Patents
Literature
Hiro is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Hiro

109748 results about "Waste management" patented technology

Waste management (or waste disposal) are the activities and actions required to manage waste from its inception to its final disposal. This includes the collection, transport, treatment and disposal of waste, together with monitoring and regulation of the waste management process.

Vacuum cleaner having a cyclone type dust collecting apparatus

A vacuum cleaner includes a cleaner body, a suction brush, through which air and contaminants are drawn in, and a cyclone type dust collecting device. The cleaner body has a motor driving chamber and a dust collecting chamber in communication with the motor driving chamber. The cyclone type dust collecting device is mounted in the dust collecting chamber and separates by centrifugal force the contaminants from the air. The cyclone type dust collecting device includes a hollow cylindrical cyclone body having an open top, a closed bottom, and a contaminant outlet. The open top allows air and contaminants into the cyclone body, where the contaminants are separated from the air by centrifugation. The contaminants are then discharged from the cyclone body through the contaminant outlet. The cyclone type dust collecting device further includes a contaminant receptacle for collecting the contaminants discharged through the contaminant outlet, a base member hingedly connected to the contaminant receptacle, and a cover for covering the top of the cyclone body. The cover has an air inlet passage, through which air and contaminants drawn in through the suction brush enter into the cyclone body, an air outlet passage, through which the air is discharged from the cyclone body, and a contaminant separating grill. The grill extends downward from the air outlet passage into the cyclone body and has a plurality of fine holes.
Owner:SAMSUNG GWANGJU ELECTRONICS CO LTD

Thin film forming method

A thin film forming method includes: a first operation of supplying a source gas at a first flow rate into a reactor; a second operation of purging the source gas in the reactor to an exhaust unit; a third operation of supplying a reactive gas at a second flow rate into the reactor; a fourth operation of supplying plasma into the reactor; and a fifth operation of purging the reactive gas in the reactor to the exhaust unit, wherein, during the second to fifth operations, the source gas is bypassed to the exhaust unit, and a flow rate of the source gas bypassed to the exhaust unit is less than the first flow rate. According to the thin film forming method, the consumption of the source gas and the reactive gas may be reduced, and the generation of reaction by-products in the exhaust unit may be minimized.
Owner:ASM IP HLDG BV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products