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High-heat-conductivity epoxy resin electronic binding glue

A technology of epoxy resin and bonding glue, which is applied in the field of bonding glue, can solve the problems of affecting mechanical properties, improving thermal conductivity limited, low thermal conductivity, etc., to reduce volume shrinkage, reduce thermal expansion coefficient, and high thermal conductivity Effect

Inactive Publication Date: 2011-07-20
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

But its thermal conductivity is too low, not only high filling is limited to improve thermal conductivity, but also high filling will lead to negative effects, such as seriously affecting mechanical properties

Method used

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  • High-heat-conductivity epoxy resin electronic binding glue

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] 70 parts of spherical alumina powder (domestic average particle size is 40 μm), 15 parts of bisphenol A epoxy resin, 5 parts of bisphenol F epoxy resin, 3.3 parts of allyl glycidyl ether, hydroxyl-terminated liquid nitrile rubber 5 parts, 0.5 parts of phenyltrimethoxysilane, 1.0 parts of fumed silica Aerosil R202, stirred evenly at room temperature to prepare component A; polyamide 300 and polyetheramine D-400 amine with a weight ratio of 1:1 kind of curing agent. Mix component A and amine curing agent in a weight ratio of 100:12, stir evenly at room temperature, cure the mixture at 25°C for 24 hours, and measure the thermal conductivity of the cured product.

Embodiment 2

[0038] 75 parts of spherical alumina powder (domestic average particle size is 40 μm), 14 parts of bisphenol A epoxy resin, 3 parts of bisphenol F epoxy resin, 3 parts of n-butyl glycidyl ether, hydroxyl-terminated liquid nitrile rubber 3.7 parts, 0.3 parts of phenyltrimethoxysilane, 0.8 parts of fumed silica Aerosil R2020, 0.2 parts of carbon black, and stir evenly at room temperature to obtain component A; weight of polyamide 651 and polyetheramine D-400 Amine curing agent with a ratio of 1:1. Mix component A and amine curing agent in a weight ratio of 100:9.8, stir evenly at room temperature, cure the mixture at 25°C for 36 hours, and measure the thermal conductivity of the cured product.

Embodiment 3

[0040] 80 parts of spherical alumina powder (domestic average particle size is 40 μm), 11 parts of bisphenol A epoxy resin, 3 parts of bisphenol F epoxy resin, 2.2 parts of phenyl glycidyl ether, 3 parts of hydroxyl-terminated liquid nitrile rubber 0.2 parts, 0.2 parts of γ-(glycidoxy) propyl trimethoxysilane, 0.4 parts of fumed silica AerosilR2020, 0.2 parts of carbon black, stir well at room temperature to obtain component A; D-400 Amine curing agent. Component A and amine curing agent were mixed in a weight ratio of 100:7.7, stirred evenly at room temperature, the mixture was cured at 25°C for 48 hours, and the thermal conductivity of the cured product was measured.

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Abstract

The invention relates to a high-heat-conductivity epoxy resin electronic binding glue. The invention is characterized in that the high-heat-conductivity epoxy resin electronic binding glue is prepared by mixing 100 parts by weight of a component A and 5-12 parts by weight of an amine curing agent; and the component A is prepared from the following raw materials in parts by weight: 70-85 parts of spherical aluminum oxide powder, 10-20 parts of epoxy resin, 2-3.5 parts of reactive diluent, 2.5-5 parts of toughener, 0.2-1 part of thixotropic agent and 0.1-0.5 part of coupling agent. The spherical aluminum oxide of the binding glue provided by the invention has higher filling volume than non-spherical aluminum oxide, and high heat conductivity for solids, and can quickly dissipate heat accumulated in the heating components; the filler with high filling volume can lower the thermal expansion coefficient and volume shrinkage, and thus, the binding glue is very suitable for binding electronic components; and the price of the spherical aluminum oxide is lower than that of boron nitride (BN) or aluminium nitride (ALN), and thus, the binding glue provided by the invention has the advantage of low cost.

Description

technical field [0001] The invention relates to an adhesive, in particular to a high thermal conductivity epoxy resin electronic adhesive, which belongs to the technical field of adhesive. Background technique [0002] Thermally conductive adhesives are mostly used for bonding and packaging of electronic and electrical components in electrical insulation applications. With the development of integrated circuits and assembly technology in the electronics industry, the volume of electronic components and logic circuits tends to be miniaturized, and their development towards multi-functionalization and integration will inevitably result in a substantial increase in heat generation, which is harmful to bonding and The thermal conductivity of packaging materials puts forward very high requirements, so improving thermal conductivity is an increasingly urgent problem. [0003] There are two ways to improve the thermal conductivity of polymers: 1. Synthesize structural polymers wit...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J163/02C09J163/04C09J11/04
Inventor 林荣杏王建斌陈田安
Owner YANTAI DARBOND TECH
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