Light-emitting diode package structure manufacturing method

Abstract

The invention discloses a light-emitting diode package structure manufacturing method, which comprises the following steps of: sequentially growing an n-type layer, an active layer and a p-type layer on an insulating substrate by utilizing a metal organic vapor phase epitaxial method; downwards photoetching one side of the upper surface of the p-type layer with the photoetching depth of reaching the surface of the n-type layer to form a first tabletop, downwards etching the other side with the etching depth of reaching the surface of the insulating substrate to form a second tabletop; manufacturing conductive through holes on the first and second tabletops, and filling conductive metals; manufacturing an insulating layer partially covering the upper surface of the p-type layer on the sideclose to the second tabletop; manufacturing a p electrode covering the insulating layer on the insulating layer; manufacturing an n electrode on the conductive through hole on the first tabletop; thinning the insulating substrate; manufacturing a first back electrode and a second back electrode on the two sides of the back of the insulating substrate to form a substrate of a device; packaging an optical element on the substrate of the device to finish manufacturing the device on the substrate; and cutting the device on the substrate into independent devices in a mechanical way.

Description

technical field [0001] The invention belongs to the technical field of semiconductors, and in particular refers to a method for preparing a light-emitting diode packaging structure by using a wafer-level in-situ packaging technology. Background technique [0002] At present, the preparation process of light-emitting diodes is generally divided into three main steps: material epitaxy, chip technology, and chip packaging. The basic function of semiconductor device packaging is to connect micro-sized chip electrodes to relatively large-sized electrode structures for practical use. [0003] The LED packaging process generally uses some kind of substrate, case or bracket, and the LED chip is bonded to the substrate, case or bracket in some way, and then the electrodes on the upper part of the chip are connected to each other through the gold wire ball bonding process. To the corresponding electrodes on the substrate, case or bracket to achieve electrical connection, and finally ...

AI Technical Summary

Problems solved by technology

Some chip-scale light-emitting diode packages (ASE Semiconductor Manufacturing Co., Ltd. ZL200610108560.4, China Taiwan Epistar Co., Ltd. US20100163907A1) have also been disclosed, but all still need to transfer substrates or multiple substrates multiple times, and their material costs and process costs are still high

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