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2591results about How to "Improve alignment accuracy" patented technology

Alignment method and apparatus therefor

A method of transferring a pattern of a mask onto shot areas on a substrate determines two sets of parameters in a single model equation. The parameters in one of the two sets relate to arrangement of a plurality of shot areas on the substrate, and the parameters in the other set relate to the shot areas per se. The mask and the substrate are moved relatively in accordance with the determined parameters.
Owner:NIKON CORP

Automatic system for temporal alignment of music audio signal with lyrics

An automatic system for temporal alignment between a music audio signal and lyrics is provided. The automatic system can prevent accuracy for temporal alignment from being lowered due to the influence of non-vocal sections. Alignment means of the system is provided with a phone model for singing voice that estimates phonemes corresponding to temporal-alignment features or features available for temporal alignment. The alignment means receives temporal-alignment features outputted from temporal-alignment feature extraction means, information on the vocal and non-vocal sections outputted from vocal section estimation means, and a phoneme network, and performs an alignment operation on condition that no phoneme exists at least in non-vocal sections.
Owner:NAT INST OF ADVANCED IND SCI & TECH

Novel wavelength division multiplexing demultiplexing optical assembly applied to high-speed parallel long-distance transmission

The invention relates to a novel wavelength division multiplexing demultiplexing optical assembly applied to high-speed parallel long-distance transmission. The output end of a laser group is sequentially provided with a lens group, an optical regulating plate group, a lower layer silicon lens array and a lower layer optical filter group, wherein the output end of the lower layer optical filter group is provided with a lower layer free space wavelength division multiplexing device, the output end of the lower layer free space wavelength division multiplexing device is provided with an optical isolator, the output end of the optical isolator is provided with a focusing lens, the output end of the focusing lens is connected with an input optical fiber, an output optical fiber is connected with a collimating lens, the output end of the collimating lens is connected with a prism, the output end of the prism is provided with an upper layer free space wavelength division multiplexing device, the output end of the upper layer free space wavelength division multiplexing device is provided with the upper layer optical filter group, the output end of the upper layer optical fiber group is provided with an upper layer silicon lens array, and the output end of the upper layer silicon lens array is provided with a detector group. The optical signal multiplexing and demultiplexing is realized by using the optical filter array structure.
Owner:INNOLIGHT TECHNOLOGY (SUZHOU) LTD

Method and system for efficient pacing of speech for transription

A method and system for improving the efficiency of real-time and non-real-time speech transcription by machine speech recognizers, human dictation typists, and human voicewriters using speech recognizers. In particular, the pacing with which recorded speech is presented to transcriptionists is automatically adjusted by monitoring the transcriptionists' output by comparing the output acoustically or phonetically to the presented recorded speech as well as monitoring the resulting transcription, and accordingly adjusting the pacing.
Owner:COGI

Method and structure for aligning mechanical based device to integrated circuits

A method for bonding substrates together. The method includes providing a first substrate comprising a first surface. The first substrate comprises a plurality of first chips thereon. Each of the chips has integrated circuit devices. The first substrate includes a first alignment mark on the first substrate and a second alignment mark on the first substrate. The method also includes providing a second substrate comprising a silicon bearing material and second surface. The second substrate comprising a plurality of second chips thereon. Each of the chips comprises a plurality of mechanical structures. The second substrate has a first silicon based pattern on the second substrate and a second silicon based pattern on the second substrate. The method includes moving the first alignment mark of the first substrate to the first silicon based pattern on the second substrate and aligning the second alignment mark of the first substrate to the second silicon based pattern on the second substrate. A portion of at least one of the first substrate or the second substrate is illuminated with electromagnetic radiation. The method includes detecting a portion of the electromagnetic radiation and using the detected portion of the electromagnetic radiation to align the first substrate with the second substrate. The method also includes coupling the first substrate with the second substrate by contacting the first surface with the second surface and bonding the first surface with the second surface.
Owner:MIRADIA INC

Flip chip device having soldered metal posts by surface mounting

A disclosed semiconductor device having MPS-C2 (Metal Post Solder-Chip Connection) structure can be mounted on a PCB by an SMT mounter. A chip is disposed on a substrate. The substrate has a plurality of connecting pads and a plurality of accessory pads, and the chip has a plurality of corresponding metal posts and a plurality of accessory bumps. The dimensions on the soldered flat tops of the accessory bumps are corresponding to the soldered areas of the accessory pads where each soldered flat top has a plurality of angular corners and an edge between two adjacent angular corners where the length of the edge is twice greater than the pad pitch. Therefore, the displaced or rotational displaced metal posts can be pulled back and self-aligned during reflow processes so that an SMT mounter with poor alignment accuracy can be implemented for flip-chip bonding the semiconductor device having MPS-C2 structure to replace the conventional expensive flip-chip die bonder and to achieve higher productivity. Furthermore, the shape of the flat top surfaces of the metal posts does not have to match with the shape of the connecting pads.
Owner:POWERTECH TECHNOLOGY

Method of fabricating two-step self-aligned contact

A method of fabricating a self-aligned contact is provided. A first dielectric layer is formed on a substrate having a contact region therein. Next, a lower hole corresponding to the contact region is formed in the first dielectric layer. Thereafter, a second dielectric layer is formed on the first dielectric layer, and then an upper hole self-aligned to and communicated with the lower hole is formed in the second dielectric layer, wherein the upper hole and the lower hole constitute a self-aligned contact hole. Afterwards, the self-aligned contact hole is filled with a conductive layer.
Owner:UNITED MICROELECTRONICS CORP

Alignment method for attaching chip or flexible circuit board to circuit substrate

The invention discloses an alignment method for attaching a chip or a flexible circuit board to a circuit substrate, which is characterized by comprising the following steps of: designing two identification points on the circuit substrate in advance; after the circuit substrate is transferred to a framing table board and positioned, shooting images of the two identification points by using a camera, converting the images of the two identification points into position coordinates of an image coordinate system by using an image processing system; converting image coordinates of the two identification points into mechanical coordinate values of a mechanical coordinate system by using a relationship between the image coordinate system and the mechanical coordinate system; finding out an X-directional offset, a Y-directional offset and a deflection angle around a Z axis between the actual positions of the two identification points and a target position through calculation; and finally adjusting the two identification points to the target position by using an X-directional movement mechanism, a Y-directional movement mechanism and a rotating mechanism around the Z axis, so that the chip or the flexible circuit board is aligned with a conducting terminal of the circuit substrate. By the invention, the alignment precision of a chip on glass (COG), a film on glass (FOG) and a chip on film (COF) is greatly improved.
Owner:苏州凯蒂亚半导体制造设备有限公司

Organic electroluminescence display panel

The invention relates to the technical field of organic electroluminescence display, and discloses an organic electroluminescence display panel. The organic electroluminescence display panel comprises a plurality of R sub pixel units, a plurality of G sub pixel units, a plurality of B sub pixel units and a plurality of W sub pixel units. Each R sub pixel unit comprises four R sub pixel elements, each G sub pixel unit comprises four G sub pixel elements, each B sub pixel unit comprises four B sub pixel elements, and each W sub pixel unit comprises four W sub pixel elements. Different colors are emitted by every two adjacent sub pixel units. The R sub pixel elements, the G sub pixel elements, the B sub pixel elements and the W sub pixel elements form a pixel area of the display panel, each sub pixel unit comprises four sub pixel elements which emit the same light colors, and the alignment precision of MASK in the preparation process can be improved. Meanwhile, due to the fact that the area of each sub pixel element is 1 / 4 of the area of each sub pixel unit, the resolution ratio of the organic electroluminescence display panel can be greatly improved to 4 times of the original resolution ratio.
Owner:BOE TECH GRP CO LTD
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