Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Micro-fluidic chip bonding method and micro-fluidic chip

A microfluidic chip and bonding technology, which is applied in the field of bioscience micro-analysis system, can solve the problems of not being able to package the microfluidic chip firmly, and achieve the effect of reasonable structure, obvious bonding effect and guaranteed stability

Active Publication Date: 2018-03-09
成都微康生物科技有限公司
View PDF10 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The technical problem to be solved by the present invention is that the bonding method of the microfluidic chip in the prior art cannot not only firmly package the microfluidic chip, but also not have a physical or chemical impact on the final microstructure of the plastic microfluidic chip , providing a new microfluidic chip bonding method and microfluidic chip, the bonding method combines the substrate and cover sheet of the microfluidic chip by combining ultrasonic bonding and tape bonding Forms a tightly closed microchannel structure with high bond strength and low microstructural deformation

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Micro-fluidic chip bonding method and micro-fluidic chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0032] A microfluidic chip bonding method for bonding a substrate 4 with a microchannel structure 1 on the surface and a cover sheet together to form a microfluidic chip with a preset cavity structure, including:

[0033] Step 1, providing a microfluidic chip substrate 4, the upper surface of the substrate 4 is provided with a microchannel structure 1;

[0034] Step 2, setting ultrasonic bonding energy directors 2 at the periphery of the microchannel structure 1 on the upper surface of the substrate 4, the width and thickness of the ultrasonic bonding energy directors 2 are both 100-500 μm, more optimally, 200 μm is selected; the ultrasonic bonding energy director 2 cannot directly contact the edge of the microchannel structure 1, and is 100 μm-2 mm away from the edge of the microchannel structure 1, and more optimally, 200 μm is selected;

[0035] Step 3, paste double-sided adhesive tape 3 on the upper surface of the substrate 4, and bond the cover sheet to the substrate 4. T...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Widthaaaaaaaaaa
Thicknessaaaaaaaaaa
Login to View More

Abstract

The invention relates to the technical field of bioscience micro-total analysis systems, in particular to a micro-fluidic chip bonding method and a micro-fluidic chip. The method includes: providing amicro-fluidic chip substrate, wherein the upper surface of the substrate is provided with a microchannel structure; arranging ultrasonic bonding energy conducting ribs at the edge around the microchannel structure of the upper surface of the substrate or around a position, corresponding to the microchannel structure of the substrate, of a cover plate; adhering a surface pasting double-side adhesive tape on the substrate or the cover plate to glue the cover plate with the substrate; performing ultrasonic bonding on the substrate and the cover plate to enable first-step bonding; applying pressure to fix the chip or hot-pressing the same to enable the substrate and the cover plate which are pasted by the double-side adhesive tape to be firmly bonded. By the method, bonding stability of the micro-fluid chip can be ensured, and own physiochemical properties of the micro-fluidic chip can be avoided being affected, so that detection results are not interfered.

Description

technical field [0001] The invention relates to the technical field of bioscience micro-total analysis systems, in particular to a microfluidic chip bonding method and a microfluidic chip. Background technique [0002] The bonding link of the microfluidic chip is one of the key links in the preparation of the microfluidic chip, and the quality of the bonding directly affects the practical application of the microfluidic chip. At present, the main issues that need to be paid attention to in the bonding process of microfluidic chips include: [0003] 1. It is required that the chip can be connected, and the microchannel has airtightness, and has sufficient mechanical strength after bonding to avoid cracking and liquid leakage. [0004] 2. Avoid deformation, blockage or other influences on the microchannel during the bonding process. [0005] 3. When using organic matter for bonding, it is necessary to avoid changes in the physical and chemical properties of the surface. [...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): B29C65/08B29C65/48B01L3/00
CPCB01L3/5027B01L2200/10B01L2300/0861B01L2300/0887B01L2300/12B29C65/08B29C65/48
Inventor 唐勇
Owner 成都微康生物科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com