83results about How to "Improve bonding effect" patented technology

The invention discloses a back bonding platform for a superchip. The back bonding platform comprises a substrate, a chip peeling and overturning unit, an X-Y direction movement unit, a multi-degree of freedom bonding head and a mounting platform unit, wherein the chip peeling and overturning unit is used for respectively peeling and overturning a chip on a wafer disk and sending the chip to a to-be-picked position; the multi-degree of freedom bonding head is arranged on a supporting guide rail of the X-Y direction movement unit in a cantilever mode, and has functions of automatically levelling and aligning; the mounting platform unit is used for adsorbing the substrate and matched with the bonding head, so that the chip and the substrate are mutually positioned. In addition, in order to ensure the high-precision movement or matching of units, a plurality of vision positioning systems are configured in the back bonding platform. The back bonding platform can reach micrometer-level alignment accuracy, has the parallel adjusting accuracy of higher than 0.01 degree, and has the advantages of compact structure, convenience for operation and the like, so that the back bonding platform is particularly suitable for back bonding of the superchip.

The invention discloses a manufacturing method of a melamine ecological plate. The ecological plate is compounded with a core plate, a middle plate layer, a slab layer and melamine impregnated paper. The core plate is stuck to the middle plate layer after an upper face and a lower face of the core plate are glued. After cold pressing and hot pressing, the core plate is repeatedly maintained, trimmed and sanded, and is glued and stuck to the slab layer. Similarly, after the cold pressing, hot pressing, trimming and sanding, the core plate is glued and stuck to the melamine impregnated paper. The ecological plate manufactured by the method is energy-saving and environment-friendly, and under the condition that energy consumption is not increased, the ecological plate is cold pressed before hot pressing so that a composite structure of the plate is firmer. Furthermore, in the process of pressing and gluing the melamine impregnated paper, emulsion free of formaldehyde is used as binding agent, and accordingly formaldehyde content of the plate is reduced.

The present invention discloses a macromolecule bonding agent and a preparation method thereof, and belongs to the technical field of chemical synthesis and propellant applications, wherein the obtained product can be adopted as a propellant bonding agent. According to the present invention, N,N-dicyanopropyl aminoethyl acrylate, methyl methacrylate, butyl acrylate and hydroxyethyl acrylate are subjected to copolymerization, wherein a copolymer function chain contains two cyanoalkyl groups, such that an absorption effect is strong; during product preparation, a reactivity ratio of the function monomer is close to reactivity ratios of other copolymerization monomers, such that the reaction is easily controlled; a good bonding effect can be achieved in propellant applications so as to provide a good mechanical property; and advantages of easily-obtained raw materials, easily-achieved preparation process and easy promotion and application are provided.

The invention relates to the technical field of bioscience micro-total analysis systems, in particular to a micro-fluidic chip bonding method and a micro-fluidic chip. The method includes: providing amicro-fluidic chip substrate, wherein the upper surface of the substrate is provided with a microchannel structure; arranging ultrasonic bonding energy conducting ribs at the edge around the microchannel structure of the upper surface of the substrate or around a position, corresponding to the microchannel structure of the substrate, of a cover plate; adhering a surface pasting double-side adhesive tape on the substrate or the cover plate to glue the cover plate with the substrate; performing ultrasonic bonding on the substrate and the cover plate to enable first-step bonding; applying pressure to fix the chip or hot-pressing the same to enable the substrate and the cover plate which are pasted by the double-side adhesive tape to be firmly bonded. By the method, bonding stability of the micro-fluid chip can be ensured, and own physiochemical properties of the micro-fluidic chip can be avoided being affected, so that detection results are not interfered.

The invention provides a preparation method of modified magnesium sulfate cement. The method comprises the following steps: (1) weighing concentrated sulfuric acid, ultrafine coal ash, magnesium oxideand water according to a certain proportion for later use; (2) adding the concentrated sulfuric acid into a certain amount of water reserve to prepare a dilute sulfuric acid solution, then adding theultrafine coal ash, and stirring to obtain activated modified ultrafine coal ash; (3) slowly adding 10 to 20 percent of magnesium oxide reserve into the mixture obtained in step (2), and regulating and stirring to fully dissolve the active magnesium oxide in order to obtain a mixture of the coal ash and the magnesium sulfate solution; (4) weighing a certain amount of additive, adding the additiveinto the remaining water, stirring at room temperature for dissolving, adding the solution into the mixture obtained in step (3), continually adding the remaining magnesium oxide, and stirring for 30to 60 minutes to obtain pure thick magnesium sulfate cement slurry. The magnesium sulfate cement can be up to 66.96 MPa in compressive strength after 28 days. Moreover, the preparation method is easyto operate, low in cost, and easy for realizing industrialization.

The invention provides a copper-copper metal thermal pressing bonding method. The method at least comprises the following steps: first of all, providing a first wafer to be bonded and a second wafer to be bonded, wherein the first water comprises a first substrate, a first passivation layer and a first Ti-Cu alloy film, and the second wafer comprises a second substrate, a second passivation layer and a second Ti-Cu alloy film; then, performgin thermal pressing bonding on the surface of the first Ti-Cu alloy film of the first wafer and the surface of the second Ti-Cu alloy film of the second wafer; and finally, performing annealing processing in a protective gas to enable Ti atoms in the first Ti-Cu alloy film to diffuse towards the surface of the first passivation layer and Ti atoms in the second Ti-Cu alloy film to diffuse towards the surface of the second passivation layer so as to finally form Ti adhesive/barrier layers on the surfaces of the first passivation layer and the second passivation layer, and Cu atoms diffusing towards a bonding surface so as to realize bonding. According to the method provided by the invention, before the bonding, what is needed is only to respectively perform co-sputtering on the two substrates for once, such that the sputtering frequency is reduced by half, the process is relatively simple, the reliability is good, the technical cost is quite low, and finally, the Ti adhesive/barrier layer are formed through diffusion after the annealing processing, and the copper bonding effect is better.

The invention discloses a hand bag which comprises a bag body with a bag opening, a hand lifting rope, a first adhesive layer, a sticker, a second adhesive layer and release paper. Two ends of the hand lifting rope are respectively provided with a bonding part with a flat structure, the middle section of the hand lifting rope is a handle part, the sticker is arranged near the bag opening, the outer side surface of the sticker and the bonding part of the hand lifting rope are adhered to the corresponding inner side surface of the bag body through a first adhesive layer, the inner side surface of the sticker is coated with a second adhesive layer, and the second adhesive layer is covered with release paper. According to the hand bag, the bonding parts at the two ends of the hand lifting ropeare designed to be flat; the stability of the contact face is good, operation is convenient during bonding, the sticker and the bonding part can be directly bonded to the corresponding inner side face of the bag body together through the first bonding layer, the outer contour of the bonding part can be completely wrapped without a too thick bonding layer, and therefore the good bonding effect isachieved. Compared with the prior art, a layer of sticker and a layer of adhesive layer are omitted, so that the material cost is saved, and meanwhile, the production process is simplified.

The invention provides an isolation trench film filling structure, a semiconductor memory device and a preparation method. The preparation method of the isolation trench film filling structure comprises the steps that a semiconductor substrate with a peripheral groove is provided; a prefabricated filling material is formed on the semiconductor substrate, and the upper surface of the semiconductorsubstrate and the sidewall and the bottom of the peripheral groove are covered to form a neck; the prefabricated filling material is pre-etched to remove the neck; a high-density plasma oxide materialis formed on the semiconductor substrate; the prefabricated filling material is covered, and the peripheral groove is filled; and extra high-density plasma oxide material and prefabricated filling material are removed to acquire a high-density plasma oxide material layer and a prefabricated filling layer in the peripheral groove. According to the invention, the shape of the prefabricated fillinglayer is improved through pre-etching; voids between the high-density plasma oxide material and the prefabricated filling material are prevented; and device failure caused by short circuit caused by asubsequently formed metal bit line is prevented.