32results about How to "Improve sintering density" patented technology

The invention provides a thin dielectric material for X5R multilayer ceramic capacitors. The thin dielectric material for X5R multilayer ceramic capacitors is composed of a main component and an auxiliary additive, wherein the main component is BaTi(1-x)CrxO3 (0.005<x<=0.05); on the basis of 100mol of the main component, the addition amount of the auxiliary additive is 0.32-5.6mol; and the auxiliary additive is composed of acetates, transition metal oxides and glass powder. The dielectric material provided by the invention has the advantages of favorable temperature stability and high reliability. By using the chromium barium titanate as the main component, the additive introduced into the formula mostly adopts water-soluble acetates, thereby being more beneficial to the mixing of the additive and main component on the atom level. The thin dielectric material solves the problem of poor product reliability since the oxides used as the main additive and the main component can not be mixed uniformly in the existing dielectric material. The glass powder added into the formula can effectively lower the sintering temperature of the product and enhance the sintering compactness of the product. The introduced rare earth element can enhance the reduction resistance of the dielectric material.

The invention discloses a method for preparing a novel phosphate composite ceramic solidified body material, which comprises the following steps: mixing raw materials, pre-sintering to obtain a precursor, adding sintering aids to the precursor, mechanically activating, molding, and sintering to obtain A new type of phosphate composite ceramic solidified body material; wherein, the phosphorus source in the raw material is ammonium dihydrogen phosphate or phosphorus pentoxide; the raw material of A, B, Ln, An elements in the raw material is nitrate, metal alkoxide or oxide One; A is +1 or +2 valence element, B is +4 valence element, Ln is +3 or +4 valence lanthanide, An is +3 or +4 valence actinide. The NZP type ceramics and the monazite ceramics in the novel phosphate composite ceramic solidified body prepared by the invention are all solidified body materials with excellent chemical stability, so the phosphate composite ceramic solidified body has a large waste holding capacity and good stability.

The invention discloses an ultralow dielectric constant microwave dielectric ceramic material. The material is prepared by sintering, by mass, 93-95% of fused silica powder, 2-4% of nanometer silica powder, 0.5-2.5% of CaF2 and 0.5-2.5% of MnO2, and the principal phase of the ultralow dielectric constant microwave dielectric ceramic material is crystalline state SiO2. The invention further discloses a preparation method of the ultralow dielectric constant microwave dielectric ceramic material. The method comprises the steps that S1, CaF2 and MnO2 powder are ground and mixed; S2, the fused silica powder and the nanometer silica powder are mixed, the CaF2 and MnO2 mixed powder obtained in step 1 is added, and wet process ball milling is performed to obtain a mixture; S3, the mixture obtainedin step 2 is dried, granulation and pressing are performed to obtain a perform body, and the perform body is sintered to obtain the ceramic material. The ultralow dielectric constant microwave dielectric ceramic material is wide in raw material source, the preparation method is simple and convenient to implement, practical application and production are facilitated, the obtained ceramic materialis low in dielectric constant, the temperature coefficient of resonance frequency approaches to zero, and the ultralow dielectric constant microwave dielectric ceramic material can be widely applied to manufacturing microwave devices such as a microwave substrate and a missile radome.

The invention provides electrocondution slurry used for a chip component termination electrode. The electrocondution slurry comprise the following components in percentage by weight: 45-75% of silver powder, 2-10% of glass powder, 20-50% of organic carriers and 0-3% of inorganic additives. The chip component termination electrode manufactured by the electrocondution slurry can reduce thickness of a silver layer obviously, thus reducing manufacturing cost of a chip component obviously.

The invention discloses a powder metallurgy preparation method for a fine-grained diamond copper-based composite heat dissipation material, comprising the following steps: S1: weighing according to weight percentage: fine-grained diamond with a weight percentage of 4.2-11.6%, and a weight percentage of 1-11.6% 5% of water atomized superfine CuSn15 bronze powder, 0.1-0.5% by weight of composite nickel / copper-plated carbon fiber / silicon carbide whisker, and the balance of electrolytic copper powder. The present invention is a powder metallurgy production technology for preparing a composite heat dissipation substrate with thermal conductivity > 550W / mK by mixing fine-grained diamond and copper powder and then sintering twice. It has the characteristics of low cost, stable process and quantifiable production. , which can solve the engineering application difficulties that the existing technology is difficult to quantitatively produce heat dissipation substrates with a thickness of ≤2mm.

The invention discloses platinum-ceramic composite powder as well as a preparation method and an application thereof and belongs to the field of metal and ceramic powder composite. The platinum-ceramic composite powder is spherical powder, the particle size distribution is 0.2-1.2 mu m, the average particle size is 0.45 mu m, the specific surface area is 20-45 m<2> / g, the bulk density is 0.5-1.2 g / cm<3>, and the tap density is 0.8-1.8 g / cm<3>. The preparation method of the platinum-ceramic composite powder comprises steps as follows: sensitized and activated ceramic powder is mixed with a sodium chloroplatinate solution, reduction is performed with a chemical reduction method, and the platinum-ceramic composite powder is prepared. The platinum-ceramic composite powder can be used as platinum electrode paste, and the performance of a platinum electrode prepared by sintering the powder on the ceramic surface is remarkably improved. The preparation method of the platinum-ceramic composite powder is simple and easy to implement, and industrial production is facilitated.

The invention relates to the technical field of ceramic preparation, in particular to a preparation method of tooth-like special-shaped ceramics. Slurry is applicable to a photo-curing forming method to prepare tooth-like ceramic bodies by optimizing the composition and proportioning of the slurry, the forming efficiency is high, ceramic particles in the bodies can be also dispersed evenly, and the shape and size accuracy of the bodies is high; the bodies cannot deform and crack in the producing process by controlling process parameters in degreasing and sintering steps, the sintered compactness is higher, tooth-like ceramic products are more uniform in structure, higher in accuracy and better in surface smoothness, the thickness of the tooth-like ceramic products can be greater than 8 mm, and accordingly the reliability of the ceramic products is improved.

The invention provides a lithium-based microwave dielectric ceramic material. The raw materials include: main powder and auxiliary powder shown in formula (I); the auxiliary powder includes glass powder and 0.5-1.5 wt% of the main powder Accounting for 5-10wt% rutile TiO in the main powder 2 Micropowder; Li 2 (Zn (1‑x) Cu x )(Ti (1‑y) (Mg 1 / 3 Nb 2 / 3 ) y ) 3 o 8 , formula (I). The specific glass powder of the present invention reduces the sintering temperature of the system and introduces Mg 2+ , Nb 5+ replace Ti 4+ Improve frequency temperature coefficient, introduce TiO 2 Can increase Li 2 CO 3 ‑ZnO‑TiO 2 The sintering density of the system can be adjusted by τ f value. Cu 2+ Substitution and specific glass frits successfully make Li 2 CO 3 ‑ZnO‑TiO 2 The system is perfectly sintered at 850-890°C and has excellent dielectric properties, so that the material can be co-fired with Ag electrodes.

The present invention provides a zirconia-based ceramic back plate and its preparation method and application, by using zirconia, zirconium oxychloride and lanthanum hexaboride as initial raw materials, and then mixing, hydrolyzing, Dried and pretreated by ultra-high pressure cold isostatic pressing to obtain a green body, which has no organic volatilization, low porosity, and no density gradient. The green body is pre-sintered, sliced ​​and secondly sintered to obtain a zirconia ceramic back plate. After the green body is sintered, the zirconia ceramic back plate obtained after sintering has good sintering density, high strength, strong wear resistance and high toughness. , strength, hardness and excellent wear resistance and thermal stability.

The invention relates to a low-temperature sintering method of ultra-high-temperature ceramic, belonging to the technical field of preparation of compact ceramics. The ultra-high-temperature ceramic is a material capable of maintaining chemical stability in a high temperature environment (with a temperature higher than 2000 DEG C) and mainly contains certain high-melting-point transition metal compounds such as boride and carbide, and low-temperature sintering is carried out at 1650-1750 DEG C. The ultra-high-temperature ceramic prepared by virtue of the method is high in density.

The invention provides an aluminum-silicon alloy graphite composite heat-conducting material and its preparation and application. The aluminum-silicon alloy-graphite composite heat-conducting material is obtained by mixing aluminum-silicon alloy powder and graphite filler, and then subjecting the obtained mixture to It is prepared after hot pressing and sintering; in the said material, the graphite filler is uniformly dispersed in the aluminum-silicon alloy matrix. The material provided by the present invention has higher thermal conductivity, higher compactness, higher effective strength and lower coefficient of thermal expansion, and can be used to make high-power electronic devices to solve the problem of high-power electronic devices. heat conduction problem.