471 results about "Metalorganics" patented technology

A method for depositing a Group IV semiconductor is disclosed. The method may include, providing a substrate within a reaction chamber and heating the substrate to a deposition temperature. The methods may further include, exposing the substrate to at least one Group IV precursor and exposing the substrate to at least one Group IIIA metalorganic dopant precursor. The methods may further include depositing a Group IV semiconductor on a surface of the substrate. Semiconductor device structures including a Group IV semiconductor deposited by the methods of the disclosure are also provided.

The present invention relates to the preparation process of one kind of composite carbon nanotube/polyethylene material. Single or multiple wall carbon nanotube is treated with oxidant to obtain functional carbon nanotube with hydroxyl, carbonyl and carboxyl groups on the surface; and further reacted with alkyl metallizing compound in inert atmosphere to connect metal organic matter component capable of catalyzing ethylene polymerization to obtain carbon nanotube supporting olefin polymerization catalyst. In the presence of alkyl metallizing compound as catalyst assistant, the prepared carbon nanotube supporting olefin polymerization catalyst catalyzes ethylene polymerization to obtain the composite carbon nanotube/polyethylene material. The composite material has two components homogeneously dispersed, electric and mechanical performance higher than other polyethylene material.

Conducting and superconducting doped, magnesium boride materials are formed by a process which combines physical vapor deposition with chemical vapor deposition by physically generating magnesium vapor in a deposition chamber and introducing a boron containing precursor and a dopant into the chamber which combines with the magnesium vapor to form the material. Embodiments include forming carbon-doped magnesium diboride film and powder with hybrid physical-chemical vapor deposition (HPCVD) by adding a carbon-containing metalorganic magnesium precursor, bis(methylcyclopentadienyl)magnesium, with a hydrogen carrier gas together with a borane precursor in a chamber having a source of magnesium vapor.

The up-conversion fluorescent powder is prepared by adopting a liquid-phase co-precipitation method and a thermal reaction method, and the up-conversion fluorescent material film is deposited by using a suspension coating film method or metal organic chemical vapor deposition. By adjusting the doping amount of Yb, Er, Tm and other rare-earth elements, the up-conversion fluorescent material can absorb near-infrared light with the wavelength between 800 and 2,000nm and emit visible light, and also can absorb ultraviolet light with the wavelength between 200 and 350nm and emit the visible light. The up-conversion fluorescent material film is applied to silicon-based thin-film solar cells, and the spectral absorption range of the silicon-based thin-film solar cells is widened. The silicon-based thin-film solar cells have the maximum photoelectric conversion efficiency in the visible light range, so the photoelectric conversion efficiency and the stability of the silicon-based thin-film solar cells can be improved by applying the up-conversion fluorescent material.

The invention relates to a preparation method of a bore diameter adjustable hierarchical pore metal organic skeleton nanometer material. The preparation method comprises the following steps: synthesizing terephthalic acid with a zircon salt at the existence of a conditioning agent through a solvent thermal method to form a micropore zirconium-based metal organic skeleton; activating the microporezirconium-based metal organic skeleton with a low boiling point solvent and then drying to obtain an activated micropore zirconium-based metal organic skeleton; and dispersing the activated microporezirconium-based metal organic skeleton into 0.8 to 5.6 mol/L of monocarboxylic acid at the temperature of 25 to 180 DEG C for etching so as to obtain the hierarchical pore metal organic skeleton nanometer material. The invention also relates to the obtained bore diameter adjustable hierarchical pore metal organic skeleton nanometer material and application thereof. In short, according to the preparation method in the invention, a part of micropores is retained in the process that hierarchical pores are formed through etching of monocarboxylic acid, so that the obtained hierarchical pore metalorganic skeleton has chemical stability and heat stability similar to those of an original micropore skeleton.

The invention discloses a manufacturing method for a distributed-feedback semiconductor laser with bar-shaped burying. According to the method, primary epitaxy is carried out to form a primary epitaxial wafer; a single-beam spherical light mode is utilized to manufacture a distributed-feedback bragg grating with a gradient wavelength; a metal-organic chemical vapor deposition technology is utilized to carry out grating burying; a mode of combination of reactive ion etching and a two-step wet etching is used to manufacture a ridged bar; the metal-organic chemical vapor deposition (MOVCD) technology is used to carry out high-temperature meltback and then bar-shaped burying is carried out by a rapid growth mode; a SiO2 buried bar and a InGaAsP protective layer are removed and P type InP cover coat and a P+ In GaAs contact layer is grown; a large dual-channel structure is manufactured, a SiO2 insulated dielectric film is deposited, a P side electrode is manufactured, a substrate is thinned, an N side electrode is manufactured, an optical film is evaporated and plated on an end surface, and a laser chip is manufactured finally. According to the manufacturing method provided in the invention, the manufactured laser has characteristics of low threshold, low resistance, wide and stable working temperature range, high reliability and high yield and the like.

The invention discloses a method for uninterrupted growth of a high-quality InGaN/GaN multi-quantum well (MQW). The method comprises the following steps of: carrying out uGaN epitaxial growth on a sapphire-patterned substrate, growing nGaN on uGaN, and then, growing an MQW stress release layer on nGaN; carrying out InGaN/GaN MQW epitaxial growth on the MQW stress release layer; repeatedly growing a plurality of InGaN/GaN MQWs on the InGaN/GaN MQW; and growing pAlGaN and pGaN needed by a GaN-based LED (Light Emitting Diode) on the InGaN/GaN MQWs. According to the method for the uninterrupted growth of the high-quality InGaN/GaN MQW, a metal organic chemical vapor deposition method is adopted, and the growth of the GaN is kept during the process of switching growing conditions for quantum wells and quantum barriers, namely the uninterrupted growth of the quantum wells, so that the time required for the growth of the MQW is shortened, the production efficiency is greatly increased, and meanwhile, an LED epitaxial wafer with the high-quality InGaN/GaN MQW is obtained.

The invention discloses an annular semiconductor laser of a vertical coupling structure and a preparing method thereof. An annular active resonator cavity is any one closed loop composed of ridge type waveguide and strip type waveguide, a P type electrode and an N type electrode are arranged on the annular active resonator cavity, laser light in the annular active resonator cavity is coupled to strip type straight waveguide through a vertical coupler, and the strip type straight waveguide outputs the laser light. An N type lower wrapping layer, a first gradual-change refractive index limiting layer, a first barrier layer, a multiple quantum well active layer, a second barrier layer, a second gradual-change refractive index limiting layer, a P type upper wrapping layer and a P type contacting layer which have preset thicknesses and concentration are successively formed by means of a metal organism chemical vapor deposition or molecular beam epitaxy method. A plurality of epitaxial layers are etched by using a SiO2 image as a mask, the etching depth is less than or equal to a first height and greater than or equal to a second height, and the annular active resonator cavity is transferred to a chip. The obtained annular semiconductor laser has the advantages of being simple in process, low in cost, stable in performance of parts, high in reliability and the like.

A large area comb-shaped sprinkler head for metal-organic chemical vapor deposition equipment is provided with two sets of comb-shaped sprinkler heads; the first set of comb-shaped sprinkler head consists of a gas A main pipe provided with a gas inlet and a plurality of gas A ventilation branch pipes which are lined in parallel; one end of each gas A ventilation branch pipe is communicated with the gas A main pipe and the other end is sealed; the second set of comb-shaped sprinkler head is provided with a gas B main pipe with the gas inlet and a plurality of gas B ventilation branch pipes which are lined in parallel; one end of each gas B ventilation branch pipe is communicated with the gas B main pipe and the other end is sealed; the gas A ventilation branch pipes and the gas B ventilation branch pipes are alternatively lined and connected into an integral structure; the gas A main pipe and the gas B main pipe are respectively arranged on the corresponding two sides of the integral structure; all gas A ventilation branch pipe and gas B ventilation branch pipes are opened with a plurality of sprinkler holes. The invention effectively feeds two source gases and separates them before they are sprayed into the reaction chamber, so as to evenly mix them before they reach above the substrate and react.

The invention relates to multiple-reaction cavity metallorganic chemical vapor deposition equipment comprising a gas transport system, reaction cavities, a tail gas treatment system, heaters and a wafer fetch and transport mechanism. The equipment is characterized by comprising two or more than two reaction cavities; the reaction cavities are mutually connected by the gas transport system; the equipment is provided with the tail gas treatment system; each reaction cavity is connected with the tail gas treatment device; a control valve is arranged in a pipeline; the reaction cavities are arranged in glove boxes; the wafer fetch and transport mechanism is arranged among the glove boxes; both ends of the wafer fetch and transport mechanism are respectively provided with a valve; and each cavity is provided with one heater. The invention has the advantages that the equipment is provided with a plurality of reaction cavities, can complete various process manufactures in one step and switches to another growth process after one growth process is ended, and thereby, the processing time and the energy sources are saved, the efficiency is improved, the cost is reduced and the product quality is improved.

The invention discloses a growing direction for GaN thin film based on Al2O3 underlay, which aims to solve the problem of generating excessive heat stress during the growing of AIN layer inserted under low temperature in prior art. The growing process of the Gan thin film is that: put the underlay of Al2O3 in the MOCVD reaction chamber where the chemical vapor deposition of metallorganics occurs; inflate the hydrogen or mixed gas of hydrogen and alkaline air to the reaction chamber and make heat treatment to the underlay chip; grow the GaN orAIN nucleating layer on the heat-processed underlay; grown the GaN top layer on the AIN interposed layer. The technological conditions of AIN interposed layer growing under high temperature is: 20 to 760 Torr in growing pressure, 900 to 1,100 degrees centrigrade in temperature, 120 mu mol/min in flow rate of aluminium resources and 1000 to 5000 sccm in flow rate of alkaline air. The GaN epitaxial layer grown by the method provided in the invention is applicable to making micro wave high power transistor based on GaN, LED and optical maser.

The method includes steps: (1) using method of metallorganics chemical vapor deposition or method of molecular beam epitaxy or method of gas phase epitaxy for hydride develops a thin layer of nucleation layer of aluminum nitride on crystal face of sapphire (0001) substrate or silicon carbide (0001) substrate or silicon (111) substrate; (2) developing a thicker buffer layer of semi insulating gallium nitride in high impedance; (3) developing aluminum-gallium-nitrogen barrier layer in high aluminum content including spatial isolation layer without aluminum-gallium-nitrogen doped, carrier supplying layer with aluminum-gallium-nitrogen doped; (4) developing a covering cap in thin layer of gallium nitride.

The invention discloses a substrate base rotary structure in the metal organic chemical vapor deposition (MOCVD) equipment, which is characterized by the following: (1) the big graphite boat in the reacting chamber revolves one public fixing point; the small graphite boat rotates each center point; (2) the motor anchors substrate base (big graphite boat) to revolve; (3) the motor anchors the substrate base (small graphite boat) rotates; (4) the high-temperature region (substrate base) and low-temperature region (rotary dynamic structure) are separated by heat-durability material, which transmits the rotary dynamics.

The present invention discloses a method for preparing p type ZnO film by Sb doping, belonging to the field of semiconductor doping technology. The invention relates to a p type Zno doping technology, particularly to a doping technology by metal organic chemical vapor deposition (MOCVD) technology, which uses organic source as the p type doping agent of ZnO. The method is characterized in: with antimony metallorganic as the doping source of p type ZnO, antimony doping p type ZnO film is prepared by metal organic chemical vapor deposition. When the temperature of a substrate is 250 DEG to 650 DEG C, the proportion of antimony doping to ZnO is controlled by adjusting the carrier gas flow rate of antimony metallorganic and zinc metallorganic to grow p type ZnO. The effect and benefit of the invention lies in a high-quality high-controllability p type ZnO growing technology is provided, which is an industrial production transplantable metal organic chemical vapor deposition technology, the difficulty of p type ZnO doping is overcome, thus to realize p-n junction type optoelectronic devices of ZnO.

The invention is a extension growing device for metal organic chemical gas phase deposition kalium nitride base film, it includes reactor, whose character lies in: the reacting room is tube type double layer structure, and it is made up interior tube and exterior tube, the interior tube cavity is reacting cavity, the interior and exterior are inserted in the upper and subjacent fixing device, there is cooling water cavity between the interior and the exterior, the outer wall of exterior tube is winded with conduction heating coil, there sets a black lead base in the interior tube, the black lead is set on a ceramic tube, the ceramic tube connects with gearing part. The reactor has water cooling system, in order to maintain the low temperature within reactor, especially the part above crystal piece and gas mixing room; it can prevent the occurrence of pre-reaction.

The invention discloses a light-emitting diode package structure manufacturing method, which comprises the following steps of: sequentially growing an n-type layer, an active layer and a p-type layer on an insulating substrate by utilizing a metal organic vapor phase epitaxial method; downwards photoetching one side of the upper surface of the p-type layer with the photoetching depth of reaching the surface of the n-type layer to form a first tabletop, downwards etching the other side with the etching depth of reaching the surface of the insulating substrate to form a second tabletop; manufacturing conductive through holes on the first and second tabletops, and filling conductive metals; manufacturing an insulating layer partially covering the upper surface of the p-type layer on the sideclose to the second tabletop; manufacturing a p electrode covering the insulating layer on the insulating layer; manufacturing an n electrode on the conductive through hole on the first tabletop; thinning the insulating substrate; manufacturing a first back electrode and a second back electrode on the two sides of the back of the insulating substrate to form a substrate of a device; packaging an optical element on the substrate of the device to finish manufacturing the device on the substrate; and cutting the device on the substrate into independent devices in a mechanical way.