The present invention is intended to solve the following problems with a method for fabricating a substrateless
semiconductor package using an
adhesive sheet as a temporary fixing supporter. A
chip can be displaced from a specified position by pressure during resin encapsulation because the
chip is not properly held by the
adhesive sheet. If such displacement occurs, the relative positional relationship between the
chip and an interconnect to be connected to a specified position in a subsequent wiring step also changes by the displacement of the chip from the specified position. Another problem is that if
adhesive deposits occur during peeling of the adhesive sheet and the surface of a
package is contaminated with the adhesive deposits, adhesive components left on the surface of the chip can inhibit connection between the interconnect and the chip in a subsequent wiring step. To solve these problems, the present invention provides an adhesive sheet for
semiconductor device fabrication that is attached to a substrateless
semiconductor chip when the chip is encapsulated with resin. The adhesive sheet includes a base material layer and an adhesive layer. The adhesive layer has a specific
adhesion strength and peel strength.