365 results about "Ultrasonic bonding" patented technology

A feedthrough terminal assembly for active implantable medical devices includes a structural wire bond pad for a convenient attachment of wires from either the circuitry inside the implantable medical device or wires external to the device. Direct attachment of wire bond pads to terminal pins enables thermal or ultrasonic bonding of lead wires, while shielding the capacitor or other delicate components from the forces applied to the assembly during attachment of the wires.

An electromagnetic interference filter terminal assembly for active implantable medical devices includes a structural pad in the form of a substrate or attached wire bond pad, for convenient attachment of wires from the circuitry inside the implantable medical device to the capacitor structure via thermal or ultrasonic bonding, soldering or the like while shielding the capacitor from forces applied to the assembly during attachment of the wires.

This invention relates to apparatus and methods for intermittently bonding a substrate web in fabricating a blank subassembly for an absorbent article. The invention comprises ultrasonic bonding apparatus including an anvil roll, a substrate web thereon, and at least one rotary ultrasonic horn. The substrate web can comprise at least first and second layers of material. The rotary ultrasonic horn, in combination with the anvil roll, ultrasonically bonds intermittent segments of the first and second layers of the substrate web to each other. Such intermittent bonds can comprise end seals for the absorbent articles. The ultrasonic horn and anvil roll are periodically separated from each other to provide the intermittent bonding of the substrate web. An actuator apparatus periodically moves the anvil roll and ultrasonic horn from engaging contact with each other preventing bond formation. The actuator apparatus can include a cam mechanism moving one of the anvil roll and ultrasonic horn from engaging contact with the other during rotation of the rotary ultrasonic horn. The cam mechanism can create a physical gap between the ultrasonic horn and the anvil roll. The cam mechanism moves either the ultrasonic horn and the anvil roll toward the other of the ultrasonic horn and anvil roll at a velocity of no more than about 80 millimeters / second to prevent bounce or impact loading when the horn and anvil roll are in engaging contact. The anvil roll comprises a substrate-receiving surface generally moving the substrate web through the nip at a surface speed of at least 300 meters per minute. The ultrasonic system generally creates bonds between the first and second layers of the substrate web at least about 600 times per minute.

An insulative shield is co-bonded to the top of a ceramic capacitor in a feedthrough terminal assembly on an active implantable medical device. The insulative shield is a thin substrate that provides protection against damage and degradation of the feedthrough capacitor and / or its conformal coating from heat, splatter or debris resulting from the electromechanical connection of components during construction of the assembly. Laser welding, thermal or ultrasonic bonding, soldering, brazing or related lead attachment techniques can create such heat, splatter or debris. In a preferred embodiment, the insulative shield is co-bonded using the capacitor's own conformal coating.

An insulative shield is co-bonded to the top of a ceramic capacitor in a feedthrough terminal assembly on an active implantable medical device. The insulative shield is a thin substrate that provides protection against damage and degradation of the feedthrough capacitor and / or its conformal coating from heat, splatter or debris resulting from the electromechanical connection of components during construction of the assembly. Laser welding, thermal or ultrasonic bonding, soldering, brazing or related lead attachment techniques can create such heat, splatter or debris. In a preferred embodiment, the insulative shield is co-bonded using the capacitor's own conformal coating.

An electromagnetic interference filter terminal assembly for active implantable medical devices includes a structural pad in the form of a substrate or attached wire bond pad, for convenient attachment of wires from the circuitry inside the implantable medical device to the capacitor structure via thermal or ultrasonic bonding, soldering or the like while shielding the capacitor from forces applied to the assembly during attachment of the wires.

A feedthrough terminal assembly for active implantable medical devices includes a structural wire bond pad for a convenient attachment of wires from either the circuitry inside the implantable medical device or wires external to the device. Direct attachment of wire bond pads to terminal pins enables thermal or ultrasonic bonding of lead wires, while shielding the capacitor or other delicate components from the forces applied to the assembly during attachment of the wires.

A communication radio-frequency module is provided that has a semiconductor device to which an antenna element is connected. This communication radio-frequency module includes: a supporting body that has a waveguide formed therein; a wiring board that is fixed onto a surface of the supporting body; the semiconductor device that is flip-chip mounted onto the wiring board by ultrasonic bonding; and the antenna element that is disposed on the other surface of the supporting body. In this module, the wiring board includes a board core member that is made of a resin material, and the supporting body includes a supporting body core member that is also made of a resin material.

The invention discloses a method for manufacturing an electrospun nanofiber gas filtering material in a mass manner by using an umbrella-shaped electrostatic spinning sprayer. The method comprises: dissolving a high-molecular polymer in a solvent, mixing to obtain an even solution; using the spinning solution in electrostatic spinning to obtain a nanofiber membrane; combining the nanofiber membrane with a non-woven fabric, manufacturing non-woven fabric / nanofilm / non-woven fabric composite film; performing ultrasonic bonding on the non-woven fabric / nanofilm / non-woven fabric composite film, to manufacture a filtering material. The manufacturing method is convenient and fast, and can realize small-batch production. Filtering efficiency of the obtained filtering material reaches up to 99.55%, filtering resistance is 150-200 Pa, gas permeability reaches 355L.m<-2>.s<-1>, and moisture-penetrability reaches 9.6 m<2>.Pa / w, that is, the material has good gas permeability and moisture penetrability, and the method has very good application prospect in the field of air filtering.

A disposable absorbent article of a brief or pull-up type incorporates a breathable laminate material composed of three layers. The laminate is an elastic material and may include non-elastic portions created by deactivating the material. The laminate material may be made breathable by the ultrasonic bonding process used to create the laminate. The absorbent article includes an absorbent assembly that overlaps with the non-elastic portions of the laminate.

A carriage assembly of a hard disk drive is constructed so that the bonding of flying leads of a long tail suspension circuit board and bonding terminals of a flexible printed circuit board can be carried out uniformly and reliably, and the problem of the flying leads breaking when the flying leads are pulled off the bonding terminals does not occur. The flexible printed circuit board is attached to a reinforced part by an adhesive in which spacers with a substantially equal particle diameter are mixed, and the flying leads and the bonding terminals are bonded together by ultrasonic bonding by applying ultrasonic vibration in a state where the flying leads are pressed onto the bonding terminals. In addition, an insulating film is provided on an opposite surface of the flying leads to the surface bonded to the bonding terminals, and during the ultrasonic bonding, ultrasonic vibration is applied in a state where the flying leads are pressed via the insulating film onto the bonding terminals.

A method for making an edge fold on an absorbent article having longitudinal edges including the steps of activating a portion of an absorbent article along its longitudinal edges to create substantially uniform gathers, folding a portion of the absorbent article along its longitudinal edges, and bonding a portion of the absorbent article along its longitudinal edges. Said method may include the step of cutting a portion of the absorbent article before the step of folding. Said method may include the step of cutting a portion of the absorbent article after the step of bonding. Said step of activation may include the application of heat to the absorbent article to assist in the activating process, whether before or during activation. Said bonding may be performed by application of adhesive, ultrasonic bonding, compression bonding, thermal bonding, radio frequency bonding, infrared bonding and combinations thereof. Absorbent articles include disposable diapers, sanitary napkins, pantiliners, incontinence briefs, and incontinence undergarments. Said step of folding creates an edge fold that substantially covers a portion of a longitudinal edge between a pair of side panels.

Polymer films may be discontinuously laminated by processes such as adhesive bonding, ultrasonic bonding, embossing, ring rolling, and strainable network formation. The films may be prestretched under cold process conditions before lamination. The laminates have superior properties such as tear strength. The laminates may be incorporated into bags, such as trash bags.

The invention relates to a nanofiber mouth mask capable of effectively blocking PM0.3 and rich in nanometer antibacterial ingredients and belongs to the technical field of daily protection products. The nanofiber mouth mask comprises a nanometer antibacterial layer, a first non-woven layer, a coarse effect filtering layer, an efficient filtering layer and a second noon-woven layer. The first non-woven layer is arranged on the outer side of the mouth mask, the second non-woven layer is arranged on the inner side of the mouth mask, the nanometer antibacterial layer is sprayed on the surface of the first non-woven layer, finally the five layers of structures are combined through an ultrasonic bonding method, either or both of a spunbond fabric and an SMS spunbond fabric can be selected for the first noon-woven layer and the second non-woven layer, a melt-blown fabric or spunlace or electrostatic cotton can be selected for the coarse effect filtering layer, the efficient filtering layer is prepared through an electrospinning technique, and the nanometer antibacterial layer is prepared in an electronic injection or coating mode. The mouth mask is high in capturing efficiency for fine particles, especially for PM 0.3 fine particles, low in breathing resistance and free of irritation to the skin in the using process, and the nanometer antibacterial layer can effectively inhibit or kill germs, bacteria and the like in the air.

An electric wire with a terminal including a conductor, and the terminal connected to an end portion of the conductor. The terminal includes a first connecting portion connected to an electrical equipment and a second connecting portion connected to the conductor. The second connecting portion includes a first connection surface and a second connection surface opposite to the first connection surface. The conductor includes a first conductor and a second conductor that are connected to the first connection surface and the second connection surface, respectively, by ultrasonic bonding. A total cross-sectional area of the first conductor and the second conductor is not less than 20 mm2.

In an ultrasonic bonding method of an electric wire in which the electric wire 1 in which a conductor end 7 made of plural core wires is exposed and a metallic connection terminal 19 formed by erecting two side walls 27 from a bottom surface are prepared and the conductor end is bonded to the connection terminal by applying ultrasonic vibration while the conductor end of the electric wire is positioned in the bottom surface between the two side walls of the connection terminal and is pushed, a cross section of the conductor end of the electric wire is made by being molded by press so that a thickness of a width direction between the side walls becomes thin toward at least one of the side positioned in the bottom surface of the connection terminal and the side to which the ultrasonic vibration is applied.

A method comprises providing a first electrically-conductive circuit-path (22), and separately providing a second electrically-conductive circuit-path (24). A portion of the first circuit-path is positioned proximally adjacent a portion of the second circuit-path at a first predetermined electrical bond location (26). A first, electrically-insulating barrier layer (28) is interposed between the first circuit-path and second circuit-path at the first bond location, and the first circuit-path is mechanically bonded to the second circuit-path at the first bond location. The mechanical bonding configured to provide an electrically-conductive bond-path between the first circuit-path and the second circuit-path at the first bond location. The mechanical bonding may desirably include ultrasonic bonding and / or pressure bonding.

A magnetic head actuator provided with a finely movable tracking device having a piezoelectric element is provided for easy wiring to the piezoelectric element and reducing problems such as wire breakage and continuity defects. In the magnetic head actuator, a portion of an FPC board resin base is removed to expose a portion of the feeding line that extends onto a voltage impressing electrode. An electrical and mechanical connection is made between the electrode and the exposed portion of the feeding line by ultrasonic bonding, Au ball bonding, or stud bumping.

The invention concerns a method for mounting a piezoelectric resonator (40) inside a case (80) by ultrasonic bonding of the piezoelectric resonator to a base part of the case. The invention also concerns a small-sized packaged piezoelectric resonator, in which the piezoelectric resonator is ultrasonically bonded inside a base part of the package.

A flexible flat cable connecting method includes stripping an insulation coating (5) surface of a flexible flat cable (1) to be connected with a busbar (2) to expose a conductive element (4). The method continues by introducing the flexible flat cable (1) and the busbar (2) between a horn (7) and an anvil (6) of an ultrasonic welding machine (3), and then transmitting an ultrasonic vibration to the horn (7). The horn (7) has a plurality of elongated projections (9) of tapered cross-section pressed in contact with the insulation coating (5) of the flexible flat cable (1). Thus, the elongated projections (9) bite into the insulation coating (5) to weld the conductive element (4) ultrasonically into the busbar (2)

Changes in the form of a pressure welding part of a bonding tool for ultrasonic bonding due to abrasion of the pressure welding part and / or accumulation of foreign matter, such as plating material, on the pressure welding part during use of the bonding tool are prevented, so that the bonding tool can carry out ultrasonic bonding stably. A plurality of protrusions with curved outer surfaces are formed on the pressure welding part that contacts the bonded part during ultrasonic bonding. The protrusions can be formed with spherical outer surfaces by forming concave grooves in a grid in an end surface of the bonding tool and then sandblasting the end surface of the bonding tool.

A communication radio-frequency module is provided that has a semiconductor device to which an antenna element is connected. This communication radio-frequency module includes: a supporting body that has a waveguide formed therein; a wiring board that is fixed onto a surface of the supporting body; the semiconductor device that is flip-chip mounted onto the wiring board by ultrasonic bonding; and the antenna element that is disposed on the other surface of the supporting body. In this module, the wiring board includes a board core member that is made of a resin material, and the supporting body includes a supporting body core member that is also made of a resin material.

Electric wires (20) and (21) are intersected with each other at right angles such that the electric wires (20) and (21) are inclined with respect to the vibration direction of ultrasonic vibration through 45°, intersected portions (C) of the electric wires (20) and (21) are set between a horn-side chip (11) and an anvil-side chip (12) in a pressurized state, and ultrasonic vibration is input to the intersected portions (C), thereby bonding the electric wires (20) and (21) to each other.

Systems and methods are provided to mitigate excess die attachment material accrual, and parasitic conductive paths formed thereby. A die attachment material (e.g., solder) is melted using a combination of localized heat sources and ultrasonic energy. The heat sources bring the die attachment material close to its melting point, which reduces an amount of bonding force associated with purely ultrasonic bonding techniques. An ultrasonic transducer brings the die attachment material the rest of the way up to its melting point, which reduces the overall temperature that the die and / or sensitive components thereon endure during the bonding process.

The invention discloses a high-abundance monatomic cobalt-array electrocatalytic hydrogen-production nano material based on the monatomic size effect. According to high-abundance monatomic cobalt-array electrocatalytic hydrogen-production nano material, on the basis that a hydrothermal method is used for preparing laminar molybdenum disulfide and a solvothermal method is used for preparing cobalt nanosheets, the cobalt nanosheets are modified to the surface of the molybdenum disulfide material through an ultrasonic bonding method; and then through the method that electrochemical scanning is conducted on an obtained heterostructure of the cobalt nanosheets and the molybdenum disulfide under an acid condition, redundant cobalt atoms on the surface are removed, and finally, the high-abundance monatomic cobalt-modified molybdenum disulfide lamellar nano material is obtained. The novel electrocatalytic material has good electrochemical hydrogen-production catalytic performance.

The invention provides an ultrasonic bonding equipment and a bonding construction body to increase the strength of a joined part of a work after the ultrasonic bonding is completed. An ultrasonic bonding equipment has an anvil 110 and a horn 140 arranged facing the anvil, and performs the ultrasonic bonding of the work to be bonded by pressurizing and oscillating electrode tabs 210 as a plurality of works overlapped and set on the anvil by the horn. Gripping force on the outer side part is set to be smaller than the gripping force on the inner side part in a gripping area to the works by the anvil and the horn.

A conductive portion of a wire, composed of a plurality of core wires, is inserted and fitted into a groove in a pressing die, thereby restricting the conductive portion to a bonding width of a terminal, and in this condition with the use of a press forming machine, the conductive portion is pressed in a thickness direction thereof to be formed into a flat shape. Thereafter, the conductive portion is inserted and fitted into the terminal, and then the conductive portion, while pressed by a pressing vibration horn, is bonded to the terminal by ultrasonic vibrations applied from the pressing vibration horn.

A method for making an edge fold on an absorbent article having longitudinal edges including the steps of activating a portion of an absorbent article along its longitudinal edges to create substantially uniform gathers, folding a portion of the absorbent article along its longitudinal edges, and bonding a portion of the absorbent article along its longitudinal edges. Said method may include the step of cutting a portion of the absorbent article before the step of folding. Said method may include the step of cutting a portion of the absorbent article after the step of bonding. Said step of activation may include the application of heat to the absorbent article to assist in the activating process, whether before or during activation. Said bonding may be performed by application of adhesive, ultrasonic bonding, compression bonding, thermal bonding, radio frequency bonding, infrared bonding and combinations thereof. Absorbent articles include disposable diapers, sanitary napkins, pantiliners, incontinence briefs, and incontinence undergarments. Said step of folding creates an edge fold that substantially covers a portion of a longitudinal edge between a pair of side panels.

The invention relates to high-strength, abrasion-resistant optical fiber cable having a supplemental layer consisting essentially of a liquid crystal polymer (LCP) to enhance the cable's tensile strength and hermetically seal it, and an outermost encasing layer to protect the LCP supplemental layer from damage that could otherwise diminish the tensile strength or destroy the moisture barrier properties of the cable gained by adding the supplemental liquid crystal polymer layer. The encasing layer is preferably a thin layer of a smooth, non-crystalline thermoplastic that can be easily removed with chemicals that do not affect the properties of the supplemental layer so that the supplemental layer can be made accessible for promoting the formation of hermetically sealed interfaces between the cable and other structures. Cross-head extrusion methods for coating optical fibers with LCP and encasing layers are described along with laser and ultrasonic bonding techniques for fabricating hermetic packages.