High-compactness boiling-resistant solar aluminum paste
A dense and boil-resistant technology, applied in conductive materials, electrical components, circuits, etc. dispersed in non-conductive inorganic materials, it can solve the problems of aluminum back field damage, shortened battery life, and no introduction. The effect of sintering compactness, improving uniformity and stability, and improving boiling resistance
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[0013] 1000 grams of high-density boiling-resistant solar aluminum paste consists of the following components by mass percentage:
[0014] 7-8 micron spherical aluminum powder: 75 grams;
[0015] 6-7 micron spherical aluminum powder: 150 grams;
[0016] 5-6 micron spherical aluminum powder: 375 grams;
[0017] 1-2 micron spherical aluminum powder: 150 grams;
[0018] Organic binder: 220 grams;
[0019] Glass powder: 20 grams;
[0020] Boron carbide powder: 10 grams.
[0021] Wherein, the above-mentioned organic binder contains 94.5% mixed solvent, 2% low-grade ethyl cellulose, 4% high-grade ethyl cellulose, and 0.5% hydrogenated castor oil.
[0022] The solar aluminum paste significantly improves the water boiling resistance of the aluminum back field.
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