77results about How to "Reduced oxygen vacancies" patented technology

The invention provides a cation-anion co-doping n-type zinc-oxide-base transparent conducting film. The doped cation is a high-valency cation M<n+>, and n is 3, 4, 5 or 6; and the doped anion is a low-valency anion X<m->, and m is equal to 1. The preparation method adopts the High-vacuum Magnetron Sputtering technique and promotes the n-type transparent conductivity of the zinc-oxide film by utilizing high-valency cations and low-valency anions to prepare the high-performance cation-anion co-doping zinc-oxide polycrystal film. A compound containing low-valency anions can be used as a fluxing agent to promote the crystallization of the zinc-oxide-base polycrystal film and enhance the visible light transparency of the film and the electron conductivity. The high-performance zinc-oxide-base transparent conducting film has the advantages of simple preparation process, superior visible light transparency and conductivity, and low cost, and has wide application prospects in the fields of solar cells and photoconducting devices.

The invention discloses a density enhancing method of piezoelectric ferroelectric ceramic materials with bismuth layer structure. According to a chemical formula: (Am-1BmO3m+1) <2-> (Bi2O2) <2+>; and molar ratio A: B: Bi = m-1: m : 2, materials are calculated and weighted, wherein, the A is univalent, bivalent, trivalent or quadrivalent metal ion that is suitable for dodecahedral coordination; the B is trivalent, quadrivalent, pentavalent or sexivalent metal ion that is suitable for octahedral coordination; the production processes are that: mixing, pre-synthesizing, grinding, forming and sintering; the sintering process is that: the temperature of the obtained material from the last step is raised to 1100 to 1250 DEG C at a speed of 2 to 5 DEG C per minute, and is lowered to 50 to 150 DEG C within 1 to 5 minutes; under the temperature of 950 to 1150 EDG C, insulation at the low temperature is done for 5 to 20 hours; then the temperature is lowered to 500 DEG C at a speed of 3 to 7 DEG C per minute, and the obtained material is naturally cooled with a furnace. The invention can obtain the piezoelectric ferroelectric ceramic materials with grain-refining and density bismuth structure.

The invention provides a thin-film transistor, an array substrate, a preparation method thereof, and a display device. The preparation method of the thin-film transistor comprises forming a gate electrode, a gate electrode insulating layer, an active layer, a source electrode and a drain electrode of the thin-film transistor, wherein the active layer is prepared by a metal oxide. Furthermore an electrochemical oxidation treatment is performed on a metal oxide film in the preparing process, and the metal oxide film after electrochemical oxidation treatment is patterned for forming the active layer of the thin-film transistor. According to the preparation method, the number of oxygen vacancies of the metal oxide film can be reduced and the concentration of free carriers of the metal oxide film can be controlled, and the prepared thin-film transistor has high stability. Furthermore, an additional photolithographic process is not required and a little cost influence is realized.

The invention provides a Bi0.9Er0.1Fe1-xCoxO3 film with high ferromagnetism and ferroelectricity, and a making method thereof. The method comprises the following steps: preparing a Bi0.9Er0.1Fe1-xCoxO3 precursor solution from bismuth nitrate, iron nitrate, cobalt nitrate and erbium nitrate, spin-coating a substrate with the Bi0.9Er0.1Fe1-xCoxO3 (x is 0.01-0.03) precursor solution, uniformly sizing, drying, and annealing to obtain the Bi0.9Er0.1Fe1-xCoxO3 film with high ferromagnetism and ferroelectricity. The method has the advantages of simple device requirements, easy reaching of experiment conditions, easy control of the doping amount, and great improvement of the ferromagnetism of a BiFeO3 film, and the Bi0.9Er0.1Fe1-xCoxO3 film made in the invention has the advantages of good uniformity, high magnetic intensity and high remanent polarization.

The invention discloses a preparation method of a manganese-doped potassium-sodium-niobate-base lead-free piezoelectric film. The invention provides a simple and controllable technique on the basis of a non-alcohol niobium salt sol-gel method. The method comprises the following steps: preparing a stable manganese-doped KNN sol, carrying out spin coating on the KNN sol on a (Pt/TiO2/Ti/SiO2/Si) substrate for 30 seconds at the rotation speed of 3200 r/min, drying the wet film at 150 DEG C, and keeping the temperature at 600 DEG C for 10 minutes; repeating the previous step 8 times under the same heat treatment conditions to obtain 8 spin coatings; and carrying out annealing treatment at 700 DEG C for 10 minutes. The final film thickness is 2-4 mu m; and the prepared film has the advantages of favorable compactness and improved drain current property.

The invention belongs to the field of lithium ion battery positive electrode materials, and particularly relates to a nanometer lithium-rich manganese-based positive electrode material, and a precursor and a base material thereof. The chemical general formula of the lithium-rich manganese-based positive electrode material precursor is MnxM<1-x>(OH)2, x is more than 0.5 and less than 1, and M is one or two of Ni and Co. Primary particles of the precursor are nanosheets, and the thicknesses of the nanosheets are similar; the crystal faces of the nanosheets face the same direction and are stackedwith one another to form a nanoflower-shaped morphology; the interior is of a radial structure with a core in the center. The lithium-rich manganese-based positive electrode material precursor is calcined to obtain a nanometer lithium-rich manganese-based positive electrode material base material which is provided with oxygen-containing vacancies, with primary particles being nanosheets with thethickness of about 10 nm. According to the present invention, during the lithium mixing sintering of the base material, the primary particles are the ultra-thin nanosheets, such that the specific surface area is large, the contact with a lithium source is complete, the uniform mixing of the base material and the lithium source is easily achieved, the problems of unbalanced reaction and insufficient reaction are avoided, and the performance of the ternary positive electrode material can be easily and completely provided.

The invention provides a semiconductor structure, which comprises a semiconductor substrate, an interface layer, a first dielectric layer and a second dielectric layer, wherein the interface layer is formed on the semiconductor substrate; the first dielectric layer is formed on the interface layer; the second dielectric layer is formed on the first dielectric layer; and the phase-transition temperature of the second dielectric layer is lower than that of the first dielectric layer. By the semiconductor structure and the forming method thereof provided by the invention, the condition that external oxygen diffuses and passes through the second dielectric layer and enters the first dielectric layer is facilitated when dielectric constants of the dielectric layers are improved; and oxygen vacancies in the first dielectric layer are reduced, so that a gate leakage current is reduced.

The invention is suitable for the flat panel display technology field, and provides a modified ITO anode and a preparation method and applications thereof. The preparation method comprises the following steps: providing an ITO substrate, the ITO substrate comprising a substrate and an ITO film formed on the substrate through deposition, and cleaning and drying the ITO substrate in sequence; taking an HF solution or an HC1 solution as an electrolyte, the ITO substrate as an electrolytic bath anode and a molybdenum electrode as an electrolytic bath cathode, and then placing the ITO substrate and the molybdenum electrode side by side in a reaction container, conducting constant voltage electrochemical processing on the ITO film, and obtaining a surface-modified ITO electrode; and cleaning and drying the surface-modified ITO electrode.

The invention is suitable for the technical field of a lithium battery, and provides a niobium and manganese modified tin oxide-coated lithium nickel cobalt manganate positive electrode material and apreparation method thereof. The method comprises the steps of S1, weighing tin oxide and a niobium and manganese oxide, performing low-temperature treatment after mixing to obtain a niobium and manganese tin oxide mixture; S2, weighing a nickel cobalt manganate ternary material, fully and uniformly mixing the nickel cobalt manganate ternary material and the niobium and manganese tin oxide mixtureto obtain a mixed material; and S3, loading the mixed material obtained in the step S2 to a sagger, and performing sintering to obtain the niobium and manganese modified tin oxide-coated lithium nickel cobalt manganate positive electrode material. The ternary positive electrode material is coated by employing niobium and manganese modified tin oxide, the surface structure of the material can be effectively protected, Ni<2+> generation is reduced, de-intercalation of lattice oxygen is effectively prevented, the cycle and rate performance of the material is improved, meanwhile, the side reaction brought by the defect of the tin oxide material also can be effectively reduced, and the material performance is more excellent.

The invention relates to the field of a display technique, and in particular to a metal oxide film and a preparation method thereof, a thin film transistor and an array substrate. The metal oxide filmand the preparation method thereof, the thin film transistor and the array substrate are used for solving the problem of uneven brightness of different positions of the display panel in the related art. The embodiment of the present invention provides the preparation method of the metal oxide film. The preparation method comprises the steps of forming the metal oxide film on an underlayer substrate; and providing an oxygen anion to the metal oxide film by using an anodic oxidation method within preset time so that part of metal ions in the metal oxide film are converted into metal oxides. Theembodiment of the invention is used for manufacturing of the display panel.

The invention discloses a hydrogen-passivated zinc oxide-base thin film transistor. According to the hydrogen-passivated zinc oxide-base thin film transistor, a zinc oxide-base semiconductor material doped with titanium or magnesium and passivated through hydrogen plasma is used as a channel layer. A preparation method of the hydrogen-passivated zinc oxide-base thin film transistor includes the steps that a highly-doped P-type silicon wafer on which silicon dioxide grows is used as a substrate, radio frequency magnetron sputtering is conducted on a composite target of Ti and zinc oxide or Mg and zinc oxide, and meanwhile a small zinc oxide thin film layer doped with Ti or Mg is formed on the substrate through first masking deposition; in-situ hydrogen plasma processing is conducted; direct current sputtering is conducted on the zinc oxide-base thin film layer on which in-situ hydrogen plasma processing is conducted, an Al electrode is prepared through secondary masking deposition, and then the hydrogen-passivated zinc oxide-base thin film transistor is obtained. The hydrogen-passivated zinc oxide-base thin film transistor has the advantages of being high in electron mobility, good in electrical stability, high in switch ratio and the like. The preparation method is simple in process and low in cost, and threshold voltage of a device can be adjusted through hydrogen passivation time and the content of dopants.

The invention relates to a high-quality-factor yttrium-doped zirconium oxide microwave dielectric ceramic material and a preparation method thereof. The yttrium-doped zirconium oxide microwave dielectric ceramic material has a tetragonal phase structure, the chemical composition is that: of ZrO2-x mol% Y2O3-y wt% Al2O3-z wt% SiO2, the x is greater than or equal to 1.5 and less than or equal to 2.0, the y is greater than or equal to 0.04 and less than or equal to 0.06, and the z isgreater than or equal to 0.001 and less than or equal to 0.002; and the x mol% is the molar content of the Y2O3, the y wt% is the mass percentage content of the Al2O3, and the z wt% is the mass percentage content of the SiO2.

The invention provides a method for manufacturing a double-layer high-K dielectric structure. The method comprises the step S01 that a semiconductor substrate is provided, and spaced shallow trench isolations are arranged on the semiconductor substrate, the step S02 that the semiconductor substrate is exposed to hafnium-based compounds and steam in a circulating mode to form a first hafnium oxide layer of the preset thickness, the step S03 that the first hafnium oxide layer is exposed to the hafnium-based compounds and strong oxidants in a circulating mode to form a second hafnium oxide layer of the preset thickness, and the step S04 that a metal gate material layer is formed on the surface of the second hafnium oxide layer. According to the method for manufacturing the double-layer high-K dielectric structure, on the one hand, the thickness of silicon oxide on the surface of the semiconductor substrate is reduced, and the EOT parameter of gate dielectrics is within the reasonable range; on the other hand, the second hafnium oxide layer has fewer oxygen vacancies, and the current leakage phenomenon of the finally-formed hafnium oxide dielectric layer is controlled.

The invention relates to a preparation method of potassium-sodium niobate-based nano fine-grain ceramic with the average grain size of 160nm. 0.5 mol% of lanthanum oxide is added into raw materials, so that oxygen vacancies generated by volatilization of alkali metal elements can be reduced, meanwhile, growth of grains is hindered, and the purpose of refining the grains is achieved. The preparation method comprises the following steps: calcining dried powder subjected to ball milling for 12-18 hours at 800-900 DEG C for 2-4 hours, carrying out secondary ball milling for 12-18 hours, performing calcining at 800-900 DEG C again after drying for 2-4 hours, carrying out tertiary ball milling for 12-18 hours, performing drying, and carrying out multiple times of ball milling and calcining to enable raw materials to fully react and refine, so the sintering temperature and the heat preservation time can be reduced, and the purpose of grain refinement is achieved due to insufficient grain growth. Through doping modification of a rare earth element lanthanum and an improved traditional solid phase method, a scanning electron microscope diagram and a particle size distribution diagram of the finally obtained potassium-sodium niobate-based ceramic are shown in a figure 2, the average grain size of the potassium-sodium niobate-based ceramic is 160nm, and the grain size distribution is uniform and very fine.

The invention discloses an anti-reduction BME ceramic dielectric capacitor and a ceramic material for the capacitor. The ceramic material for the anti-reduction BME ceramic dielectric capacitor consists of the following raw materials: barium titanate, vanadyl oxalate, manganous nitrate, magnesium nitrate, strontium nitrate, rare earth nitrate A, rare earth nitrate B, chromic nitrate, barium nitrate, calcium bicarbonate, nano silicon dioxide and nano hafnium dioxide. By adding additives such as vanadyl oxalate, barium nitrate, calcium bicarbonate, nano silicon dioxide, nano hafnium dioxide and the like, the loss is reduced, the insulation resistance is improved, the dielectric withstand voltage is improved, and good electrical properties are obtained.