminobenzene oxygen) is 15-20 percent of the novolac epoxy resin; and the preparation of the two-component epoxy resin adhesive includes the step of evenly mixing the component A and the component B for use. The two-component epoxy resin adhesive used for conductive adhesive has good heat resistance, average stretching and shearing strength of 21.28MPa, simple preparation process and operation without solvent, and plays the role of protecting environment.

Description

technical field [0001] The invention belongs to the field of preparation of organic adhesives, in particular to a two-component epoxy resin adhesive and a preparation method thereof. Background technique [0002] Conductive adhesive is a conductive material formed by uniformly dispersing conductive particles and additives in resin. With the development of the electronics industry, the use of conductive adhesive is becoming wider and wider. With the development of high technology, the heat resistance of conductive adhesives is increasingly demanding (long-term heat resistance above 200°C, instantaneous heat resistance at 250°C), especially in aviation, aerospace, military, electronics, electric power , automobiles, machinery, etc. The conductive adhesive is mainly composed of a resin matrix and conductive particles. The resin matrix endows the conductive adhesive with physical and mechanical properties, so the choice of the resin matrix is ​​very important. Novolac epoxy re...

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Problems solved by technology

[0003] At present, there are many researches on high temperature resistant adhesives in China, but there are not many adhesives that can achieve high connection strength and ideal heat resistance at the same time.

Beijing Institute of Aeronautical Materials Zhao Shenglong, Liu Qingfang and others introduced in the Supplement to Volume 23 of "Journal of Aeronautical Materials" in October 2003 that by mixing high-functionality epoxy resin AG-80 and bisphenol A epoxy resin, using mixed amine A type of curing agent has been made into an adhesive that can be cured at room temperature and can withstand heat at 200°C, but the tensile shear strength of this adhesive at high temperature is not ideal, only 3MPa

Wang Chao, Zhang Bin and others introduced a solvent-free high-temperature resistant epoxy resin in "China Adhesives", Volume 8, Issue 3, 1998, using bismaleimide as the matrix resin, with 4,4' - As a curing agent, diaminodiphenylmethane has a shear strength of up to 10MPa at 250°C, but its curing process is complicated, which is not conducive to construction

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