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175results about How to "High conductance" patented technology

Barrier first method for single damascene trench applications

Methods for forming a diffusion barrier on low aspect features of an integrated circuit include at least three operations. The first operation deposits a barrier material and simultaneously etches a portion of an underlying metal at the bottoms of recessed features of the integrated circuit. The second operation deposits barrier material to provide some minimal coverage over the bottoms of the recessed features. The third operation deposits a metal conductive layer. Controlled etching is used to selectively remove barrier material from the bottom of the recessed features, either completely or partially, thus reducing the resistance of subsequently formed metal interconnects.
Owner:NOVELLUS SYSTEMS

Method and Apparatus for Three-Dimensional Integration of Embedded Power Module

InactiveUS20070230221A1Reduces packaging overheadPackaging overhead is reducedTransformers/inductances coolingTransformers/inductances coils/windings/connectionsCo-fired ceramicInductor
A modified planar Low Temperature Co-Fired Ceramic (LTCC) high conductance inductor, embedding a large cross section conductor, supports a stacked arrangement of heat spreader, inductor and active device layers. Interlayer electrical connections connect the layers. Optionally, a DC-DC converter includes the modified planar LTCC high conductance inductor, embedding a large cross section conductor, supporting a stacked arrangement of heat spreader, capacitor and active device layers, the active devices layer including the switching transistors. The active devices layer may include semiconductor dies embedded in a substrate.
Owner:VIRGINIA TECH INTPROP INC

RF connectors having ground springs

Radio frequency (RF) connectors and electronics housings and packages employing one or more inventive RF connector(s) provided herein utilize a ground spring to achieve improved conductivity of the ground signal by making a plurality of contacts with a ferrule member of the RF connector's hermetic feedthru and a plurality of contacts with the electronics housing or package at points adjacent to an air dielectric. Ground springs used in connection with the present RF connectors maintain predetermined spring properties under compression and / or extreme environmental conditions, including thermal fluctuations, and therefore may be suitably employed in aircraft and spacecraft.
Owner:PACIFIC AEROSPACE & ELECTRONICS

P-type graphene/N-type germanium nanocone array schottky junction infrared photoelectric detector and preparation method thereof

The invention discloses a P-type graphene/N-type germanium nanocone array schottky junction infrared photoelectric detector and a preparation method thereof. The preparation method is characterized by comprising the following steps of forming an insulating layer on the front face of an N-type germanium basal layer in an evaporation manner by taking the N-type germanium basal layer as a base region of the photoelectric detector; arranging an N-type germanium nanocone array on the upper surface of the N-type germanium basal layer; transferring P-type graphene to the N-type germanium nanocone array covered with the insulating layer; coating the P-type graphene with indium tin oxide (ITO) nano-particles in a spin manner to realize a P-type graphene/N-type germanium nanocone array schottky junction-based photodiode. According to the infrared photoelectric detector disclosed by the invention, by utilizing the structure of the germanium nanocone array and the characteristic of the surface plasma resonance of the ITO nano-particles, the ability of absorbing light is enhanced, and the ability of responding to light is improved; the preparation method disclosed by the invention is simple, is suitable for mass production, and can be used for preparing the infrared photoelectric detector which has high light absorption ability and is high in photoelectric conversion efficiency, and a foundation is laid for applying the germanium nanocone array structure to the photoelectric detector.
Owner:HEFEI UNIV OF TECH

Organic electroluminescent device

An organic electroluminescent device includes an anode, a cathode and an organic functional layer between the anode and the cathode, in which at least one of hole injection layer, hole transport layer and electron transport layer includes a host material and an inorganic inactive material doped in the host material, and the inorganic inactive material is a halide, oxide or carbonate of metal.
Owner:TSINGHUA UNIV +2

Trivalent chromium electroplating solution of sulfate system and electroplating method thereof

The invention provides a trivalent chromium electroplating solution of a sulfate system. The trivalent chromium electroplating solution is characterized by comprising the following components in molarconcentration (mol / L): chromium sulfate0.2-0.6, potassium sulfate 0.5-1.5, ammonium bromide 0.02-0.5, boric acid 0.5-1.2, sodium hypophosphite 0.1-1, ferrous sulfate 0.01-0.1, complexing agent 0.2-2.0, thickening agent 0.01-0.5 and the balance of water. The invention also discloses an electroplating method for the electroplating solution. Compared with the prior art, the electroplating solution and the electroplating method have the advantages that: the electroplating solution is clean and pollution free, the thickness of the plating layer reaches 20 to 80mu m, the plating layer is smooth with few cracks and high bonding force, the source of raw materials is rich, the cost is lower, the performance-to-price ratio is good, the electroplating solution can be continuously used for electroplating for 0.5 to 5 hours, the hardness of the plating layer is 600 to 700HV, and after thermal treatment, the hardness of the plating layer can reach 1,200HV.
Owner:NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI
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