High performance organosilicon epoxy material, preparation method and applications thereof

An organosilicon epoxy and cyclosiloxane technology, applied in epoxy resin coatings, epoxy resin adhesives, organic insulators, etc., can solve the problems of failing to take into account material transmittance, poor compatibility, and large interfacial tension.

Inactive Publication Date: 2013-09-25
GUANGZHOU CHEM CO LTD CHINESE ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the silicone-modified epoxy resin or epoxy-reinforced silicone material used above is prepared by adding silicone or single-phase epoxy curing. The two-phase interfacial tension of silicone and epoxy in the material is too large and compatible. Poor performance, failing to take into account other properties such as light transmittance of the material

Method used

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  • High performance organosilicon epoxy material, preparation method and applications thereof
  • High performance organosilicon epoxy material, preparation method and applications thereof
  • High performance organosilicon epoxy material, preparation method and applications thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0052] The preparation method of silicone epoxy material is as follows:

[0053] (1) Preparation of end-capped epoxy cyclosiloxane: add 0.5mol (90.1g) 1,3,5-trimethylcyclosiloxane to a round-bottomed flask equipped with a stirrer, reflux condenser, thermometer, and nitrogen port Trisiloxane C 3 h 12 o 3 Si 3 (provided by Beijing Huawei Ruike Chemical Co., Ltd.), 1.0mol (114.1g) allyl glycidyl ether (CH 2 =CHCH 2 OCH 2 CHCH 2O, provided by Energy Chemical) and 100ml cyclohexane, feed high-purity nitrogen into the reactor at room temperature and stir evenly, then gradually heat up to 70°C, and slowly add 0.4ml dropwise after the temperature is constant. 1g / 160ml of tetrahydrofuran solution of chloroplatinic acid was used as a catalyst. After the dropwise addition, it was reacted for 8 hours, and 59.3g of end-capping agent n-butanol and 0.15ml of the above-mentioned tetrahydrofuran solution of chloroplatinic acid were added to the reactor, and the reaction was continued fo...

Embodiment 2

[0058] The preparation method of silicone epoxy material is as follows:

[0059] (1) Preparation of end-capped epoxy cyclosiloxane: add 0.5mol (120.2g) 1,3,5,7-tetramethyl to a round bottom flask equipped with a stirrer, reflux condenser, thermometer, and nitrogen port Cyclotetrasiloxane C 4 h 16 o 4 Si 4 (Quzhou Ruilijie Chemical Co., Ltd. provides), 0.5mol (62.1g) 1,2-epoxy-4-vinyl epoxycyclohexane ( CH 2 = CHC 6 h 9 O, provided by Sigma Aldrich) and 150ml of xylene, feed high-purity nitrogen into the reactor at room temperature and stir evenly, then gradually heat up to 60°C, after the temperature is constant, slowly add 3.22ml of platinum chloride with a concentration of 1g / 160ml Acid isopropanol solution is used as a catalyst, and after the dropwise addition is completed, after reacting for 2 hours, add 176.7g of end-capping agent 1-heptene and 2.52ml of the above-mentioned isopropanol solution of chloroplatinic acid in the reactor, and continue to react for 6 hou...

Embodiment 3

[0065] The preparation method of silicone epoxy material is as follows:

[0066] (1) Preparation of end-capped epoxy cyclosiloxane: add 0.5mol (180.4g) 1,3,5,7,9 in a round bottom flask equipped with a stirrer, reflux condenser, thermometer, nitrogen port, 11-Hexamethylcyclohexasiloxane C 6 h 24 o 6 Si 6 (provided by Kingston Chemistry), 3.5mol (434.63g) 1,2-epoxy-4-vinylcyclohexane (CH 2 = CHC 6 h 9 O, Provided by Sigma Aldrich) and 100ml of toluene, feed high-purity nitrogen into the reactor at room temperature and stir evenly, then gradually heat up to 100°C, and add 0.10ml of dicyclopentadiene dichloride with a concentration of 1g / 160ml dropwise after the temperature is constant Platinum ethanol solution was used as a catalyst. After 24 hours of reaction, 20.0 g of capping agent ethanol and 0.01 ml of the above-mentioned dicyclopentadiene platinum dichloride ethanol solution were added to the reactor, and the solvent toluene and excess unreacted 1 , 2-epoxy-4-viny...

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Abstract

The invention belongs to the field of light emitting semiconductor packaging, and discloses a high performance organosilicon epoxy material, a preparation method and applications thereof. According to the present invention, a vinyl epoxy monomer and methylhydrosiloxane are subjected to a catalysis reaction for 2-24 h, an end capping agent and a catalyst are added to continuously carry out the reaction to obtain end capped epoxy cyclosiloxane, 0.1-5.0 parts of a cyclosiloxane ring opening agent, 0.01-80 parts of an epoxy curing agent and 0.01-5.0 parts of a curing catalyst are added to 100 parts of the end capped epoxy cyclosiloxane in batches, stirring is performed for 0.5-12.0 h under a nitrogen condition during the addition, an auxiliary agent is added, stirring is continuously performed for 0.5-3.0 h, and curing is performed to obtain the organosilicon epoxy material; and the material has characteristics of the epoxy resin and the organosilicon material, further has characteristics of excellent light transmittance, excellent adhesion, excellent mechanical strength, excellent heat resistance and excellent UV performance, and can be adopted as a LED packaging material, an optical lens material, a photoelectric conversion material, an integrated circuit packaging material, an insulation material, a coating material and an adhesive.

Description

technical field [0001] The invention belongs to the field of packaging of light-emitting semiconductors, and relates to a packaging material for sealing a light-emitting diode (LED) and an optical lens, in particular to a high-performance organosilicon epoxy material and a preparation method and application thereof. technical background [0002] Since the 21st century, energy problems have become more and more serious. Under the background of rising concerns about global energy shortages, energy conservation will be an important issue in the future. At present, lighting accounts for about 20% of the world's total energy consumption. If the traditional light sources with low energy consumption, long life, safety and environmental protection are used to replace traditional light sources with low efficiency and high power consumption, it will be strategic to the sustainable development of the world. meaning. Light-emitting diodes (LEDs), as a new generation of green solid-stat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/20C08G77/14C07F7/21H01L33/56H01L23/29H01B3/40H01B3/46C09D163/00C09D183/06C09J163/00C09J183/06
Inventor 刘伟区高南
Owner GUANGZHOU CHEM CO LTD CHINESE ACADEMY OF SCI
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