2596results about How to "Improve alignment accuracy" patented technology

The chip for the multi-chip semiconductor device having the markings for alignment formed on the front surface and / or the back surface of the chip only by the processing from the front surface of the chip (photolithography, etch) and the method for manufacturing same are presented, without adding any dedicated process step to the formation process for the marking for alignment. In the chip for the multi-chip semiconductor device having two or more electroconductive through plug in one chip for the multi-chip semiconductor device, one or more electroconductive through plugs are employed for the marking for alignment, and the chip is configured to allow identification of the marking for alignment on the front surface and / or the back surface of the chip for the multi-chip semiconductor device. Then, an insulating film is provided on the front surface and / or the back surface of the electrically conducting through plug.

The invention relates to a novel wavelength division multiplexing demultiplexing optical assembly applied to high-speed parallel long-distance transmission. The output end of a laser group is sequentially provided with a lens group, an optical regulating plate group, a lower layer silicon lens array and a lower layer optical filter group, wherein the output end of the lower layer optical filter group is provided with a lower layer free space wavelength division multiplexing device, the output end of the lower layer free space wavelength division multiplexing device is provided with an optical isolator, the output end of the optical isolator is provided with a focusing lens, the output end of the focusing lens is connected with an input optical fiber, an output optical fiber is connected with a collimating lens, the output end of the collimating lens is connected with a prism, the output end of the prism is provided with an upper layer free space wavelength division multiplexing device, the output end of the upper layer free space wavelength division multiplexing device is provided with the upper layer optical filter group, the output end of the upper layer optical fiber group is provided with an upper layer silicon lens array, and the output end of the upper layer silicon lens array is provided with a detector group. The optical signal multiplexing and demultiplexing is realized by using the optical filter array structure.

There is provided a binocular device, including a rigid mechanical body supporting two image sources (2, 4), one for each eye (6, 8) and two lensing devices (12, 14), one for each eye, the lensing devices having a first surface adjacent to the image sources and an opposite, second surface, each of the lensing devices projecting an image (16, 18) of one image source onto an infinite focal plane, and electronic means permitting modification of an image generated to an eye for adjusting the binocular alignment of the images. A method for aligning a binocular device is also provided.

A device (4) for transferring a pattern to an object (2). The invention relates especially to production of micro and nanostructures. The device comprises an alignment means (10) arranged in connection with a first contacting means (7) for controlling the motion of the first stamp (8) in a direction perpendicular to the pressing direction (A), and a second contacting means (11) having a second stamp (12) adapted to imprint a second pattern in the second surface (6) of the object (2), and a pressing means (9) further adapted to press the second stamp (12) into contact with the second surface (6) of the object (2) in the pressing direction (A). Hereby is obtained a device of a simple design, which has a high accuracy of the alignment of the stamps in relation to the object.

The yield of a peeling process is improved. A first step of forming a peeling layer to a thickness of greater than or equal to 0.1 nm and less than 10 nm over a substrate; a second step of forming, on the peeling layer, a layer to be peeled including a first layer in contact with the peeling layer; a third step of separating parts of the peeling layer and parts of the first layer to form a peeling trigger; and a fourth step of separating the peeling layer and the layer to be peeled are performed. The use of the thin peeling layer can improve the yield of a peeling process regardless of the structure of the layer to be peeled.

There is provided a wiring board including: a terminal group including a plurality of terminals arrayed along a specified array axis; and a pair of alignment marks disposed on opposite sides of the terminal group in the direction of the array axis. The alignment marks each have a first portion extending so as to intersect at an angle to the array axis. The first portions of the alignment marks and the plurality of terminals extend from the terminal group to a common phantom center point that is apart from the terminal group in the direction intersecting the array axis.

An electrical connector assembly includes a socket connector soldered on one circuit board and a plug connector soldered on another circuit board. The socket connector includes an insulating socket base and a plurality of first terminals received in the first terminal-receiving slots of the insulating socket base. Each first terminal successively extends to form a first terminal lead, a first inverted U-shaped portion, a base U-shaped portion and an auxiliary-clamping portion. One leg of the base U-shaped portion includes a first elastic-contact portion. The plug connector includes an insulating plug base and a plurality of second terminals received in the second terminal-receiving slots of the insulating plug base. Each second terminal successively extends to form a second terminal lead and a second inverted U-shaped portion having a second elastic-contact portion. The second inverted U-shaped portion of the second terminal is inserted into the base U-shaped portion of the first terminal, and the first elastic-contact portion contacts the second elastic-contact portion when mating. The invention can provide stable mating and electrical connection and is in compliance with recent downsizing trends.