A two-fluid-phase cooling device for absorbing high thermal flux from
electronics devices and other thermally dissipating devices. It consists of a thermally conductive plate with thermally dissipating elements on one face and a semi-toroidal cavity in the opposite face with the cavity's axis perpendicular to the face of the plate, a liquid
refrigerant supply tube ending in a
thermodynamic cycle's
refrigeration expansion valve that directs jets of liquid to
impact the
conical surface in the center region of the semi-toroidal cavity in a direction along the cavity's axis and tangent to the
conical surface, a second plate with a semi-toroidal protrusion extending into the semi-toroidal cavity to form a thin, semi-toroidal channel between the two plates, and a seal between the liquid supply tube and the second semi-toroidal plate. In operation liquid
refrigerant jets strike the
conical surface generally tangential to the surface and flow at
high velocity in a thin film on the surface of the semi-toroidal cavity from its center radially to the outer edge of the toroidal channel, absorbing heat and boiling as it does so. The high radial acceleration forces caused by the liquid film moving at
high velocity on the cavity's
concave surface force the liquid film against the surface and create a pressure gradient that biases
evaporation toward the liquid / vapor interface. The vapor moves parallel to the liquid flow radially outwards between the liquid film and the surface of the semi-toroidal protrusion at very
high velocity, causing extreme turbulence in the liquid film and highly augmented
heat transfer between the heated plate and the liquid film, while the liquid film nevertheless remains intact and forced against the heated surface by radial acceleration and carried to a distance significantly greater than in conventional jet impingement systems. The device may also be composed of wedge-shaped sections of the semi-toroidal plates. It may further have two expansion valves in series in the liquid supply line, the first generating a small amount of vapor (increase in quality) so the resulting increase in flow volume greatly increases the velocity through the second expansion valve toward the heated surface to further enhance
heat transfer.