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78 results about "Cu doping" patented technology

Thermosensitive quantum dot material with core-shell structure and preparation method thereof

InactiveCN103074068AIsolation of electronic processesNo mutual interferenceLuminescent compositionsQuantum dotRoom temperature
The invention discloses a thermosensitive quantum dot material with a core-shell structure and a preparation method thereof, belonging to the technical field of preparation of semiconductor nanomaterials. A core of a quantum dot structure comprises Cu-doped InP quantum dots; on the basis of the core, the quantum dots are coated with an II-VI semiconductor ZnS isolating layer for isolating an inner material from an outer material, then coated with a green light-emitting II-VI semiconductor CdSe nanocrystal shell layer, and finally coated with a ZnS protective layer to enable the CdSe layer to become more stable, thus forming Cu@InP / ZnS / CdSe / ZnS quantum dots ultimately. The quantum dots are highly sensitive to temperature, specifically at different temperatures, the thermosensitive quantum dot material can emit different colors of light: green light is emitted at room temperature, red light is emitted at 200 DEG C, while yellow light at different levels is emitted at an intermediate temperature; the quantum dots are stable in properties, uniform in size and good in dispersion; and after being coated with a shell layer, the quantum dots become perfect spherical particles.
Owner:JILIN UNIV

Cu-doping modified TiO2 photocatalyst and preparation method thereof

The invention discloses a Cu-doping modified TiO2 photocatalyst. The Cu-doping modified TiO2 photocatalyst grows on a copper-titanium alloy wire or bar base body and has a two-dimensional structure on the peripheral surface of the copper-titanium alloy wire or bar base body, and the structural unit of the Cu-doping modified TiO2 photocatalyst is a Cu-doping TiO2 nanotube. The invention also discloses a preparation method of the Cu-doping modified TiO2 photocatalyst. The preparation method can be used for directly growing a Cu-doping TiO2 nanotube array which has the two-dimensional structure and higher visible light response property on the copper-titanium alloy wire or bar base body through an electrochemical anode oxidation method. The Cu-doping TiO2 photocatalyst with the two-dimensional structure, which is disclosed by the invention, enlarges the specific area of a TiO2 photocatalyst and effectively extends the forbidden bandwidth of the TiO2 photocatalyst, thereby outstandingly enhancing the adsorptive capacity on a degradation product and obtaining the high-efficiency absorption on a solar spectrum; and the Cu-doping TiO2 photocatalyst is conductive to improving the visible light catalytic activity and has the advantages of good recoverability of the TiO2 photocatalyst, simple process, low cost and high controllable degree.
Owner:RESEARCH INSTITUTE OF TSINGHUA UNIVERSITY IN SHENZHEN

Composite catalytic material capable of synchronously capturing and recycling carbon dioxide and preparation method thereof

The invention discloses a composite catalytic material capable of synchronously capturing and recycling carbon dioxide and a preparation method thereof. In the preparation method, transition metal (Ni or Fe) catalytically graphitized or partially graphitized ordered mesoporous carbon is taken as a carrier, a Cu-doped nano semiconductor photocatalyst (TiO2, ZnO and the like) is taken as an active ingredient which is introduced by an immersion method, and the composite catalytic material can be prepared by the steps of drying, heat treatment and the like. The composite material has high CO2 adsorbing and capturing capacity under the environmental condition, and can catalyze (including photocatalysis) the CO2 to react with water to generate organic fuels with high added value, such as hydrocarbon, alcohol and the like.
Owner:李溪

Cu-doped ZnO/graphene composite photocatalyst and preparation method thereof

The invention discloses a Cu-doped ZnO/graphene composite photocatalyst and a preparation method thereof. The method comprises the following steps: mixing graphite oxide and a surfactant CTAB (cetyl trimethyl ammonium bromide) in distilled water and carrying out ultrasonic treatment to obtain a first precursor reactant; dissolving zinc acetate and cupric acetate in the distilled water and carrying out ultrasonic treatment to obtain a second precursor reactant; dissolving hexamethylenetetramine and sodium citrate in the distilled water and carrying out ultrasonic treatment to obtain a third precursor reactant; after mixing the first precursor reactant and the second precursor reactant, carrying out ultrasonic treatment, then mixing the obtained product and the third precursor reactant, controlling reaction temperature in the range of 70 DEG C to 120 DEG C and performing reaction; sealing, naturally cooling, standing and carrying out extraction filtration to obtain filter residues; and after drying the filter residues, carrying out annealing treatment. According to the invention, addition of graphene reduces electron-hole compounding possibility; and meanwhile, introduction of Cu ions can be used as an ion trap to temporarily capture a charge carrier and inhibit electron-hole compounding so as to obviously improve photocatalytic efficiency of the product.
Owner:SOUTH CHINA UNIV OF TECH

Flexible CdTe thin film solar cell, and preparation method and application thereof

The invention belongs to the photovoltaic new energy material and device field, and discloses a flexible CdTe thin film solar cell, and a preparation method and application thereof. The flexible CdTethin film solar cell, and the preparation method and application thereof are characterized in that a mature upper substrate structure CdTe cell preparation technology can be employed on a temporary metal substrate to obtain temporary metal substrate thin layer after completion of cell preparation, thus avoiding technical limitation of back contact preparation, Cu doping, CdS / CdTe heat treatment and the like, caused by the deposition sequence of functional layers, and being conductive to optimization of the cell preparation technology.
Owner:JINAN UNIVERSITY

Method for preparing Cu doped TiN alloy layer on surface of titanium alloy

The invention discloses a method for preparing a Cu doped TiN alloy layer on the surface of a titanium alloy, which comprises the following steps of: firstly, placing a base material and a target material into a plasma surface alloying furnace, carrying out pre-sputtering processing on the surface of the titanium alloy, and removing surface stains and a passivation layer; then, simultaneously, starting a source electrode and a workpiece voltage, carrying out sputtering on the source electrode through argon ions and carrying out deposition and diffusion on metal ions so as to form a Cu-containing alloy layer on the surface of the titanium alloy; and finally, feeding nitrogen gas into the furnace, and carrying out thermal insulation on the obtained product so as to form a Cu doped TiN alloy layer on the surface of the titanium alloy. A modified layer on the surface of a titanium alloy has a good sterilization effect, the surface hardness is significantly improved, and the wear resistance is significantly improved; and the method is simple in operation, good in repeatability and low in cost, and can be widely used for improving the antibacterial and wear-resisting properties of the surface of the titanium alloy.
Owner:TAIYUAN UNIV OF TECH

Cu-doped lithium zinc titanate negative electrode material and preparation method thereof

The invention relates to an electrode material and a preparation method thereof, and in particular relates to a Cu-doped lithium zinc titanate negative electrode material and a preparation method thereof. The Cu-doped lithium zinc titanate negative material is characterized by having a molecular formula of Li2Zn1-xCuxTi3O8, wherein x is more than 0 and less than or equal to 0.15. The preparation method comprises the following steps of: weighing a titanium source, a lithium source, a zinc source and a copper source, uniformly mixing and then drying; and sintering at 750 DEG C for 5 hours, then naturally cooling to the room temperature, and grinding. After Cu is doped, Cu<2+> can be distributed at a tetrahedron position and an octahedron position in a ratio of 3:2, so that the arrangement of ions in the material generates changes slightly, and the stability of a crystal structure of the material during charging and discharging is improved.
Owner:珠海长兴新能源科技有限公司

Light emitting device and electronic device using the same

A light emitting device and an electronic device using the same are provided. The light emitting device includes a light emitting chip having a wavelength between 460 nm and 650 nm and phosphor powders, in which the phosphor powders can be stimulated by light emitted from the chip to emit light with a wavelength between 700 nm and 1200 nm. The phosphor powders are selected from the group consisting of Cu-doped CdS, Cu-doped SeS, Cu-doped CdTe and combinations thereof.
Owner:EVERLIGHT ELECTRONICS

Microchannel plate and method for preparing high-resistance thin film with Cu being doped with Al2O3 on inner wall of microchannel plate

The invention relates to a microchannel plate and a method for preparing a high-resistance thin film with Cu being doped with Al2O3 on the inner wall of the microchannel plate. According to preparation of the high-resistance thin film with the Cu being doped with the Al2O3 on the inner wall of the microchannel plate, the high-resistance thin film with the Cu being doped with the Al2O3 is obtainedby the manner that different composition material deposition is performed on the inner wall of the microchannel plate through an atomic layer deposition method, when the deposition is performed, in one large circulation, the Cu doping ratio is controlled by controlling the deposition times of the Al2O3 and the deposition times of the Cu, so that the resistance rate of the thin film can be accurately adjusted and controlled within the range of 10<6>-10<10> omega.cm, the thickness of the thin film is controlled by controlling the circulation times of the large circulation, the resistance rate ofthe prepared thin film basically remains constant under a high-temperature working environment or after high-temperature annealing, and the technical problem of unstable performance of the microchannel plate caused by large change of the resistance rate of an existing microchannel plate surface thin film under the high-temperature condition is solved.
Owner:XI'AN INST OF OPTICS & FINE MECHANICS - CHINESE ACAD OF SCI
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