1628 results about "Mixture formation" patented technology

Devices formed of or including biocompatible polyhydroxyalkanoates are provided with controlled degradation rates, preferably less than one year under physiological conditions. Preferred devices include sutures, suture fasteners, meniscus repair devices, rivets, tacks, staples, screws (including interference screws), bone plates and bone plating systems, surgical mesh, repair patches, slings, cardiovascular patches, orthopedic pins (including bone filling augmentation material), adhesion barriers, stents, guided tissue repair / regeneration devices, articular cartilage repair devices, nerve guides, tendon repair devices, atrial septal defect repair devices, pericardial patches, bulking and filling agents, vein valves, bone marrow scaffolds, meniscus regeneration devices, ligament and tendon grafts, ocular cell implants, spinal fusion cages, skin substitutes, dural substitutes, bone graft substitutes, bone dowels, wound dressings, and hemostats. The polyhydroxyalkanoates can contain additives, be formed of mixtures of monomers or include pendant groups or modifications in their backbones, or can be chemically modified, all to alter the degradation rates. The polyhydroxyalkanoate compositions also provide favorable mechanical properties, biocompatibility, and degradation times within desirable time frames under physiological conditions.

Polycrystalline diamond (PCD) carbide composites of this invention have a microstructure comprising a plurality of granules formed from PCD, polycrystalline cubic boron nitride, or mixture thereof, that are distributed within a substantially continuous second matrix region that substantially surrounds the granules and that is formed from a cermet material. In an example embodiment, the granules are polycrystalline diamond and the cermet material is cemented tungsten carbide. PCD carbide composites of this invention display improved properties of fracture toughness and chipping resistance, without substantially compromising wear resistance, when compared to conventional pure PCD materials.

The present disclosure provides methods for etching a silicon material in a device structure in semiconductor applications. In one example, a method for etching features in a silicon material includes performing a remote plasma process formed from an etching gas mixture including HF gas without nitrogen etchants to remove a silicon material disposed on a substrate.

At least one main air compressor makes a compressed ambient gas flow. The compressed ambient gas flow is delivered to a turbine combustor at a pressure that is greater than or substantially equal to an output pressure delivered to the turbine combustor from a turbine compressor as at least a first portion of a recirculated gas flow. A fuel stream is delivered to the turbine combustor, and a combustible mixture is formed and burned, forming the recirculated gas flow. A turbine power is produced that is substantially equal to at least a power required to rotate the turbine compressor. At least a portion of the recirculated gas flow is recirculated through a recirculation loop. An excess portion of the recirculated gas flow is vented or a portion of the recirculated gas flow bypasses the turbine combustor or both.

At least one main air compressor makes a compressed ambient gas flow. The compressed ambient gas flow is delivered to both master and slave turbine combustors at a pressure that is greater than or substantially equal to an output pressure delivered to each turbine combustor from each turbine compressor as at least a first portion of a recirculated gas flow. A fuel stream is delivered to each turbine combustor, and combustible mixtures are formed and burned, forming the recirculated gas flows. A master and slave turbine power are produced, and each is substantially equal to at least a power required to rotate each turbine compressor. At least a portion of the recirculated gas flow is recirculated through recirculation loops. At least a second portion of the recirculated gas flow bypasses the combustors or an excess portion of each recirculated gas flow is vented or both.